Senior Thermal Engineer

Frore Systems, Inc.; San Jose (CA); On-site; USD 140,000 - 220,000; Full time

Job summary

Frore Systems, Inc. is seeking a Senior Thermal Engineer to lead end-to-end thermal architecture for consumer electronics and data center platforms. You will drive simulations, validate cooling performance, and ensure scalable, energy-efficient cooling solutions across products.

The role requires a strong background in CFD, heat transfer, and production-ready designs, with a track record of mentoring engineers in a fast-paced startup environment.

Qualifications

• 5+ years of hands-on thermal design for high-power electronics or data center systems.
• Strong background in CFD and heat transfer fundamentals.
• Proven track record bringing complex cooling solutions to production.
• Excellent technical communication for customers and cross-functional teams.

Responsibilities

• Lead thermal architecture across consumer electronics and data center platforms.
• Perform CFD and system modeling to optimize cooling paths and heat sinks.
• Guide thermal validation plans using IR thermography and sensors.
• Mentor junior engineers and scale best practices across the organization.
• Collaborate with R&D and manufacturing to deliver high-quality thermal modules.

Skills

CFD Tools

Heat Transfer

Thermal System Design

Mentorship

Education

B.S. Mechanical Engineering

MS/PhD Preferred

Tools

ANSYS Icepak

ANSYS Fluent

Job description

Frore Systems, an innovative top tier VC backed startup in Silicon Valley, CA, has developed a disruptive solid-state active cooling solution, AirJet®, based on flexible micro-electromechanical systems (MEMS). AirJet® by Frore Systems is the world’s first solid-state active cooling chip, delivering >2x improvement in performance of ultra-compact, silent, dustproof, water-resistant and vibration free devices. In a world where almost every device we own needs increasing power, heat is an enduring challenge. The problem is rapidly escalating as technology advances, AI accelerates, and users demand more speed and convenience in smaller and smaller devices which generate more and more heat.

The markets that benefit from Frore Systems solid-state active cooling chips are numerous, they range from the edge applications - Notebooks, Tablets, mini-PCs, gaming devices, action cameras, VR, AR, SSD accessories, Smartphones, LED lighting, Industrial edge gateways, Industrial PCs, Security cameras, Dashcams, etc. - to Hyperscaler and Automotive applications.

We are in the unique position of being first to market with an innovative solution to a large and rapidly growing industry challenge. And we are poised to scale up!

Role Summary:

We are looking for a Senior Thermal Engineer with a deep understanding of consumer electronics and data center thermal design and cooling technologies to lead the development of next-generation compute platforms using Frore’s AirJet technologies. You will drive end-to-end thermal architecture across consumer electronics platforms, servers and racks, ensuring scalable, energy-efficient, and reliable cooling.

Key Responsibilities:

• Thermal Architecture Leadership: Drive thermal cooling strategies for consumer electronics devices, to meet performance, efficiency, and reliability goals using AirJet technologies.
• CFD and System Modeling: Lead airflow and thermal simulations using CFD tools at component, system levels. Optimize custom thermal solution, flow paths, heat sinks, ducting designs.
• Thermal Validation and Testing: Guide thermal validation plans, including the use of IR thermography, thermocouples, pressure drop measurements, and flow behavior from acoustics perspective.
• Reliability and Margin Analysis: Perform thermal margin analysis and ensure compliance with derating guidelines, component lifetime requirements, and ASHRAE standards.
• Mentorship: Mentor junior engineers, review their designs and analyses, and help scale best practices across the organization.
• Cross-Functional Integration: Collaborate closely with R&D and manufacturing to ensure high quality thermal modules to customers

Required Qualifications:

• B.S. in Mechanical Engineering, Thermal Sciences, or related field.
• M.S./PhD. Preferred.
• 5+ years of hands-on experience in thermal design of high-power electronics or data center systems.
• Expertise in CFD tools: Ansys Icepak, Fluent, or equivalent.
• Deep understanding of heat transfer and fluid dynamics, including conduction, convection (forced and natural), and phase change cooling.
• Strong track record of bringing complex cooling solutions to production, with thermal ownership.

Additional Skills:

• Strong technical communication and ability to present to customers, executive audiences and cross-functional teams.
• Proven leadership in cross-functional engineering projects.
• Proactive problem-solver who thrives in a fast-paced environment.

Compensation: Depending on experience and skills, the expected starting base salary is $140,000 - $220,000 USD per year, plus equity. The actual salary will be based on various factors unique to each candidate including skill set, relevant experience, qualifications, location, position level, and other job-related reasons.