Senior Staff Signal & Power Integrity Engineer

MaxLinear, Inc.; Irvine (CA); Vor Ort; USD 135.000 - 183.000; Vollzeit

Zusammenfassung

MaxLinear is seeking a Senior Staff Signal & Power Integrity Engineer to develop state-of-the-art packages and PCBs for our next generation products. The role emphasizes SI/PI simulations, optimization, and PDN design for high-speed interfaces and SoC packages.

You will collaborate with systems, IC design, layout, and test teams, applying RF/mm-wave, 5G, and optical concepts to enable reliable data center connectivity and AI workloads.

Qualifikationen

• Deep understanding of EM fundamentals, transmission lines, and microwave theory.
• Experience designing and simulating SI/PI for high-speed system components (packages, PCB, connectors).
• Experience with high-speed channel simulations for SerDes and transient SI/PI.
• Understanding of S-parameters, Smith Chart, and frequency domain analysis.
• Proficiency with 2.5D/3D solvers like HFSS/SIwave/Cadence Sigrity; ADS/SPECTRE for time/frequency analysis.

Aufgaben

• Develop state-of-the-art packages and PCBs for MaxLinear’s next generation products.
• Perform SI/PI simulations and optimization to ensure critical signals meet specifications.
• Design and simulate high-speed interfaces and PDN for advanced SoC packages and PCBs.
• Collaborate with cross-functional teams including systems, IC design, package/PCB layout, and test/characterization.

Kenntnisse

Electromagnetic fundamentals

Transmission lines

Microwave theory

SI/PI simulations

Ausbildung

BS in Electrical Engineering or related + 7 years

MS in Electrical Engineering + 5 years

PhD + 2 years

Tools

ANSYS HFSS

SIwave

Cadence Sigrity

Jobbeschreibung

Responsibilities

MaxLinear is seeking a Senior Staff Signal & Power Integrity (SI/PI) Engineer to join our team. In this role, you will focus on the following:

• Development of state-of-the-art packages and printed circuit boards (PCBs) for MaxLinear’s next generation products
• Perform SI/PI simulations and optimization to ensure critical signals meet their required specifications
• Design and simulate high-speed signal interfaces and power distribution networks (PDN) for advanced communications SoC packages and PCBs
• Work on a diverse set of products and applications including RF/mm-wave modems and transceivers, 5G communication, wireless connectivity, and optical communications (PAM4 1.6T/3.2T DSPs and TIAs) for data center connectivity and storage for AI applications

Qualifications

• Deep understanding of Electromagnetic fundamentals, transmission lines, and microwave theory
• Experience designing and simulating signal and power integrity solutions for high-speed system components (packages, PCB, connectors)
• Experience with high-speed channel simulations for SerDes and transient simulations for SI and PI
• Understanding of S-parameters, Smith Chart, and frequency domain analysis
• Proficiency in use of 2.5D and 3D simulation tools such as ANSYS HFSS, SIwave, Cadence Sigrity tools, or similar field solvers
• Expertise in time and frequency domain analysis using simulation tools like ADS, SPECTRE, etc.
• Hands-on experience with lab measurement equipment like Spectrum Analyzer, Vector Network Analyzer (VNA), Oscilloscopes, TDR
• Ability to manage package development in collaboration with cross functional teams including systems, IC design, IC physical layout, package/PCB layout, and test/characterization teams
• Self-motivated with ability to work effectively in both independent and team settings
• Strong communication, presentation, and documentation skills
• Excellent problem-solving skills and ability to excel in a fast-paced environment
• BS in Electrical Engineering or related + 7 years of experience, or MS + 5 years of experience, or Ph.D. + 2 years of experience
• Preferred Qualifications:
  • Experience with layout tools such as Cadence Allegro and APD
  • Understanding of different IEEE and Optical standards to define design guidelines
  • Experience with electro-optic integration on packages; co-packaging of DC-DC convertors, regulator, TIAs, and optical drivers and multi-chip package design
  • Familiarity with IC design flows, floor-planning, IO ring design, on-chip decoupling, on-die EM/IR analysis
  • Understanding of different TX/RX circuit designs and how system SI/PI impacts such circuits. Use this knowledge to drive the design of packages and PCBs
  • Expertise in equalization techniques such as FIR, CTLE, DFE, FFE and different types of noise in the system and channels and how to optimize EQ settings to mitigate them

Compensation and Benefits

MaxLinear has a Total Compensation philosophy which includes base salary and annual discretionary bonus eligibility and many positions also include stock-based compensation.

MaxLinear's good faith estimate starting base salary range is: $135,000to $183,000Annually

We offer competitive benefits designed to support employee health, welfare, and retirement and some highlights are: health care benefits, 401k savings plan, Employee Stock Purchase Plan (ESPP), and paid time off.

The actual starting base salary will be determined by the match to certain role-related criteria such as educational degree(s) or equivalent, relevant work experience, skillset needed for the role, and geographic location; this is not an all-inclusive list as some roles may require unique skills or experience.

Qualified applicants will receive consideration for employment without regard to, and will not be discriminated against based on race, sex, religion, national origin, sexual orientation, gender identity, disability, or protected veteran status.