Staff R&D Product Engineer - Liquid Cooling & Cage Systems

TE Connectivity; United States; Presencial; USD 180 000 - 240 000; Tempo integral

Resumo da oferta

TE Connectivity is seeking a Staff R&D Product Engineer to lead development of next‑generation high‑speed interconnect and thermal management solutions for AI servers, networking equipment, and hyperscale data centers. You will drive from concept through production launch, translating customer requirements into innovative, manufacturable products.

You will collaborate with customers and global engineering teams to develop cage systems, liquid cooling, and HSIO solutions, guiding DFMEA, NPI and

Qualificações

• Bachelor's degree or higher in Mechanical Engineering or related field.
• 14+ years in product development involving high-speed interconnects or cooling solutions.
• Experience leading products from concept to manufacturing launch.
• Experience with customers and cross-functional teams.
• DFM/NPI/process validation and qualification experience.

Responsabilidades

• Lead design and development of high-speed interconnect cage systems and liquid cooling products from concept through production release.
• Translate customer, system, thermal, reliability and manufacturing requirements into robust architectures and designs.
• Develop products for AI servers, HPC and hyperscale data center applications.
• Create and optimize 3D designs, drawings, BOMs using CAD tools.
• Lead HSIO cage platforms including OSFP, OSFP‑XD, QSFP‑DD, QSFP112 and future generations.
• Design EMI shielding, latching, alignment, retention, and thermal attachment solutions.
• Develop liquid cooling solutions including cold plates, manifolds and fluid distribution.
• Perform mechanical design analysis including GD&T, tolerance stack‑up, and manufacturability.
• Collaborate with thermal simulation, quality, manufacturing, tooling and supplier engineering.
• Lead DFM, DFA, APQP, NPI and industrialization activities for scalable manufacturing.
• Drive product validation, qualification, reliability analysis, and root cause investigations.
• Develop and execute DVP&R plans and DFMEA reviews.

Conhecimentos

High-speed interconnect

Liquid cooling

3D CAD design

HSIO standards

DFMEA

DFM

NPI

GD&T

Reliability engineering

Customer-facing communication

Global collaboration

Formação académica

Bachelor's degree in Mechanical Engineering

Master's degree preferred

Ferramentas

Creo

SolidWorks

Descrição da oferta de emprego

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.

Job Overview

At TE Connectivity, we help build the technologies that keep the world connected. As a global leader in connectivity and sensor solutions, we partner with customers across industries to develop innovative products that power transportation, industrial, medical, energy, aerospace, and data infrastructure applications.

The Digital Data Networks department is seeking an experienced Staff R&D Product Engineer to lead the development of next‑generation high-speed interconnect and thermal management solutions for AI servers, networking equipment, and hyperscale data center applications. This role is responsible for driving product development from concept through production launch, transforming customer and system requirements into innovative, reliable, and manufacturable products. The engineer will work closely with customers, product management, manufacturing, thermal engineering, and cross‑functional teams to develop advanced cage systems, liquid cooling solutions, and high-performance connectivity products that support the rapidly growing AI infrastructure market.

