Senior RTL Engineer, IO Die and Interconnect IP

samsungsemiconductor

San Jose (CA)

On-site

USD 150,000 - 190,000

Full time

8 days ago

Get more replies from employers

Send a job-specific resume in minutes.

Job summary

Samsung Semiconductor in San Jose, CA is hiring an experienced RTL/SoC design engineer for IO die development. You will integrate PCIe, CXL, and UCIe interconnect IP, define chiplet interfaces, and own the microarchitecture for IO subsystems.

Collaboration with verification, architecture, and software teams is essential to meet performance and power targets. The role requires strong RTL development, scripting skills, and experience with high-speed interconnects.

Qualifications

  • Bachelor's degree (or higher) in Electrical Engineering, Computer Science, or related field.
  • 5+ years in RTL development for high-speed interconnects and IO subsystems.
  • Hands-on experience integrating PCIe, CXL, UCIe, and die-to-die interfaces.
  • Experience modifying third-party interconnect IP to meet die-level requirements.
  • Familiarity with chiplet-based multi-die architectures and die-to-die interconnects.
  • Proficiency in scripting (Tcl, Python, Perl) for automation.
  • Experience in AI/ML workloads is a plus.
  • Strong analytical, problem-solving, and communication skills.

Responsibilities

  • Develop RTL (Verilog/SystemVerilog) for IO die integrating UCIe, PCIe, and other high-speed interconnect IP.
  • Integrate interconnect IP into IO die, including configuration, glue logic, clock/reset, and interfaces.
  • Modify or customize PCIe and other IP to meet die-level requirements.
  • Define die-to-die and chiplet interfaces using UCIe for protocol compliance.
  • Own microarchitecture and RTL for IO subsystems like PCIe/CXL controllers and interconnect fabric.
  • Collaborate with verification to create test plans and debug at IP, subsystem, and die levels.
  • Work with architecture, PHY, physical design, and software teams to meet performance/power/area goals.
  • Develop automated IP integration and RTL assembly flows using scripting and AI tools.
  • Communicate with stakeholders to ensure on-time, on-budget delivery.

Skills

RTL design
Microarchitecture
Interconnect IP
Verilog/SystemVerilog
Scripting

Education

Bachelor's degree in EE/CS

Tools

PCIe IP
CXL IP
UCIe IP
PIPE/PHY interfaces
AXI/ACE/CHI/APB

Job description

Please Note:

To provide the best candidate experience amidst our high application volumes, each candidate is limited to 10 applications across all open jobs within a 6-month period.



Advancing the World's Technology Together

Our technology solutions power the tools you use every day--including smartphones, electric vehicles, hyperscale data centers, IoT devices, and so much more. Here, you'll have an opportunity to be part of a global leader whose innovative designs are pushing the boundaries of what's possible and powering the future.


We believe innovation and growth are driven by an inclusive culture and a diverse workforce. We're dedicated to empowering people to be their true selves. Together, we're building a better tomorrow for our employees, customers, partners, and communities.



The AGI (Artificial General Intelligence) Computing Lab is dedicated to solving the complex system-level challenges posed by the growing demands of future AI/ML workloads.

Our team is committed to designing and developing scalable platforms that can effectively handle the computational and memory requirements of these workloads while minimizing energy consumption and maximizing performance. To achieve this goal, we collaborate closely with both hardware and software engineers to identify and address the unique challenges posed by AI/ML workloads and to explore new computing abstractions that can provide a better balance between the hardware and software components of our systems. Additionally, we continuously conduct research and development in emerging technologies and trends across memory, computing, interconnect, and AI/ML, ensuring that our platforms are always equipped to handle the most demanding workloads of the future. By working together as a dedicated and passionate team, we aim to revolutionize the way AI/ML applications are deployed and executed, ultimately contributing to the advancement of AGI in an affordable and sustainable manner. Join us in our passion to shape the future of computing!



Location:

Daily onsite presence at our San Jose, CA office / U.S. headquarters in alignment with our Flexible Work policy.



What You'll Do


  • Develop RTL (Verilog/SystemVerilog) for the IO die, integrating UCIe, PCIe, and other high-speed interconnect IP into a cohesive chiplet-based architecture.

  • Integrate internal and third-party interconnect IP - UCIe, PCIe, CXL, die-to-die, and NoC - into the IO die, including configuration, glue logic, clock/reset, and interface bridging.

  • Modify and customize PCIe and other interconnect IP as needed - controller, PIPE/PHY interface, and configuration logic - to meet die-level requirements and close functional gaps.

