Sr BEOL Engineer - DRAM Process Integration

1000 Micron Technology, Inc.

Boise (ID)

On-site

USD 80,000 - 100,000

Full time

14 days+

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Benefits offered by this job

Medical, dental and vision plans
Paid family leave
Robust paid time off program

Job summary

1000 Micron Technology, Inc. in Boise, Idaho, is looking for a motivated Process Integration Engineer to join its BEOL team within DRAM Research & Development. This role is ideal for recent graduates or early-career engineers eager to develop expertise in semiconductor processes.

You will work with experienced engineers to optimize advanced DRAM BEOL process flows, supported by strong fundamentals in electrical engineering or related fields.

Competitive benefits package includes medical, dental, vision plans, and paid time off.

Qualifications

  • MS/PhD (preferred)/BS (required) in relevant engineering discipline.
  • Understanding of semiconductor fabrication and BEOL processes.
  • Hands-on experience with CVD, ALD, PVD or similar techniques.

Responsibilities

  • Support BEOL process flow development and optimization.
  • Assist in troubleshooting integration issues across process modules.
  • Collaborate with cross-functional teams to resolve technical challenges.

Skills

Understanding of semiconductor fabrication processes
Hands-on experience with deposition techniques
Familiarity with BEOL concepts
Proficiency in statistical analysis tools

Education

MS/PhD in relevant fields (Electrical Engineering, Materials Science, etc.)
BS in related field

Tools

JMP
Python
R
SEM
TEM

Job description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is a global DRAM leader whose innovative designs are pushing the boundaries of what's possible in the future of semiconductors.

Position Overview

We are seeking a motivated Process Integration Engineer to join our BEOL (Back‑End‑Of‑Line) team within DRAM Research & Development. This role is ideal for recent graduates or early‑career engineers who are eager to develop deep expertise in semiconductor process integration, metallization, and interconnect technologies. You will work alongside experienced integration engineers to develop, optimize, and transfer advanced DRAM BEOL process flows. Strong fundamentals in materials science, electrical engineering, or a related discipline are essential. Prior semiconductor experience is valued but not required – we invest in developing our engineers.

Responsibilities
  • Support BEOL process flow development, optimization, and integration for advanced DRAM technologies.
  • Assist in troubleshooting integration issues across multiple process modules (metallization, dielectrics, etch, CMP).
  • Collect, analyze, and interpret process and electrical data to drive yield improvement and reliability enhancement.
  • Collaborate with cross‑functional teams (module engineers, device engineers, reliability, manufacturing) to resolve technical challenges.
  • Participate in technology transfer activities from R&D to pilot production.
  • Document findings and present results to peers and leadership.
  • Learn and apply statistical analysis tools and methodologies (JMP, Python, R, or equivalent).
  • Support pathfinding efforts for next‑generation BEOL architectures and materials.
Minimum Qualifications
  • MS/PhD (preferred)/BS (required) in Electrical Engineering, Materials Science, Chemical Engineering, Microelectronics, Physics, Chemistry, or related field with coursework or research in thin films, interconnect technology, or nanofabrication.
  • Foundational understanding of semiconductor fabrication processes (thin film deposition, etch, lithography, CMP).
  • Familiarity with BEOL concepts: metallization, interconnects, dielectrics, barrier/liner films.
  • Hands‑on experience with deposition techniques (CVD, ALD, PVD) or etch processes.
  • Exposure to DRAM or memory device technology paired with experience with process integration, yield improvement, or reliability testing.
Preferred Qualifications
  • Internship or co‑op experience in a semiconductor fab or R&D environment.
  • Willingness to learn, adapt, and work in a fast‑paced R&D environment.
  • Proficiency in statistical analysis tools (JMP, Python, R, etc.).
  • Familiarity with characterization techniques: SEM, TEM, XRD, electrical testing.
  • Experience with Design of Experiments methodology.
  • Knowledge of semiconductor reliability concepts (electromigration, TDDB, stress migration).
Benefits

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations, benefit programs that help protect your income if you are unable to work due to illness or injury, paid family leave, robust paid time‑off program and paid holidays. For additional information regarding our benefit programs, please see the benefits guide posted on micron.com/careers/benefits.

Equal Opportunity Employment

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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