I.Core Value of the Position:
Responsible for the process design, optimization, and abnormality resolution across the entire SMT (Surface Mount Technology) production process. This role is critical for ensuring product quality, first-pass yield, and production efficiency. The engineer bridges R&D design and mass production, leading the process review for New Product Introduction (NPI) while continuously driving process capability improvement and cost reduction.
II.Key Responsibilities:
1. New Product Introduction & Process Design
- Conduct Manufacturing Feasibility Assessments (DFM) for new products (NPI). Review PCB design data (Gerber, BOM) and issue DFM reports, providing optimization recommendations from the perspectives of printing, placement, and reflow soldering.
- Design and fabricate stencils, placement fixtures, depaneling fixtures, and reflow thermocouple test boards required for SMT production.
- Develop process flowcharts for new products and create process documentation including Standard Operating Procedures (SOPs), PFMEA, and Control Plans (CP).
2. Process Maintenance & Abnormality Resolution
- Responsible for setting, optimizing, and controlling key parameters across solder paste printing, component placement, reflow soldering, and AOI/SPI inspection processes (e.g., reflow profile development and validation).
- Lead the analysis and resolution of quality abnormalities on the production floor. Quickly establish corrective and preventive actions for soldering defects (e.g., tombstoning, bridging, insufficient solder, BGA voids, etc.) and issue 8D reports.
- Monitor and improve three core SMT performance metrics: First-Pass Yield, Production Efficiency, and Component PPM (pick-and-place defect rate).
3. Process Improvement & Cost Control
- Utilize Lean Manufacturing, Six Sigma, and other tools to continuously optimize production time and line balance, thereby increasing capacity.
- Lead or participate in special improvement projects (e.g., solder paste life management, oven energy conservation, fixture light weighting) to reduce manufacturing costs.
- Evaluate and introduce new processes, materials, and equipment to drive automation and smart manufacturing upgrades.
- Establish and update operating standards and inspection criteria for all SMT workstations.
- Train and guide production technicians and operators to perform tasks in compliance with standard procedures, enhancing the overall skill level of the team.
III. Qualifications & Requirements
1. Basic Requirements
- Major: Electronics Engineering, Mechanical Design & Manufacturing and Automation, Mechatronics, Materials Science and Engineering, or other related science/engineering disciplines.
2. Work Experience
- Mid-level / Senior: 3-8+ years of relevant experience in SMT or electronics manufacturing process engineering. Prior experience in high-reliability product sectors such as automotive electronics, telecommunications equipment, or medical electronics is highly preferred. With Chinese ability are preferred.
3. Technical Skills
- Process Knowledge: Proficient in the entire SMT process flow (printing, placement, reflow, inspection); familiar with IPC-A-610 acceptability standards for electronic assemblies.
- Software Proficiency: Skilled in using AutoCAD, CAM350, or GC-PowerPlace for stencil and fixture design; proficient in Microsoft Office Suite for data analysis and report generation.
4. Core Competencies
- Strong logical analysis and data-driven decision-making skills, with the ability to independently resolve complex process abnormalities.
- Excellent communication, coordination, and teamwork abilities, effectively interfacing with R&D, Production, Quality, and customer audit teams.
# Provided benefits : Medical insurance, 401(k), Pension plan, PTO