  • Define and implement die-to-die and chiplet interfaces using UCIe, ensuring protocol compliance and interoperability across chiplets.

  • Own the microarchitecture and RTL for IO subsystems such as PCIe/CXL controllers, UCIe adapters, and interconnect fabric bridges.

  • Collaborate with verification engineers to develop test plans and debug functional issues at the IP, subsystem, and die level.

  • Work with architecture, PHY/SerDes, physical design, and software teams to close requirements across performance, power, area, and interoperability.

  • Make design decisions out of a large design trade-off space across performance, power, latency, bandwidth, and cost.

  • Develop and automate IP integration and RTL assembly flows using scripting and agentic AI tools and frameworks to improve turnaround time and quality of results.

  • Communicate effectively with stakeholders, including users, partners, and management, to ensure that the die is delivered on time and within budget.

  • Complete other responsibilities as assigned.



What You Bring


  • Bachelor's with 5+ years, or Master's with 3+ years, or PhD's with 0+ years of industry experience.

  • Strong background in microarchitecture and RTL design for complex SoC and die integration.

  • 5+ years of experience in RTL development (Verilog/SystemVerilog) for high-speed interconnect and IO subsystems.

  • Hands-on experience integrating and configuring interconnect IP such as PCIe, CXL, UCIe, and die-to-die interfaces.

  • Experience modifying or customizing third-party interconnect IP (e.g., PCIe controller, PIPE, or PHY interface) to meet die-level requirements.

  • Familiarity with UCIe and chiplet-based, multi-die architectures and die-to-die interconnect.

  • Solid understanding of PCIe/CXL protocol stacks (transaction, data link, and physical layers) and the PIPE interface.

  • Experience with SoC integration methodologies, IP packaging (e.g., IP-XACT), and on-chip interface protocols such as AXI, ACE, CHI, or APB.

  • Proficiency in scripting (Tcl, Python, or Perl) for design integration and automation; familiarity with agentic AI tools and frameworks is a plus.

  • Experience in AI/ML workloads.

  • Strong analytical and problem-solving skills

  • Excellent communication and interpersonal skills

  • Ability to work independently and as part of a team

  • You're inclusive, adap


Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Principal PCIe Subsystem RTL lead
Principal PCIe Subsystem RTL lead

TylSemi, Inc. • San Jose (CA)

Hybrid
USD 180,000 - 240,000
Microarchitect / RTL Design - On-Chip Interconnect & High-Speed Fabric Design
Microarchitect / RTL Design - On-Chip Interconnect & High-Speed Fabric Design

Architect Labs • Palo Alto (CA), Northern (KY)

Hybrid
USD 210,000 - 360,000
Microarchitect / RTL Design - Interconnect & Fabric
Microarchitect / RTL Design - Interconnect & Fabric

Architect Labs • Palo Alto (CA)

On-site
USD 210,000 - 320,000
Member of Technical Staff — On-Chip Interconnect & High-Speed Fabric Design
Member of Technical Staff — On-Chip Interconnect & High-Speed Fabric Design

Kindredventures • Palo Alto (CA)

On-site
USD 260,000 - 420,000
Senior RTL Designer - Interconnect/NoC Design
Senior RTL Designer - Interconnect/NoC Design

TylSemi, Inc. • San Jose (CA)

Hybrid
USD 150,000 - 190,000
Senior RTL Engineer, Interconnect Design
Senior RTL Engineer, Interconnect Design

OpenAI • San Francisco (CA)

Hybrid
USD 130,000 - 180,000
Relocation assistance
Hybrid work model
Mentorship opportunities
High-Speed IO Architect - PCIe/UCIe/Ethernet Subsystems
High-Speed IO Architect - PCIe/UCIe/Ethernet Subsystems

TylSemi • United States

Hybrid
USD 175,000 - 350,000
Digital IC Design Engineer | EP
Digital IC Design Engineer | EP

118-WW TMG MFG OPS • Dallas (TX)

On-site
USD 120,000 - 180,000
Chip Design Engineer
Chip Design Engineer

TenX Semi • San Francisco (CA)

Hybrid
USD 140,000 - 210,000
Senior RTL Engineer, IO Die and Interconnect IP
Senior RTL Engineer, IO Die and Interconnect IP

Samsung Semiconductor • San Jose (CA)

On-site
USD 138,000 - 206,000
4+ weeks PTO
Onsite café and gym
Flexible work environment
+2