Staff Equipment Development Engineer, Advanced Packaging

Micron Technology, Inc.

Boise (ID)

On-site

USD 130,000 - 180,000

Full time

6 days ago
Be an early applicant
Application generator

Turn this role into an interview — a resume and cover letter built around what this employer wants.

Get past ATS filters

Benefits offered by this job

Medical Plan
Dental Plan
Paid time off
Retirement benefits

Job summary

Micron Technology, Inc. in Boise, Idaho is seeking a Staff Equipment Development Engineer for the Advanced Technology Packaging Development (APTD) team.

You will develop and optimize next-generation wafer and die equipment, driving from conception to implementation in manufacturing with a focus on FAOK hardware and cost reduction. The role involves root cause analysis, DOE/SPC, data-driven problem solving, and collaboration with process development, manufacturing, and vendors.

Qualifications

  • Master’s Degree or equivalent experience in related technical fields.
  • 2+ years of semiconductor process or equipment engineering experience.
  • Fundamental understanding of post probe and assembly process and equipment interactions.
  • 2+ years of DOE, SPC, Defect analysis and data analysis experience.
  • Ability to resolve sophisticated issues through root cause or model-based solving.
  • Hands on experience with wafer/assembly tools and overlay systems.
  • Ability to use/apply AI tools to streamline work processes and quality.
  • Willingness to travel domestically or internationally for transfers.

Responsibilities

  • Develop strategies to improve equipment maturity for FOAK hardware.
  • Develop hardware roadmaps for 5+ years in post probe wafer/die processing.
  • Develop wafer/assembly equipment to meet device requirements.
  • Optimize equipment to reduce cost and improve capability.
  • Collaborate with process development to create new solutions.
  • Perform root cause and failure analysis to drive projects with OEMs.
  • Conduct research to advance next-generation equipment products.
  • Support equipment transfer to production facilities; travel may be required.

Skills

DOE techniques
Statistical Process Control
Defect analysis
Data analysis
AI tools
Wafer/assembly tools
Root cause analysis
Problem solving

Education

Master’s degree or equivalent in Engineering/Materials
PhD preferred in Mechanical/Chemical/Electrical Eng

Tools

Overlay systems
Wafer/probe/assembly tooling

Job description

Our vision is to transform how the world uses information to enrich life for all.Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.Department Intro:The Technology Development (TD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and AI-enabled technologies that enable the creation of next-generation semiconductor products. By collaborating closely with our global R&D and manufacturing teams, we ensure the efficient transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. Join us to be part of a dynamic and forward-thinking team that is molding the future of technology!Position Overview:As a Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will develop and optimize next-generation, first-of-a-kind (FAOK) wafer and die equipment. You will take ideas from conception through development to implementation in APTD and manufacturing facilities. Responsibilities include identifying, diagnosing, and resolving equipment-related problems using failure analysis, FMEA, 8D, or FDC/Data Science methodology. You will also coordinate and carry out equipment evaluation/optimization, lead improvement and cost reduction activities, and interact with process development, manufacturing, and equipment vendors to ensure robust processes. You will become a domain expert, crafting technology roadmaps and influencing Micron’s leadership in semiconductor manufacturing.Responsibilities:Develop strategies and implement to improve Equipment maturity for (FOAK) hardware.Develop hardware roadmaps for 5+ years in the area of post probe wafer and die processing. Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron’s products.Optimizing equipment to reduce cost, increase availability, and improve hardware and process capability.Collaborating with process development teams to develop innovative new solutions.Conducting root cause and failure mode analysis to understand the limitations of current hardware and drive APTD development projects with OEMs vendors for solutions.Performing fundamental research to drive innovative solutions for next-generation equipment products.Support equipment transfer to production facilities (some domestic or international travel may be required).Minimum Qualifications:Master’s Degree or equivalent experience in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields2+ years of semiconductor process or equipment engineering experienceFundamental understanding of post probe and assembly process and equipment interactions.Understanding of related inline/electrical/probe failure.2+ years of experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysisAbility to resolve sophisticated issues through root-cause or model-based problem solving and a focus on meeting commitmentsHands on experience with wafer / assembly tools and overlay systemsAbility to use and apply AI tools to streamline work processes, accelerate productivity, and drive enhanced quality and creativity.Preferred Qualifications:Ph. D. in Mechanical Engineering, Chemical Engineering, Electrical Engineering, or a related technical field, or equivalent experienceKnowledge of robotics, machine logic language, or new hardware design is desirable.Wafer or die bonding, plating, warpage control and packaging field experience preferable.As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.To learn about your right to work click here.To learn more about Micron, please visit micron.com/careersFor US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Staff Equipment Development Engineer - Advanced Packaging
Staff Equipment Development Engineer - Advanced Packaging

Micron Technology, Inc. • Boise (ID)

On-site
USD 120,000 - 180,000
Staff Process Engineer, Advanced Packaging CMP
Staff Process Engineer, Advanced Packaging CMP

Micron Technology, Inc. • Boise (ID)

On-site
USD 110,000 - 170,000
Equipment Engineer
Equipment Engineer

Micron Technology, Inc. • Boise (ID)

On-site
USD 85,000 - 110,000
Fab Process Technician
Fab Process Technician

Micron Technology, Inc. • Manassas (VA)

On-site
USD 60,000 - 90,000
MTS Wet Process Engineer, Advanced Packaging Boise, Idaho, United States of America
MTS Wet Process Engineer, Advanced Packaging Boise, Idaho, United States of America

Micron Technology, Inc • Boise (ID)

On-site
USD 100,000 - 130,000
Medical, dental and vision plans
Paid family leave
Robust paid time-off program
Process Technician, Advanced Packaging Boise, Idaho, United States of America
Process Technician, Advanced Packaging Boise, Idaho, United States of America

Micron Memory Malaysia Sdn Bhd • Boise (ID)

On-site
USD 55,000 - 75,000
Fab Support Equipment Maintenance Technician
Fab Support Equipment Maintenance Technician

Micron Technology, Inc. • Manassas (VA)

On-site
USD 60,000 - 95,000
Medical, dental, and vision plans
Paid time off
Paid holidays
+1
Process Technician, Advanced Packaging Boise, Idaho, United States of America
Process Technician, Advanced Packaging Boise, Idaho, United States of America

Micron Technology, Inc • Boise (ID)

On-site
USD 40,000 - 60,000
Medical, dental, and vision plans
Paid time-off programs
Paid family leave
Sr RDA Engineer, Advanced Packaging Boise, Idaho, United States of America Posted a day ago
Sr RDA Engineer, Advanced Packaging Boise, Idaho, United States of America Posted a day ago

Micron Memory Malaysia Sdn Bhd • Boise (ID)

On-site
USD 110,000 - 160,000
Medical, dental, vision plans
Paid time off
401(k) with company match
DMTS Process Development Engineer, Advanced Packaging
DMTS Process Development Engineer, Advanced Packaging

1000 Micron Technology, Inc. • Boise (ID)

On-site
USD 180,000 - 240,000
Medical, dental and vision plans
Paid time‑off
Paid holidays