Senior Radio Frequency Engineer (Contingent)

KIHOMAC

Oklahoma City (OK)

On-site

USD 135,000 - 150,000

Full time

7 days ago
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Benefits offered by this job

Health Care Plan
Retirement Plan
Life Insurance
Paid Time Off
Disability Insurance
Training & Development
Wellness Resources

Job summary

KIHOMAC seeks an experienced RF power amplifier engineer to lead the redesign of high‑power amplifier assemblies and to drive measurements and validation for radar‑grade systems. You will develop correlated RF and thermal models, select and bias devices (BJT/LDMOS/GaN), and ensure tight traceability from requirements to verification.

The role requires 8+ years in RF amplification for high‑power pulsed applications, MBSE proficiency (Cameo), and strict EMI/EMC and MIL‑STD‑810/461 compliance. U.S.

Qualifications

  • 8+ years experience designing, testing, and qualifying RF power amplifiers for radar or high-power pulsed applications (L-band preferred).
  • Hands-on experience with BJT/LDMOS/GaN device selection, biasing, matching networks, and microstrip layout.
  • Proficiency building high-fidelity RF and thermal models (e.g., Ansys HFSS/Icepak) and correlating to measured data.
  • Requirements engineering using MBSE tools (e.g., Cameo).
  • Authoring System/Subsystem Specifications and Interface Control Specifications.
  • EMI/EMC planning and pre-qualification per MIL-STD-461; environmental and ESS testing per MIL-STD-810.

Responsibilities

  • Lead High Power Amplifier Circuit Card Assembly redesigns for form-fit-function interface compatibility.
  • Plan and execute measurements; derive baseline parameters (gain, impedance, output power).
  • Develop correlated RF/thermal models; evaluate device topologies and networks.
  • Author MBSE requirements; produce SSS and ICs with full traceability.
  • Own EMI/EMC and environmental planning; define fixtures and pre-qualification.
  • Prepare SRR/PDR with Government stakeholders; capture minutes and RAID updates.
  • Coordinate U.S. vendor surveys; manage NDAs and supplier inputs on risks.
  • Collaborate with Program Management to maintain PMP/IMS; report status and mitigations.
  • Mentor team members; uphold engineering rigor and documentation quality.
  • Other duties as assigned.

Skills

RF Power Amplifier Design
Device selection (BJT/LDMOS/GaN)
RF & Thermal Modeling
MBSE & Cameo
Specifications & Interface Control
EMI/EMC planning

Education

Bachelor’s Degree in relevant engineering or science discipline
Master’s degree preferred

Tools

Ansys HFSS
Icepak
Cameo

Job description

  • Lead High Power Amplifier Circuit Card Assembly redesign to achieve strict Form‑Fit‑Function‑Interface compatibility
  • Plan and execute measurements of GFP/GFI hardware; derive and verify baseline parameters (gain/flatness, impedance/VSWR, output power, spectral purity, pulse shape/timing)
  • Develop correlated RF and thermal simulation models; evaluate device topologies (BJT/LDMOS/GaN) and output combining networks
  • Author and maintain requirements in MBSE; produce SSS and ICs with full traceability to sources and verification methods
  • Own EMI/EMC and environmental planning; define fixtures and pre‑qualification per applicable standards
  • Prepare and lead SRR/PDR with Government stakeholders; capture minutes, actions, and update RAID log
  • Coordinate U.S. vendor market survey; manage NDAs; integrate supplier inputs on risks, manufacturability, and prototype ROM
  • Collaborate with program management to maintain PMP and IMS; report status, risks, and mitigations
  • Mentor team members; uphold engineering rigor and documentation quality
  • Other duties as assigned

This position is contingent upon contract award.

Education/Training:
  • Bachelor’s Degree in relevant engineering or science discipline required
  • Master’s degree preferred
Experience:
  • 8+ years experience designing, testing, and qualifying RF power amplifiers for radar or high‑power pulsed applications (L‑band preferred)
  • Hands‑on experience with BJT/LDMOS/GaN device selection, biasing, matching networks, and microstrip layout
  • Proficiency building high‑fidelity RF and thermal models (e.g., Ansys HFSS/Icepak) and correlating to measured data
  • Requirements engineering using MBSE tools (e.g., Cameo)
  • Authoring System/Subsystem Specifications and Interface Control Specifications
  • EMI/EMC planning and pre‑qualification per MIL‑STD‑461; environmental and ESS testing per MIL‑STD‑810
Security:
  • Must be a US citizen
  • If selected candidate does not have an active Clearance at level Secret or higher, one will be obtained upon hire
Physical Requirements:
  • Able to occasionally reach with hands and arms
  • Prolonged periods of computer screen use, while sitting or standing at a desk
  • Adhere to safety protocols when in work areas requiring use of PPE (e.g. eyewear, gloves, masks, hearing protection, steel toed shoes, etc.)
  • Able to safely lift and carry up to 20 pounds at a time
  • Health Care Plan (Medical, Dental & Vision)
  • Retirement Plan (401k, IRA)
  • Life Insurance (Basic, Voluntary & AD&D)
  • Paid Time Off (Vacation, Sick & Public Holidays)
  • Short Term & Long Term Disability
  • Training & Development
  • Wellness Resources
Salary:

$135,000 - $150,000

Salary rates for this position are competitive and commensurate with experience and industry standards. We offer a comprehensive benefits package that may include health insurance, paid time off, and retirement savings options.

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