Staff Engineer - Dry Etch DRAM

Massachusetts Health & Hospital Association; Boise (ID); On-site; USD 110,000 - 150,000; Full time

Job summary

DRAM Dry Etch Engineer in a research and development setting leads the development and optimization of plasma etch processes for next-generation memory devices in Boise, Idaho. You will work with process and integration teams to tackle device challenges and improve yield and stability.

Responsibilities include refining dry etch methods, analyzing data to enhance process capability, and supporting transfer and project execution in production environments.

Qualifications

• MS/PhD with 3–5 years or BS with 5–10 years semiconductor experience.
• Dry etch process development; knowledge of plasma physics and reactor fundamentals.
• Proficiency with statistical methods, SPC, and data-driven problem solving.

Responsibilities

• Develop and refine dry etch processes to meet structural and electrical specifications.
• Collaborate with process and integration teams to resolve complex device challenges.
• Perform root cause analysis to improve yield, defects, and process stability.
• Analyze data to enhance process capability and manufacturing readiness.
• Support process transfer, project execution, and problem resolution in production.

Skills

Statistical methods

Data-driven problem solving

SPC

Project coordination

Education

MS/PhD in semiconductor

BS in related field

Tools

ICP dry etch

CCP dry etch

Plasma reactors

Job description

Role: As a DRAM Dry Etch Engineer, you will develop and optimize plasma etch processes for next-generation memory devices in a research and development setting.

Responsibilities

• Develop and refine dry etch processes to meet structural and electrical specifications


• Collaborate with process and integration teams to resolve complex device challenges


• Perform root cause analysis to improve yield, defects, and process stability


• Analyze data to enhance process capability and manufacturing readiness


• Support process transfer, project execution, and problem resolution in production

Qualifications

• MS/PhD with 3-5 years or BS with 5-10 years of semiconductor experience


• Experience in dry etch process development; knowledge of plasma physics and reactor fundamentals


• Proficiency with statistical methods, SPC, and data-driven problem solving


• Ability to manage multiple projects and work effectively across teams

Preferred Skills

• Experience with DRAM processes or module ownership


• Hands-on experience with ICP and CCP dry etch systems


• Knowledge of plasma processes, surface interactions, and defect analysis methodologies


• Experience leveraging AI for process optimization