Sr Principal Semiconductor Equipment Engineer

0090 CORP-Corporate Office

United States

On-site

USD 122,800 - 184,200

Full time

14 days+
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Benefits offered by this job

Health Plan
Savings Plan
Paid Time Off
Education Assistance
Training & Development
9/8 Work Schedule
Life & Disability Insurance
Paid Holidays

Job summary

Northrop Grumman Mission Systems in Apopka, Florida, seeks a Sr. Principal Semiconductor Equipment Engineer to lead projects on equipment layout, cleanroom construction, and installation of semiconductor equipment.

The role emphasizes cross‑functional leadership, preventive maintenance, and continuous improvement across fab facilities, with 10% travel and eligibility for a Secret clearance. The ideal candidate has 8+ years in semiconductor fabrication or construction and a related STEM degree.

Qualifications

  • Bachelor’s degree in a related STEM field with a minimum of 8 years of relevant work experience, or a master’s degree with 6 or more years of experience.
  • Minimum 6 years of experience working with semiconductor fabrication equipment or the construction industry.
  • Experience with semiconductor wafer fabrication facilities and operating equipment.
  • Experience with fab facility equipment installation and maintenance.
  • Experience with Computerized Maintenance Management System (CMMS).
  • US Citizenship required; ability to obtain and maintain a Secret clearance.

Responsibilities

  • Lead and manage engineering projects such as equipment layout, cleanroom construction, and installation of semiconductor equipment.
  • Handle daily to yearly equipment maintenance, including preventive maintenance operations, chemical management, and vendor service contracts.
  • Develop and apply continuous improvement programs across all facilities and factory layout for foundry equipment.
  • Manage project schedules, budgets, risk, and stakeholder alignment including contractors and subcontractors.
  • May run a group or groups of tools, day‑to‑day maintenance, and maintenance operations.

Skills

Leadership
Cross-functional collaboration
Communication
Flexibility
On‑call readiness

Education

Bachelor’s degree in a related STEM field
Master’s degree in a related STEM field

Tools

AutoCAD
CMMS

Job description

Job Overview

Northrop Grumman Mission Systems is a trusted provider of mission-enabling solutions for global security. We are looking for a Sr. Principal Semiconductor Equipment Engineer to join our Advanced Packaging Technology Fab in Apopka, Florida. The role involves leading projects related to equipment layout, cleanroom construction and installation, and maintenance of semiconductor equipment.

Relocation Assistance: None

Clearance Required: Secret (must obtain and maintain)

Travel: 10% of the time; minimal travel, one to three short trips per year.

Responsibilities
  • Lead and manage engineering projects such as equipment layout, cleanroom construction, and installation of semiconductor equipment.
  • Handle daily to yearly equipment maintenance, including preventative maintenance operations, chemical management, and vendor service contracts.
  • Develop and apply continuous improvement programs across all facilities and factory layout for foundry equipment.
  • Manage project schedules, budgets, risk, and stakeholder alignment including contractors and subcontractors.
  • May run a group or groups of tools, day‑to‑day maintenance, and maintenance operations.
Ideal Candidate
  • Demonstrated ability to work with cross‑organizational teams (engineering, line maintenance, building maintenance).
  • Strong leadership and communication skills.
  • Flexibility to work second shift as needed and be on call.
Basic Qualifications
  • Bachelor’s degree in a related STEM field with a minimum of 8 years of relevant work experience, or a master’s degree with 6 or more years of experience.
  • Minimum 6 years of experience working with semiconductor fabrication equipment or the construction industry.
  • Experience with semiconductor wafer fabrication facilities and operating equipment.
  • Experience with fab facility equipment installation and maintenance.
  • Experience with Computerized Maintenance Management System.
  • US Citizenship required; ability to obtain and maintain a Secret clearance.
Preferred Qualifications
  • Experience with semiconductor equipment, clean‑room design and construction.
  • Experience with Architecture and Engineering (“A&E”) drawing sets and AutoCAD design.
  • Experience managing strategic projects from inception through completion, including financial, risk and schedule management.
  • Experience in low volume/high product mix environments.
  • Experience interfacing with vendors for equipment repairs, service contracts and purchase.
  • Active Secret clearance.
Benefits
  • Health Plan
  • Savings Plan
  • Paid Time Off
  • Education Assistance
  • Training and Development
  • 9/8 Work Schedule (where available)
  • Additional benefits including life and disability insurance, paid holidays, and more.
Salary Range

$122,800.00 – $184,200.00 (depending on scope, responsibilities, experience and market conditions). Overtime, shift differential, and discretionary bonuses may apply.

EEO Statement

Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit https://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.

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