Software Engineering PhD Intern New 2027

Intel Corporation; Hillsboro (OR); On-site; USD 150,000 - 151,000; Full time

Job summary

Intel Corporation seeks a highly motivated Software Research Intern (PhD) to join the TCAD Process Reliability Modeling team within Intel Foundry. The role focuses on advanced computational software for semiconductor technology development, including chip-package interactions and thermal management.

The internship collaborates with multidisciplinary teams across Intel, offering hands-on experience in software engineering and research to solve complex engineering challenges.

Qualifications

• Must be a full-time PhD student in a relevant engineering field.
• Minimum GPA of 3.0.
• At least 1 year of programming experience in C/C++/Python or equivalent.
• Strong analytical and software development skills.

Responsibilities

• Design, develop, and optimize software solutions for engineering and research.
• Develop simulations using numerical methods such as finite element or level sets.
• Create modeling-based methodologies to address device and interconnect problems.
• Define input criteria and validate results.
• Collaborate with engineers and researchers to deliver scalable solutions.
• Document approaches and present findings to stakeholders.

Skills

Programming in C/C++/Python

Analytical skills

Problem-solving

Education

PhD student in Electrical Engineering / Materials Science / Mechanical Engineering / Chemical Engineering or semiconductor field

GPA 3.0 or higher

Tools

TCAD tools

Finite element solvers

Job description

Job Details:

Job Description:

The Role and Impact

Intel is seeking a highly motivated Software Research Intern (PhD) to join the TCAD Process Reliability Modeling team within Intel Foundry. This internship offers an opportunity to work on advanced computational software solutions supporting semiconductor technology development. The selected candidate will contribute to cutting-edge software applications and solution methodologies like chip-package interactions, thermal transport and thermal management, thin films development and patterning.

The internship is designed for PhD students interested in applying software engineering and research expertise to solve complex engineering challenges while collaborating with multidisciplinary teams across Intel.

Business Group

The Intel Foundry Technology organization is focused on driving semiconductor process innovation and enabling future technology nodes. Within the LTD-TD TCAD team, engineers and researchers develop advanced simulation, modeling, and software solutions used to accelerate technology development. The team fosters a collaborative environment where software, mathematics, physics, and engineering intersect to solve challenging technical problems.

Key Responsibilities

• Design, develop, and optimize software solutions for engineering and research applications.

• Develop simulations capabilities using numerical methods like finite element, level sets, or related techniques.

• Develop modeling-based methodologies to solve device and interconnect process, module and reliability problems.

• Establish criteria and methods to determine proper inputs and validate results.

• Collaborate with software engineers, researchers, and domain experts to deliver scalable and maintainable solutions.

• Document technical solutions and present findings to project stakeholders.

Qualifications:

Minimum Qualifications

• Must be a full-time student pursuing a Ph.D. degree in Electrical Engineering, Material Science, Mechanical Engineering, Chemical Engineering or a semiconductor-related field.
• Must have a minimum of a 3.0 GPA in college courses to date.
• 1+ year experience programming in C/C++/Python or equivalent.
• Strong analytical, problem-solving, and software development skills.

Preferred Qualifications

• Experience with using TCAD or atomistic simulation tools to study thermo-mechanical and chip/package interactions, thermal transport, thin film deposition processes, patterning, material chemical interactions or circuit performance.
• Hands on experience development and/or using finite element or equivalent solvers for solutions of physical systems.
• Experience with physics-based modeling, AI/machine learning methodologies for the analysis of solid mechanics, thermal management, reliability and manufacturing process of microprocessors devices.

This is your opportunity to develop your expertise, gain hands-on experience, and make a meaningful impact within a collaborative environment that drives the future of technology. We look forward to seeing how your skills and passion will contribute to our innovative team.

Job Type:

Student / Intern

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Annual Salary Range for jobs which could be performed in the US: $149,598.00-149,602.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.