SMT Process Engineer – Electronics Manufacturing Services (EMS / PCBA)

J T; Seymour (CT); On-site; USD 80,000 - 110,000; Full time

Job summary

J T is seeking an SMT Process Engineer to lead design, development, and optimization of end-to-end SMT lines in a high-mix EMS environment in Seymour, CT. You will drive NPI readiness, improve yield, and mentor junior staff.

This role emphasizes collaboration with design, quality, and maintenance, delivering SOPs, PFMEAs, and process control plans while ensuring IPC-A-610/J-STD-001 compliance and targeted throughput.

Qualifications

• Bachelor’s degree in Mechanical, Electrical, Manufacturing, or Industrial Engineering required.
• Hands-on SMT process engineering experience in EMS or contract manufacturing.
• Familiarity with IPC-A-610 and J-STD-001 standards; Lean/Six Sigma knowledge.

Responsibilities

• Lead end-to-end SMT line design, execution, and optimization for high-mix production.
• Drive NPI readiness, line efficiency, and first-pass yield improvements.
• Develop SOPs, PFMEAs, process control plans, and CAPA as needed.
• Mentor junior engineers and coordinate with cross-functional teams.

Skills

Process optimization

Yield improvement

Root-cause analysis

Cross-functional leadership

Documentation

Education

B.S. in Engineering

Tools

DEK

Panasonic

Fuji

Heller

Koh Young

CyberOptics

Aegis MES

CAM software (Valor)

Job description

SMT Process Engineer - Electronics Manufacturing Services (EMS / PCBA)

Location: Seymour, CT

Position Type: Full-Time

Industry: Electronics Manufacturing Services (EMS) / Contract Manufacturing

Career Path: Succession track to a formal engineering leadership role within 1-2 years

Position Overview

The SMT Process Engineer serves as a technical subject-matter expert and strategic contributor within the Engineering & Technology group. Operating in a high-reliability, high-mix electronics manufacturing environment, this individual is responsible for leading process development, yield optimization, and line efficiency across SMT platforms, driving New Product Introduction (NPI) readiness, and mentoring junior technical personnel.

Designed with a clear trajectory toward formal engineering leadership, this position requires technical depth, cross-functional collaboration, and the ability to turn complex manufacturing challenges into reliable production solutions.

SMT Process Ownership & Yield Optimization:

Lead the design, execution, and continuous optimization of end-to-end SMT lines, including solder paste printing, high-speed component placement, reflow profiling, SPI, AOI, and X-ray inspection.

Own process capability ($C_{pk}$) analysis, first-pass yield tracking, defect rate reduction, and throughput enhancement using Lean and Six Sigma methodologies.

Author, maintain, and standardize robust engineering documentation, including Standard Operating Procedures (SOPs), detailed work instructions, process control plans, and PFMEAs.

Engineering Leadership & Mentorship:

Provide technical mentorship, coaching, and direction to junior process engineers and manufacturing technicians.

Serve as a cross-functional technical driver, bridging operations, manufacturing engineering, quality assurance, and equipment maintenance.

Demonstrate technical leadership and initiative across high-impact capital and process projects in preparation for formal management responsibilities.

NPI & Customer Technical Engagement:

Partner with customer design teams, program management, and internal engineering to lead Design-for-Manufacturability (DFM) reviews and ensure smooth production ramp-ups.

Analyze PCB layouts, panelization data, and Gerber files to guarantee assembly compliance, minimize solder defects, and streamline process flow.

Act as a direct technical liaison with clients, communicating process capabilities, design recommendations, and yield improvement strategies.

Evaluate, specify, and assist in procuring advanced SMT machinery, feeders, conveyors, and automated inspection platforms.

Direct equipment installation, calibration, IQ/OQ/PQ validation, and recipe standardization for new tooling and capital equipment.

Design or oversee the fabrication of custom tooling, carrier pallets, and assembly fixtures to improve floor throughput.

Deliver real-time technical troubleshooting on production lines to resolve process anomalies and minimize machine downtime.

Lead structured root-cause investigations (8D, A3, DMAIC) and implement robust Corrective and Preventive Actions (CAPA) to resolve component placement or solder escapes.

Partner with maintenance teams to define and refine preventative maintenance schedules for line equipment.

Project Execution & Industry Standards:

Manage engineering project milestones, budgets, and deliverable timelines, presenting structured KPI reports to executive leadership.

Ensure all soldering, assembly, rework, and inspection processes strictly adhere to IPC-A-610 and J-STD-001 quality standards.

Qualifications & Experience Requirements

Education: Bachelor’s degree in Mechanical, Electrical, Manufacturing, or Industrial Engineering required.

Professional Experience:

Minimum 3 to 7 years of hands-on SMT process engineering experience within electronics contract manufacturing (EMS), preferably in a high-mix, low-to-medium volume setting.

In-depth operational and programming knowledge of industry-standard SMT equipment (e.g., DEK, Panasonic, Fuji, Heller, Koh Young, CyberOptics).

Quality & Technical Standards:

Comprehensive working knowledge of IPC-A-610 and J-STD-001 standards, component packages, and polarity verification.

Demonstrated mastery of Lean Manufacturing and structured problem-solving methodologies (DMAIC, 8D, A3, Root Cause Analysis).

Systems & Software (Preferred):

Six Sigma Green Belt certification or equivalent preferred.

Hands-on experience with Manufacturing Execution Systems / shop-floor tracking platforms (such as Aegis MES).

Familiarity with CAD tools, Gerber viewers, and CAM engineering software (e.g., Valor, CAM350).

Core Competencies: Strong analytical and quantitative problem-solving ability, disciplined project management, proactive cross-functional communication, and the capacity to lead technical initiatives with minimal direct supervision.