Sr. Process Engineer (Starlink)

United States Digital Space LLC; Bastrop (TX); On-site; USD 120,000 - 180,000; Full time

Job summary

United States Digital Space LLC is seeking a Sr. Process Engineer to own the day-to-day operation, uptime, and optimization of packaging and assembly tools on the production floor.

You will design processes from lab benches through production ramps and collaborate with engineering teams to stabilize flow and improve yields. The role requires 5+ years in semiconductor packaging or related fields, strong troubleshooting, and experience with flip-chip bonding, wafer processing, plasma cleaning, and

Qualifications

• BS or MS in an engineering discipline.
• 5+ years in semiconductor packaging, assembly, process engineering or advanced manufacturing.
• Experience qualifying or operating production equipment in a high-volume production environment.
• Knowledge of sub-µm die-bonding, wafer prep, and materials used in advanced packaging.
• Familiarity with statistical process control and root cause analysis methods.
• 2+ years of experience in process development or yield improvement for optical, photonic, or microelectronic devices.
• Strong troubleshooting skills with high-uptime operation of precision manufacturing tools.
• Familiarity with flip-chip bonding, wafer processing, plasma cleaning, and wire bonding.

Responsibilities

• Own day-to-day operation and uptime of production tools (flip-chip bonders, plasma cleaners, de-flux tools, automated handlers, dispense tools, wire bonders).
• Design production processes from lab bench to production ramp.
• Monitor and control key process parameters for repeatability and calibration.
• Troubleshoot tool and process issues in real-time to minimize downtime.
• Collaborate with engineering teams to improve process flows for die attach, bonding, cleaning, and packaging.
• Analyze production data and yield trends to identify optimization opportunities and defect reduction.
• Push process yields above 99.9% and thermal-cycle reliability beyond 1000 cycles.
• Support factory scaling by qualifying new tools and recipes to enhance throughput and yield.

Skills

Semiconductor packaging

Process engineering

SPC

Root cause analysis

Production tooling operation

Data analysis

Education

BS or MS in an engineering discipline

Tools

flip-chip bonder

plasma cleaner

de-flux tools

automated handlers

dispense tools

wire bonder

Job description

the company was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today the company is actively developing the technologies to make this possible, with the ultimate goal ofenabling human life on Mars.

SR. PROCESS ENGINEER (STARLINK)

Keeping our production tools running and our processes stable is what turns engineering designs into product at volume. We are seeking a Sr. Process Engineer to own the day-to-day operation, uptime, and optimization of the packaging and assembly tools on our production floor.

RESPONSIBILITIES

• Own day-to-day operation and uptime of production tools including flip-chip bonders, plasma cleaners, de-flux tools, automated handlers, dispense tools, and wire bonders

• Design production processes from the lab bench through proof of concept and production ramp

• Monitor and control key process parameters, ensuring repeatability, equipment calibration, and adherence to manufacturing specs

• Troubleshoot tool and process issues in real-time, minimizing downtime, and driving fast root-cause resolution

• Collaborate with engineering teams to stabilize and improve process flows for die attach, bonding, cleaning, and packaging

• Analyze production data and yield trends, identifying opportunities for process optimization and defect reduction

• Push process yields above 99.9% and thermal-cycle reliability beyond 1000 cycles

• Support factory scaling efforts, qualifying new tools and recipes that enhance unit throughput and yield

QUALIFICATIONS

• BS or MS in an engineering discipline

• 5+ experience in semiconductor packaging, assembly, process engineering or advanced manufacturing

PREFERRED EXPERIENCE

• Direct experience qualifying or operating production equipment in a high-volume production environment

• Knowledge of sub-µm die-bonding, wafer prep, and materials used in advanced packaging

• Familiarity with statistical process control and root cause analysis methods

• 2+ years of experience in process development or yield improvement for optical, photonic, or microelectronic devices

• Strong troubleshooting skills with experience maintaining high-uptime operation of precision manufacturing tools

• Familiarity with equipment and processes such as flip-chip bonding, wafer processing, plasma cleaning, and wire bonding

• Ability to interpret process documentation, equipment specifications, and production data to drive consistent output

ADDITIONAL REQUIREMENTS

• Comfortable working in a cleanroom or controlled manufacturing environment with cross-functional engineering teams

• Willingness to work extended hours and weekends as needed

ITAR REQUIREMENTS:

• To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.

the company is an Equal Opportunity Employer; employment with the company is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.

Applicants wishing to view a copy of the company’s Affi­? or applicants requiring reasonable accommodation to the application/interview process should reach out [e-mail]*.*