Silicon Packaging Technician, Silicon Assembly (Starlink)

United States Digital Space LLC; Bastrop (TX); On-site; USD 55,000 - 85,000; Full time

Job summary

The company is seeking a Silicon Packaging Technician, Silicon Assembly to join Starlink efforts. You will work with IC packaging engineers, test engineers, equipment manufacturers and leadership in a fast-paced environment.

Responsibilities include operating deposition and photolithography tools, monitoring process performance with metrology equipment, and performing wafer dicing, plasma etching, and die attach with micron-level accuracy.

Qualifications

• Bachelor's degree in materials science, electrical engineering, or related field is preferred.
• 6+ years of practical experience in high volume semiconductor manufacturing operations.
• Experience with photolithography, plating, and wafer handling in cleanroom environments.

Responsibilities

• Operate and maintain deposition systems, including PVD for thin films and related equipment.
• Operate photolithography tools to apply resist, align, expose, and develop with precision.
• Monitor process performance using in-situ sensors and metrology tools for film uniformity.
• Operate dicing saws, laser dicers, and plasma etching for singulation on wafers.

Skills

Photolithography

Electrochemical plating

Die attach

Wafer dicing

Plasma etching

RIE

Thin films deposition

Data analysis

Cleanroom protocols

ESD guidelines

Education

Bachelor's degree in materials science

Tools

XRF

3D profilometer

Confocal SAM

Stereoscope

Optical tensiometer

Job description

the company was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today the company is actively developing the technologies to make this possible, with the ultimate goal ofenabling human life on Mars.

SILICON PACKAGING TECHNICIAN, SILICON ASSEMBLY (STARLINK)

One of the most ambitious missions that the company has undertaken to date, the Starlink satellite constellation, is our solution to providing reliable internet to the entire world. In true the company fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing. You will work closely with IC packaging engineers, test engineers, equipment manufacturers and leadership.

The success of Starlink depends on the quality, reliability, cost, manufacturability, throughput, and security of the products that you deliver. If you seek a fast-paced, dynamic environment; if you thrive on solving difficult problems where resolutions have high impact; and if you love the challenge of building something from scratch, then this role will be an ideal next career step.

RESPONSIBILITIES:

• Operate and maintain deposition systems, including physical vapor deposition (PVD) to deposit precise thin films of metals & dielectrics as well as stripping and etching equipment

• Operate photolithography tools, such as photoresist coaters, aligners, steppers, scanners, and developers, to apply uniform resist layers, align products, expose patterns, and develop images with precision accuracy

• Monitor process performance using in-situ sensors and metrology equipment like 3D profilometers, ellipsometers, reflectometers, and X-ray fluorescence (XRF) to ensure film uniformity, step coverage, and contamination control

• Operate dicing saws, laser dicers, and plasma etching tools to perform mechanical, laser, or plasma-based singulation on wafers and large-format panels, following & monitoring recipes

• Load and unload materials into molding systems, following recipes to achieve target mold fill, void minimization, and flash control during production runs

• Operate die attach equipment, including epoxy dispensers, pick-and-place bonders, and reflow stations, to place and secure dies with micron-level accuracy and controlled bond line thickness

• Operate electrochemical plating tools, including copper electroplaters and seed layer systems, and stripping/etch equipment to process products according to recipes for uniform deposition and precise material removal rates.

• Comply with cleanroom gowning protocols (ISO), Chemical Safety Standards, & Strict Electrostatic Discharge (ESD) guidelines

BASIC QUALIFICATIONS:

• High school diploma or equivalency certificate

• 3+ years of professional experience in a hands‑on manufacturing environment; OR associate's degree in an engineering, math or science discipline

PREFERRED SKILLS AND EXPERIENCE:

• Bachelor's degree in materials science, electrical engineering, or a related field

• 6+ years of practical experience in high volume semiconductor manufacturing operations

• Proficiency and experience in photolithography (e.g. align, bake, coat, expose, develop), electrochemical plating, die Attach, thermal compression bonding, compression molding/overmold, wafer dicing, scribe & break, stripping/etching, plasma, reactive ion etching (RIE), thin films deposition (CVD/PVD/ALD), dry film lamination & imaging

• Proficiency in data analysis and process control software for statistical process control (SPC)

• Physical stamina to manage equipment in a cleanroom suit and handle sensitive substrates

• Experience with metrology tools such as confocal scanning acoustic microscopy(C‑SAM), 3D profilometers, stereoscopes, optical tensiometers (goniometer), X‑Ray fluorescence (XRF)

• Excellent manual dexterity with the ability to work with both hands under a microscope

ADDITIONAL REQUIREMENTS:

• Must be able to work all shifts & be willing to work overtime and/or weekends as needed

• Must be able to dawn & wear (at all times) cleanroom attire (e.g. bouffant caps, gowns, masks, nitrile gloves, ESD footwear, bunny suits, hoods) for full shifts

• Standing for long periods, bending, grasping, sitting, pulling, pushing, stooping & stretching

• Must be able to lift up to 35lbs. unassisted

ITAR REQUIREMENTS:

• To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.

the company is an Equal Opportunity Employer; employment with the company is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.

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