PRINCIPAL R&D/PRODUCT DVL ENGINEER

Devconnectplatform; Northern (KY); À distance; USD 120 000 - 190 000; Plein temps

Résumé du poste

TE Connectivity is seeking a Principal R&D Product Development Engineer to drive design and qualification of high-speed, large-size sockets for DDN applications. You will work with PDE teams to translate VOC/PRD into detailed inputs, perform SI simulations with HFSS, and develop prototypes for qualification.

Responsibilities include leading cross-functional development, mentoring teams, and collaborating with customers to align solutions with performance targets, while supporting manufacturing

Qualifications

• Bachelor’s degree in Mechanical or Mechatronics Engineering; Master’s degree preferred.
• Minimum 5 years in mechanical design for high-speed interconnects with SI knowledge.
• Experience designing high-speed interconnects, servers, switches, or memory is a plus.

Responsabilités

• Lead end-to-end product development of high-speed, fine-pitch sockets—from concept to production release.
• Mentor engineering teams in mechanical design and SI methods.
• Collaborate with Sales, PMs, and customers to capture VOC and translate to specs.
• Provide technical support to manufacturing and QA for ramp-up and launches.

Connaissances

Mechanical design

Signal integrity

Creo/SolidWorks

Ansys HFSS

PCIE Gen6/7

Customer collaboration

DFMEA

Manufacturing support

Formation

Bachelor’s degree in Mechanical or Mechatronics Engineering

Master’s degree preferred

Outils

Creo

SolidWorks

Ansys HFSS

Keysight ADS

Description du poste

# PRINCIPAL R&D/PRODUCT DVL ENGINEERTE ConnectivitySalary not statedFull-timeremote· leadUSAListed via Jobicy · posted 6 Oct 2026. The application happens there, not on DevConnect.Apply on Jobicy## DescriptionAt TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job OverviewCOMPANYTE Connectivity plc (NYSE: TEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enables the distribution of power, signal, and data to advance next-generation transportation, energy networks, automated factories, data centers, medical technology, and more. With more than 85,000 employees, including 9,000 engineers, working alongside customers in approximately 130 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn, Facebook, WeChat and Instagram. BU / FUNCTION DESCRIPTION Key markets of Digital Data Networks are Artificial Intelligence (AI), Cloud, Enterprise/Telecommunications, Tier 3/Business Retail Equipment (BRE), and Internet of Things (IoT). In these markets, we are driving growth and innovation with an industry-leading product portfolio and global manufacturing capabilities.TE /448GB/shas specialized in socket products since 1970 and has developed a large size socket (>10K pin count), small pitch socket (<0.4mm pitch) for high-speed applications (224/448Gbps) ROLE OBJECTIVE As Principal R&D Product Development Engineer of the DDN socket team, you will focus on creating relationships with customer innovators and influencers, defining and driving technical activities, coordinating and facilitating technical engineering-related communications for internal/external customers, creating the product standard for a key technology, and contributing to the technical roadmap of the socket products.Job Requirements1. Concept Development & Design• Develop innovative design concepts and conduct feasibility studies to assess technical and commercial viability.• Collaborate with global Product Design Engineering (PDE) teams to accurately convert VOC and PRD into detailed design inputs for precise socket development.• Create simplified 3D models and perform signal integrity (SI) simulations using advanced tools such as Ansys HFSS to validate electrical signal performance.• Build and test prototype samples, execute design validation plans, and complete product qualification to finalize specifications.2. Strategic & Leadership Responsibilities• Lead end-to-end product development of high-speed, fine-pitch, large-size sockets—from market definition, concept creation to design, review, and production release.• Foster strong alignment between business and customer engineering teams to deepen market understanding and drive customer-centric innovation.• Responsible for mentoring and training engineering teams in advanced mechanical design principles and signal integrity simulation methodologies, including hands-on guidance in using industry-standard tools such as Creo and Ansys HFSS, to ensure design robustness, performance optimization, and alignment with high-speed interconnect requirements. 3. Customer & Market Engagement• Collaborate closely with customers and internal stakeholders (Sales, System Architects, FAEs, and PMs) to capture clear Voice of Customer (VOC) and translate it into conceptual designs and preliminary product specifications.• Engage in early-stage pathfinding with customers to co-develop cutting-edge interconnect solutions that meet future technological needs.• Prepare and present engineering evaluations and proposals to customers, aligning solutions with application requirements and performance targets 4. Manufacturing Support & Quality Assurance• Provide technical support to manufacturing and quality teams to ensure efficient ramp-up, process optimization, and safe product launches.• Support cross-functional teams—including customers, Sales, PMs, and manufacturing sites—through DFMEA, testing, troubleshooting, and engineering analysis.What your background should look like• Bachelor’s degree in Mechanical or Mechatronics Engineering; Master’s degree preferred. • Minimum of 5 years of work experience in mechanical design for high-speed interconnect products, with high-speed signal integrity knowledge preferred. • Direct customer design and support experience, including the ability to work with Field Application Engineers to troubleshoot customer problems and improve existing designs. • Design experience with high-speed servers, switches, and memory is a plus. • Understanding semiconductor IC packaging and fundamental test/burn-in methodology. • Expert-level knowledge of interconnect design or experience with high-speed connectors with PCIE Gen 6/7 compliance. • High level of competency in mechanical design tools such as Creo/SolidWorks. • Good level of competency in signal integrity analysis tools (Ansys HFSS, Keysight ADS). • Strong analytical capabilities to interpret simulation and lab data, identify issues, and provide solutions. • Six Sigma methodologies or other strong data analytics background is a plus. • Excellent verbal and written communication skills. • Ability to work in a global environment, fluent in English (verbal/written), and able to collaborate across geographies. • Highly motivated, quick learner, and able to work independently.CompetenciesSET : Strategy, Execution, Talent (for managers)