Role And Responsibilities

• Lead the design and development of high-speed interconnect cage systems and liquid cooling products from concept through production release.
• Translate customer, system, thermal, reliability, and manufacturing requirements into robust product architectures and design solutions.
• Develop innovative products for AI servers, networking equipment, high-performance computing (HPC), and hyperscale data center applications.
• Create and optimize 3D designs, engineering drawings, specifications, and Bills of Materials (BOMs) using CAD tools.
• Lead the development of HSIO cage platforms including OSFP, OSFP‑XD, QSFP‑DD, QSFP112, and future‑generation interconnect solutions.
• Design and optimize EMI shielding structures, module latching mechanisms, alignment features, retention systems, and thermal attachment solutions.
• Develop liquid cooling solutions including cold plates, manifolds, fluid distribution systems, blind mate fluid connectors, and quick disconnect couplings.
• Perform mechanical design analysis including GD&T, tolerance stack‑up analysis, design optimization, and manufacturability assessments.
• Collaborate with thermal simulation, quality, manufacturing, tooling, supplier engineering, and product management teams throughout the product lifecycle.
• Lead DFM, DFA, APQP, NPI, and industrialization activities to ensure scalable and cost‑effective manufacturing solutions.
• Drive product validation, qualification testing, reliability analysis, and root cause investigations.
• Develop and execute DVP&R plans, DFMEA reviews, and product qualification strategies.
• Support customer design reviews and resolve technical issues related to mechanical, thermal, manufacturing, and reliability performance.
• Manage engineering changes, product improvements, and continuous improvement initiatives throughout the product lifecycle.
• Participate in LEANPD stage‑gate processes to ensure projects meet cost, quality, schedule, and performance objectives.
• Provide technical leadership across global engineering teams and serve as a key customer‑facing technical resource.

Education And Experience

• Bachelor's degree or higher in Mechanical Engineering, Thermal Engineering, Manufacturing Engineering, Electrical Engineering, Materials Engineering, or a related engineering discipline.
• Master's degree preferred.
• Minimum of 14 years of experience in product development involving high-speed interconnects, connector systems, cage products, thermal management, or liquid cooling solutions.
• Proven track record of leading products from concept development through qualification, manufacturing launch, and lifecycle management.
• Experience working directly with customers and cross‑functional global engineering teams.
• Background in Design for Manufacturing (DFM), New Product Introduction (NPI), process validation, and product qualification.
• Experience supporting customer‑facing engineering activities and complex technical problem‑solving.
• Experience with AI servers, data center infrastructure, networking equipment, or high-performance computing platforms preferred.

Required Skills

• Strong knowledge of mechanical product design and development, including:
  • Product architecture development
  • Tolerance analysis
  • GD&T
  • DFMEA
  • Product validation and qualification
  • Reliability engineering
• Proficiency with 3D CAD design tools such as Creo or SolidWorks.
• Strong understanding of mechanical design principles, engineering analysis, and statistical design methodologies.
• Experience designing and developing products using:
  • Metal stamping
  • Sheet metal fabrication
  • Machining
  • Welding
  • Brazing
  • Molding
  • Plating
  • Automated assembly
• Knowledge of HSIO technologies and industry standards including:
  • OSFP
  • OSFP‑XD
  • QSFP‑DD
  • QSFP112
• Knowledge of liquid cooling technologies including:
  • Cold plates
  • Direct‑to‑chip cooling
  • Manifolds
  • Fluid distribution systems
  • Quick Disconnect Couplings (QDC)
  • Rack‑level cooling solutions
• Experience developing and maintaining engineering documentation, specifications, and product requirements.
• Strong analytical, troubleshooting, and root cause investigation skills.
• Excellent written and verbal communication skills.
• Ability to collaborate effectively across global teams and multiple time zones.

Preferred Skills

• Experience supporting hyperscale data center, cloud computing, AI infrastructure, and networking applications.
• Knowledge of thermal management technologies, CFD analysis, and thermal‑fluid optimization techniques.
• Experience with quality and reliability methodologies including:
  • FMEA
  • Six Sigma
  • DOE
  • 8D Problem Solving
  • APQP
• Experience working with OCP systems, NVIDIA HGX/NVL platforms, and AI accelerator environments.
• Strong customer‑facing communication and presentation skills.
• Ability to communicate complex technical concepts to customers, leadership, and cross‑functional teams.
• Experience leading global engineering projects and influencing cross‑functional teams.
• Knowledge of intellectual property development, technical publications, and patent submissions.
• Proficiency with Microsoft Office applications including Word, Excel, PowerPoint, Outlook, and Teams.

Other Information

• Position supports a global customer base and requires collaboration across engineering, manufacturing, supplier, and customer teams worldwide.