Senior Staff Product Application Engineer-Memory Subsystems

Advanced Micro Devices, Inc.; San Jose (CA); On-site; USD 180,000 - 240,000; Full time

Benefits offered by this job

AMD benefits at a glance

Job summary

Advanced Micro Devices, Inc. seeks a memory systems expert to own escalated customer memory issues across DDR/LPDDR generations, from design-in to production. You will root-cause failures on real systems, review next-gen memory architecture, and author customer-facing documentation.

The role requires deep memory/NoC knowledge, lab debugging, and cross-functional leadership without direct authority, plus applying AI to engineering workflows to improve debugging and automation.

Qualifications

• Extensive hands-on experience with memory subsystems across multiple DRAM generations.
• Expertise in DDR and LPDDR generations with JEDEC specs and module variants.
• Proven ability to author customer-facing documentation.
• Strong root-cause analysis of system-level memory failures.
• Experience working with strategic customers and cross-functional teams.
• Demonstrated use of AI in engineering workflows to improve debugging and automation.

Responsibilities

• Own escalated memory support issues from design-in to production.
• Be authority on DDR/LPDDR, JEDEC standards, device behavior, module topologies, and data rates.
• Author product guides, user guides, datasheets, answer records and tutorials for customers.
• Review memory and NoC architecture for next-generation silicon; identify gaps and propose fixes.
• Perform DRAM SI/PI measurements and provide PCB layout guidance for DDR/LPDDR.
• Create targeted memory tests and tooling in C to stress hardware.
• Translate system-level challenges into product and roadmap decisions; coordinate across teams.
• Apply AI tools to surface design gaps and summarize large test/log datasets.

Skills

Memory subsystems

DDR/LPDDR standards

Root-cause analysis

System architecture

Hardware debugging

C programming

AI in workflows

Customer engagement

Technical writing

NoC/Memory controller

Oscilloscopes

JTAG/protocol analysis

Tools

IBIS-AMI models

Lab debugging tools

Job description

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THE ROLE

Join our team to drive customer success on the memory subsystem across our silicon portfolio, covering DDR and LPDDR across generations and the memory controller, Network-on-Chip and physical interface behind them. You will be a technical point of contact for escalated memory cases, from early design-in and bring-up through production support.

You are the person strategic customers elevate to when memory does not behave the way the specification says it should. You will root-cause those failures on real systems, drive the fix through the teams that own it, and review next-generation memory architecture and design to catch defects before they reach silicon. You will also own the memory documentation customers design against. The scope runs from JEDEC device behavior and PCB routing, through controller architecture and RAS features, to the product and roadmap decisions your findings should drive.

THE PERSON

You have a passion for memory technology, system architecture, and hardware debug at the level where silicon, firmware, board and DRAM device all interact. You are a thorough memory expert who knows what the specification says, what the silicon actually does, and where the two diverge. You are a team player with excellent written and verbal communication skills and experience collaborating with engineers located in different sites and timezones, and you can hold a technical conversation directly with a customer. You are effective across organizations you do not manage, and you are drawn to problems that arrive without a clear owner or a clear root cause. We place a high value on technical writing. You produce documentation a customer can design against with confidence, and you can present a complex technical finding clearly to both engineering and customer audiences.

KEY RESPONSIBILITIES

Customer Support and Debug:Own escalated customer support issues for memory, from early design-in and bring-up through production support. Partner with key customers to root-cause system memory failures such as intermittent errors, calibration and training failures, and margin and boot issues. Attribute each correctly across DRAM, board, controller IP, calibration firmware and silicon, and drive the fix to closure.

Memory Subsystem and Interconnect Expertise:Be the authority on DDR and LPDDR, covering JEDEC standards, device behavior, module topologies, ranks, widths and supported data rates. Know how traffic reaches the controller across the Network-on-Chip, including QoS, arbitration, and bandwidth and latency budgeting.

Customer Documentation and Communication:Author the customer-facing memory documentation, including product guides, user guides, datasheets, answer records, tutorials and layout guidance, and publish resolutions internally and externally.

Architecture Review and RAS Validation:Review memory and NoC architecture and design specifications for next-generation silicon, identifying gaps, inconsistencies and design bugs, and proposing fixes. Evaluate and validate its memory RAS features.

Signal and Power Integrity:Perform DRAM SI/PI and timing measurements. Apply PCB layout and routing knowledge for DDR and LPDDR to assess customer designs and define the layout guidance we publish. Support IBIS-AMI models and channel simulation.

Memory Health Tooling and Experiments:Create experiments and tooling that catch memory health issues before they are reported. Write targeted memory tests in C to stress and characterize specific failure modes on real hardware.

Product Influence and Cross-Functional Leadership:Translate system-level challenges into product and roadmap decisions on supported configurations, data rates, feature scope and documentation accuracy. Drive teams across IP, firmware, tools, signal integrity, validation and quality without direct authority, for feature enablement, optimization and characterization.

Apply AI to Engineering Workflows:Use AI/LLM/ML tools to surface design gaps, summarize and correlate large test and log datasets, and drive productivity in debug, automation and documentation.

PREFERRED EXPERIENCE

• Extensive hands-on experience with memory subsystems in an applications, architecture, design, or validation role, built across multiple DRAM generations and product cycles.
• Expertise across DDR and LPDDR generations (DDR4/DDR5, LPDDR4/4X/5/5X/6), with fluency in the relevant JEDEC specifications and in module variants (UDIMM, SODIMM, RDIMM, LRDIMM, CUDIMM). HBM experience is a plus.
• Excellent technical writing, with a track record of authoring and publishing customer-facing documentation that an external audience designs against: product guides, user guides, datasheets, answer records and tutorials.
• Deep knowledge of DRAM, memory controller and PHY architecture: command scheduling and arbitration, address mapping and decode, calibration and training, DQS gating and delay-line behavior, termination and drive strength, voltage and temperature tracking, and page policy, with experience evaluating and validating RAS features.
• Working knowledge of on-chip interconnect architecture, including Network-on-Chip, and of bandwidth and latency budgeting.
• Proven root cause of system-level memory failures, attributing each correctly across the DRAM device, board, controller IP, firmware, tools and silicon, including reading calibration and training firmware closely enough to trace a failure to the step that produced it. Hands-on lab debug with oscilloscopes, signal generators, BERTs, logic and protocol analyzers, and register-level debug over JTAG.
• Hands-on DRAM SI/PI and timing analysis (measurement on real hardware, eye and margin analysis, and channel simulation with IBIS and IBIS-AMI models) together with a practical understanding of PCB layout and routing for DDR/LPDDR. Platform-level signal and power integrity is a plus.
• Experience working directly with strategic customers in technical or architecture-facing roles, translating system-level challenges into product or roadmap decisions, and influencing multi-functional teams without direct authority, with a track record of mentoring and running technical reviews.
• Demonstrated use of AI in engineering workflows, applying AI/LLM/ML tools to identify design gaps, summarize collected data for distribution and analysis, and drive productivity in debug, automation and documentation.
• Strong C for writing targeted memory test applications, and able to read architecture specifications, design documentation and SystemVerilog/Verilog RTL closely enough to identify implementation bugs.

This role is not eligible for visa sponsorship.

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Benefits offered are described: AMD benefits at a glance.

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