Senior Process Engineer - Thin-Film Deposition

Applied Materials, Inc.; Santa Clara (CA); On-site; USD 124,000 - 171,000; Full time

Job summary

Applied Materials, Inc. is seeking a Process Engineer III in Santa Clara to lead development of 300 mm chamber processes and surface treatments for advanced logic interconnects.

You will own experiments end-to-end, coordinate with hardware teams, and push technology from feasibility to qualification. The role requires PhD or MS with relevant experience, hands-on thin-film deposition or plasma processing, and strong communication.

Qualifications

• PhD or MS with semiconductor-related experience in academia or industry.
• Hands-on deposition or plasma processing experience required.
• Strong written and verbal communication skills essential.

Responsibilities

• Own experiments end to end from DOE design to results and recommendations.
• Develop and optimize deposition and plasma-based processes to meet film targets.
• Characterize films using standard metrology and relate processing to properties.
• Collaborate with mechanical, electrical, and RF teams on hardware requirements and test plans.
• Support hardware bring-up, chamber qualification, and troubleshooting with data-driven analysis.
• Plan multiple experiment tracks in parallel to optimize tool time.
• Communicate results to cross-functional teams and management.

Skills

DOE design

Data analysis

Wafer runs

Metrology

Problem solving

Cross-functional communication

Education

PhD in Chemistry, Chemical Engineering, Materials Science, Physics, Electrical Engineering, or related field

MS in a related field with 2–5 years experience

Tools

Thin-film deposition equipment

Plasma processing equipment

Metrology instruments

Job description

Applied Materials, Inc. is seeking a Process Engineer III in Santa Clara to lead development of 300 mm chamber processes and surface treatments for advanced logic interconnects.

You will own experiments end-to-end, coordinate with hardware teams, and push technology from feasibility to qualification. The role requires PhD or MS with relevant experience, hands-on thin-film deposition or plasma processing, and strong communication.