Systems Engineering Co-op: Hardware, Embedded Software & RF

New Grad; City of Rochester (NY); On-site; USD 40,000 - 80,000; Part time

Job summary

CAA's Rochester team is hiring a Systems Engineering Co-Op/Intern in Rochester, NY for Spring or Summer 2027. The role focuses on hardware and software design to meet customer requirements, balancing size, weight, power, and packaging for field-ready solutions.

Projects cover electronic/mechanical design, embedded software, reverse engineering, protocol analysis, and RF communications. You will contribute to testing, documentation, and integration tasks within a multidisciplinary group.

Qualifications

• Pursuing a Bachelor’s degree in Systems Engineering, Electrical Engineering, Mechanical Engineering, Computer Engineering, or related field
• Must be legally authorized to work in the United States without sponsorship now or in the future
• Must be able to obtain and maintain applicable security clearance
• Experience working within a multidisciplinary engineering team
• Ability to learn how to use new software tools
• Experience in technical writing
• Experience installing software on Windows and Linux machines
• Experience with Microsoft Office including Word, Excel, Outlook, Visio

Responsibilities

• Develop test plans and procedures
• Conduct tests and document results
• Provide technical support for application notes
• Conduct vehicle site surveys and associated vehicle integration designs for Mastodon equipment
• Procure and validate 3rd party OEM products
• Develop and write software install procedures for laptops, including Mastodon and 3rd party software
• Create and update laptop clones
• Coordinate document reviews

Skills

Multidisciplinary teamwork

Technical writing

Software installation (Windows/Linux)

Microsoft Office (Word/Excel/Outlook/V

Education

Bachelor’s degree in Systems Engineering / Electrical/Mechanical/Computer Engineering

Tools

Windows

Linux

Job description

CAA's Rochester team is hiring a Systems Engineering Co-Op/Intern in Rochester, NY for Spring or Summer 2027. The role focuses on hardware and software design to meet customer requirements, balancing size, weight, power, and packaging for field-ready solutions.

Projects cover electronic/mechanical design, embedded software, reverse engineering, protocol analysis, and RF communications. You will contribute to testing, documentation, and integration tasks within a multidisciplinary group.