Sort Interface Pathfinding and Development Engineer

Intel; Hillsboro (OR); On-site; USD 134,000 - 255,000; Full time

Benefits offered by this job

Stock bonuses

Benefits package

Job summary

Intel Corporation is seeking a Sort Interface Pathfinding and Development Engineer in Oregon to pioneer probe and test solutions for wafer and die sort capabilities across EMIB, Foveros, and related platforms. You will lead electro-mechanical pathfinding, testing hardware development, and co-design with customers and suppliers to support Intel's roadmap.

Minimum qualifications include a STEM degree with 6+ years (or advanced degrees with fewer years) and experience in probe card technologies,

Qualifications

• Bachelor’s degree with 6+ years experience or Master’s with 4+ years or PhD with 2+ years.
• Experience with wafer/die sort tech, prober‑tester integration, and probe card qualification.
• DOE design, evaluation of probing margins, yield, and process health.

Responsibilities

• Formulate and execute DOEs to optimize probing technologies and contact architectures.
• Lead liaison for Foundry/OSAT customers translating chiplet needs into specs.
• Write sort design rules and IDKs for ecosystem integration.
• Collaborate with design and DFT teams to architect test interface hardware.
• Partner with global Test Solution vendors and PCB suppliers for advanced probing.
• Drive supplier accountability and manufacturing readiness for NPI.

Skills

Cross-functional collaboration

Strong communication

Analytical thinking

Self-motivated

Customer-focused

Adaptability

Continuous learning

Education

Bachelor’s degree in electrical engineering, mechanical engineering, materials science, or related STEM field

Master’s degree in same fields with 4+ years of experience

Ph.D. in same fields with 2+ year of experience

Tools

Advantest V93k

Teradyne Ultra-FLEX

PCB/space transformer design rules

Job description

Job Details

Job Description:

Intel Corporation is one of the world's leading semiconductor companies, driving innovation across computing, connectivity, and artificial intelligence. With a bold vision to shape the future of technology, Intel is transforming how the world processes, stores, and communicates data. Our Advanced Packaging ,Test and Manufacturing (APTM) organization is at the forefront of this transformation, delivering industry-leading packaging and test technologies that power products across Client, Data Center, AI, Networking, and External Foundry markets. At Intel, we believe the next big thing starts with you.

We are seeking a talented and driven Sort Interface Pathfinding and Development Engineer to join our Sort Interface Development team in Oregon. In this high-impact role, you will pioneer breakthrough silicon interface probing & test solutions that enable best-in-class die and wafer sort capabilities across leading-edge process nodes and advanced heterogeneous packaging platforms — including EMIB, EMIB‑T, Foveros, and Foveros Direct.

As Intel scales its Open System Foundry and OSAT (Outsourced Semiconductor Assembly and Test) business model, you will play an instrumental role in establishing world‑class, customer‑ready sort interface capabilities. You will lead electro‑mechanical pathfinding, test hardware development, customer and supplier technical co‑design, and probing process qualification to support both Intel's internal product roadmap and external Foundry customers.

Key Responsibilities

• Formulate and execute rigorous Design of Experiments (DOE) to optimize and qualify next-generation probing technologies and contact architectures for wafer and die sort operations
• Serve as the lead technical liaison for Foundry and OSAT customers, translating complex chiplet and package requirements into scalable sort interface specifications
• Author industry-standard sort design rules and Interface Design Kits (IDKs) to streamline ecosystem integration for external fabless customers and design partners
• Collaborate with customer design and DFT teams to architect test interface hardware, resolve technical gaps, and synchronize testability roadmaps
• Partner with global Test Solution vendors and PCB suppliers to pioneer state‑of‑the‑art probing capabilities
• Direct supplier and pathfinding initiatives to align vendor roadmaps with internal efficiency and performance goals
• Drive supplier accountability and manufacturing readiness to guarantee on‑time hardware delivery for critical New Product Introductions (NPI)

As a Successful Candidate, You Will Bring

• Collaborative mindset — you thrive working across cross‑functional teams, customers, and global suppliers
• Strong communicator — you can translate highly technical concepts into clear, actionable specifications for diverse audiences
• Analytical thinker — you approach complex problems with curiosity, structure, and data‑driven decision‑making
• Self‑starter — you take initiative, drive projects forward, and hold yourself and others accountable
• Customer‑focused — you understand the importance of building trust and delivering value to external partners
• Adaptable — you are comfortable navigating ambiguity and evolving priorities in a fast‑paced, cutting‑edge environment
• Continuous learner — you stay current with emerging technologies and proactively seek opportunities to grow

If you are passionate about pushing the boundaries of advanced packaging and test technology, and you want to make a meaningful impact on products that power the world's most advanced computing systems, we want to hear from you.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

• Bachelor’s degree in electrical engineering, Mechanical Engineering, Materials Science, or a related STEM field with 6+ years of industry experience OR Master's degree in the same fields with 4+ years of industry experience OR Ph.D. in the same fields with 2+ year of relevant post‑graduate or industry experience
• Relevant industry experience can be any of the following:
  • Experience with wafer/die sort Technology, prober‑tester cell integration, and qualification of advanced probe card technologies
  • Structure and execute DOEs to evaluate probing margins, yield, and process health
  • Direct experience in ATE test hardware/methodology, Sort/Class product development, or PCB/space transformer/substrate design rules and stackup architectures

Preferred Qualifications

• 6+ years of experience in:
  • Advanced probing process characterization
  • Direct experience managing technical relationships with external probe card/substrate suppliers or providing test hardware application support to external foundry/OSAT customers
  • Knowledge of OSAT/Foundry test operations, multi‑client test cell standards, customer design collateral/PDK enablement, or turnkey test delivery models
  • Experience qualifying probe technologies for fine‑pitch micro‑bumps, 2.5D/3D architectures (EMIB, EMIB‑T, silicon bridges), or wafer‑level chip‑scale probing
  • Hands‑on experience with commercial ATE platforms such as Advantest V93k or Teradyne Ultra‑FLEX

Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location

US, Oregon, Hillsboro

Additional Locations

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00 - 255,200.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job‑related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on‑site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION:

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.