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HP IQ Connectivity is seeking an Software Engineering Intern to help develop on-device software and firmware for next‑generation HP IQ experiences. You will work with experienced engineers on wireless protocols, device discovery, and AI‑driven features across multiple devices and platforms.
You will contribute to testing, validation, and documentation of connectivity features while learning from a broad engineering team and participating in design discussions.
HP IQ's Connectivity Software team is building foundational software that enables the next generation of connected experiences across devices and platforms. Our team works at the intersection of systems software, wireless connectivity, and emerging technologies to create seamless, intelligent experiences. We are looking for an Intern to join the team and contribute to the software, protocols, and systems that bring these experiences to life. In this role, you will work alongside experienced engineers to develop on-device software for next-generation HP IQ experiences. You’ll contribute to the design, development, and implementation of software across emerging devices and platforms. This is a hands‑on technical role where you’ll write code, solve complex system-level problems, and collaborate with engineers to explore and build new experiences.
Hourly Pay Range: $40.00–$50.00 per hour. Actual compensation will be determined based on factors such as skills, qualifications, and experience.
2027 Internship Program Dates: May/June–August/September 2027. Final dates will be based on student schedules.
Job - Administration Schedule - Full time Shift - No shift premium (United States of America) Travel - Relocation - Equal Opportunity Employer (EEO) -
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