Sr. Principal Package Engineer

Marvell Semiconductor, Inc.; California, Santa Clara (MO, CA); On-site; USD 153,000 - 230,000; Full time

Job summary

Join a dynamic package engineering team at an innovative semiconductor company, where you will lead the development of cutting-edge semiconductor packages from concept to mass production. This role offers the chance to shape the future of the semiconductor industry by managing new product introductions and collaborating with cross-functional teams. You'll be at the forefront of technology, tackling complex challenges and mentoring junior engineers while contributing to a roadmap that drives major semiconductor projects. This is an exciting opportunity to thrive in a fast-paced environment that values purpose-driven innovation.

Benefits

Flexible time off

401k

Year-end shutdown

Floating holidays

Paid time off to volunteer

Qualifications

• 10-15 years of semiconductor package development experience.
• Extensive experience in flip-chip package development and substrate review.
• Experience with large body FCBGA package development.

Responsibilities

• Manage package development of NPIs and achieve milestones.
• Define optimal package solutions collaborating with cross-functional teams.
• Resolve package-related quality issues with Quality Engineering.

Skills

Effective communication skills

Program management

OSAT management

Problem-solving skills

People management

Leadership

Education

Bachelor of Science in Mechanical Engineering

Master of Science in Mechanical Engineering

PhD in Mechanical Engineering

Tools

Cadence APD

AutoCAD

Job description

About Marvell

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

Join our dynamic package engineering team and be at the forefront of semiconductor innovation! This role focuses on developing cutting-edge semiconductor packages from concept to mass production. Our team plays a crucial role in New Product Introduction (NPI), transforming innovative ideas into final designs for engineering samples and production ramp-up. Experience the thrill of working on groundbreaking projects and pioneering technologies that shape the future of the semiconductor industry.

What You Can Expect

1. Manage package development of NPIs. Achieve milestones.
2. Define optimal package solutions based on end product/client requirements, collaborating with cross-functional teams.
3. Manage OSAT and substrate suppliers on risk assessments, design reviews, and package characterization, package qualification and product ramp-up.
4. Perform package design reviews and provide technical guidance.
5. Resolve package-related quality/reliability issues with Quality Engineering and suppliers.
6. Contribute to the package technology roadmap and support new package development.
7. Set packaging technical direction and drive solutions for major semiconductor projects.
8. Provide inputs to design guidelines and ensure their implementation.
9. Conduct package cost analysis with procurement and suppliers.
10. Manage and mentor junior engineers.

What We're Looking For

• Education & Experience:
• Bachelor of Science (BS) or Master of Science (MS) degree in Mechanical Engineering or related fields with 10-15 years of semiconductor package development experience.
• PhD in Mechanical Engineering or related fields with 7-10 years of experience.

• Technical Expertise:
• Extensive experience in flip-chip package development and substrate review.
• Experienced with large body (>60mm) FCBGA package development. Large body 2.5D package development is preferred.
• Great problem-solving skills.
• Basic skills in Cadence APD and AutoCAD.
• Broad industry knowledge, including semiconductor technologies, assembly processes, yield management, substrate materials and processes, SMT processes, packaging materials, reliability standards, and failure analysis techniques.
• Knowledgeable in 3D, wafer-level packaging, automotive IC packaging, and AEC Q100.

• Skills:
• Effective communication skills for collaboration with internal teams, suppliers, and clients.
• Excellent program management and OSAT management experience.
• People management experience, with potential for future management roles.
• Ability to learn quickly, work independently, provide leadership, and solve complex problems.

Expected Base Pay Range (USD)

153,530 - 230,000 USD per annum

The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location, and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefits

At Marvell, we offer a total compensation package including base salary, bonus, and equity. Health and financial wellbeing are part of the package, including flexible time off, 401k, year-end shutdown, floating holidays, and paid time off to volunteer. For questions about our benefits, ask your recruiter during the interview process.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability, or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at [e-mail].