Staff PCB Designer

ttmtech

Village of Farmingdale (NY)

Vor Ort

USD 110.000 - 170.000

Vollzeit

Vor 5 Tagen
Sei unter den ersten Bewerbenden

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Zusammenfassung

TTM Technologies, Inc. in the United States is seeking a PCB Staff Design Engineer to design moderate to complex PCB layouts in Digital, Analog, Power and RF interconnect domains.

You will use Siemens Xpedition, PADs and Cadence Allegro to conceptualize and detail board layouts, aligning with IPC and manufacturing requirements. The role emphasizes high-speed design constraints, RF routing, impedance control, and collaboration with E/M/NPI teams to deliver manufacturable designs and

Qualifikationen

  • Minimum 10 years hands-on experience with Siemens PADs/Xpedition and Cadence Allegro/OrCAD.
  • Background in physical design and electrical drafting for PCBs.
  • Experience with IPC standards and manufacturing documentation.

Aufgaben

  • Design PCB layouts meeting detailed design requirements and constraints.
  • Create fabrication and assembly drawings and BOMs.
  • Maintain libraries and output files for manufacturing and assembly.
  • Ensure EMI/EMC considerations and high-speed design practices.

Kenntnisse

High-Speed PCB Design
RF PCB Routing
PCB Layout
Signal Integrity

Ausbildung

Associate in Electrical Design/Drafting
BS in Electronic Technology

Tools

Siemens PADs
Xpedition
Cadence Allegro/OrCAD
AutoCAD 2023

Jobbeschreibung

About TTM

TTM Technologies, Inc. - Publicly Traded US Company, NASDAQ (TTMI) - Top-5 Global Printed Circuit Board Manufacturer

Additional information can be found at www.ttm.com

Position Summary

TTM is an advanced-technology leader in highly sophisticated surveillance, communications, analysis and integration solutions. Our systems are deployed across a wide range of land, sea and air applications, providing our aerospace, defense and commercial customers with a distinct tactical advantage.

In this role, the PCB Staff Design Engineer will design moderate to complex printed circuit board (PCB) layouts in the domain of Digital, Analog, Power & RF interconnect applications. This includes responsibility for circuit board layout conceptualization, (CAD application by means of Siemens Xpedition, PAD's or Cadence Allegro tool sets), detail design activities and value-engineering in support of internal TTM programs.

Areas of emphasis/focus include physical design (CAD implementation)/documentation utilizing best practice of electrical IPC standards/methodologies with experienced approach to manufacturing and sustaining maintenance of legacy design projects. Complementary support provided by a combination of TTM Management, Field Application Engineering, Electrical/Mechanical Engineering and NPI Manufacturing teams.

Must have a background that would permit the U.S. Department of Defense to issue a Secret clearance when necessary for work on a project that requires such a clearance

Duties and Responsibilities
Design Engineering Physical Design
  • PCB concept sketches for assistance in design layout estimating
  • PCB design suggestions/trade-offs regarding initial engineering inputs
  • Support changes to existing schematic diagrams using

TTM suite of tools: OrCAD and/or DxDesigner

Place and route components ensuring that all electrical and physical specifications meet the detailed design requirements for each PCB design. Utilization of Siemens Xpedition/PAD's and/or Cadence Allegro required

Leadership
  • Provide layout feedback to design engineers as needed to ensure functionality and manufacturability of PCB designs
  • Create fabrication and assembly drawings (AutoCAD 2023), parts list & incorporate changes to existing design documentation. Create and maintain component libraries
  • Generate all output files (ODB++, Bill of Materials & PCB/CCA documentation) required for the manufacture of the board and assembly
  • Maintain change (PCN) responsibilities on re-design and documentation updates
  • Industry and TTM-specific electrical standards and methodologies- Product safety and EMI consideration during eCAD layout (UL, CSA, NEBS, Etc.)
  • Standardization of electrical components and eCAD libraries utilizing IPC or vendor specific standards
  • Exceedingly experienced with High-Speed PCB Design Constraints: Differential Pairs, Routing Topologies, Controlled Impedance, Length-matched Traces and Delay Tuning
  • Demonstrated experience with RF PCB routing complexities. Implement layout rules for RF transmission lines (Micro-strip & Coplanar Waveguide), signal line isolation practices, via fencing & unique RF routing structures
  • Audio (Analog & Digital separation) PCB best practice layout guidelines highly recommended
  • Direct design experience related to multi-layer CCA and Flex PCB technologies
  • Current knowledge of μ-via/HDI layout methodologies and best practices
  • Understanding of stack-up materials/construction along with impedance modeling requirements
Education and Experience

Education: Minimum Associates in Electrical Design/Drafting or BS in Electronic Technology. Related eCAD training certification/career experience will be considered in lieu of a degreed program with 10 year experience.

Experience: Minimum of 10 years' experience with primary hands‑on demonstrated proficiency of Siemens PAD's (VX2.8 or later), Siemen's Xpedition (VX2.14 or later) and/or Cadence Allegro/OrCAD (17.4 or later) product experience is required. Comprehensive understanding of electrical and mechanical engineering design practices related to printed circuit board electrical drafting and fabrication drawing creation experience is essentia

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