Senior Process Engineer

Elbit America, Inc. in; Fort Worth (TX); On-site; USD 110,000 - 140,000; Full time

Benefits offered by this job

9/80 schedule

401(k) program

Medical, dental, vision coverage

Life Insurance

Paid PTO

Parental leave

Employee referral program

Voluntary benefits

Tricare supplement

Job summary

Elbit America is seeking a Senior Process Engineer to lead manufacturing improvements for circuit card assemblies in a defense environment. Expertise in SMT, soldering, and through-hole processes is required to ensure quality, cost, and on-time delivery.

You will drive process development, implement SPC, and lead cross-functional collaboration with Design Engineering and Supply Chain to optimize products and materials under stringent military standards.

Qualifications

• A bachelor's degree in mechanical, electrical, manufacturing engineering, or related field; Master’s preferred.
• Minimum 6+ years in relevant electronics manufacturing/process engineering.
• Strong knowledge of IPC/J-STD-001 and defense/aerospace requirements.

Responsibilities

• Design, implement, and optimize circuit card assembly processes (SMT, wave soldering, conformal coating).
• Develop and maintain process documentation, work instructions, and SOPs.
• Ensure compliance with IPC-A-610, J-STD-001, MIL standards; drive CAPA actions.
• Apply Lean, Six Sigma, and root cause analysis to reduce defects and improve yield.
• Provide hands-on support; train operators/technicians on best practices.
• Collaborate with Design Engineering to ensure manufacturability; assist Supply Chain on specs.
• Monitor key metrics and implement SPC for critical processes.

Skills

Soldering & SMT

AOI & inspection

Lean Six Sigma

Process development

Cross-functional leadership

Data analysis

CAD tooling

Education

Bachelor's degree in mechanical, electrical, manufacturing engineering

Master's degree preferred

Tools

FUJI pick and place

Koh Young 3D SPI/AOI

Conformal coating equipment

Wave soldering

Job description

The Senior Process Engineer will lead and optimize manufacturing processes for circuit card assemblies (CCA) within a defense industry environment. This role ensures compliance with stringent military and aerospace standards while driving continuous improvement in quality, cost, and delivery. The Engineer will have deep expertise in electronics manufacturing, including soldering, SMT (Surface Mount Technology), and through-hole assembly processes.

Responsibilities and Tasks:

• Process Development & Optimization: Design, implement, and improve processes for circuit card assembly, including SMT, wave/selective soldering, bonding/staking, and conformal coating. Develop and maintain process documentation, work instructions, and standard operating procedures.
• Quality & Compliance: Ensure adherence to IPC-A-610, J-STD-001, and MIL standards for defense electronics. Collaborate with Quality Assurance to resolve non-conformances and implement corrective actions.
• Continuous Improvement: Utilize Lean, Six Sigma, and root cause analysis to reduce defects and improve yield. Drive automation and advanced manufacturing techniques for efficiency gains.
• Technical Support: Provide hands‑on support to production teams for troubleshooting and process‑related issues. Train operators and technicians on best practices and new technologies.
• Cross‑Functional Collaboration: Work closely with Design Engineering to ensure manufacturability of new products. Support Supply Chain and Procurement in evaluating component and material specifications.
• Data Analysis & Reporting: Monitor key process metrics and generate reports for management. Implement SPC (Statistical Process Control) for critical processes.

Education, Experience/Knowledge & License/Certification:

• A bachelor's degree in mechanical, electrical, manufacturing engineering, or related field (Master's preferred), with a minimum 6+ years of relevant experience or equivalent experience: minimum 10+ years of hands‑on experience in electronics manufacturing and process engineering, specifically in circuit card assembly, may be considered in lieu of a degree.
• Strong knowledge of IPC standards (IPC-A-610, J-STD-001) and defense/aerospace requirements.
• Proficiency in SMT equipment, soldering techniques, and automated optical inspection (AOI).
• Experience with Lean Manufacturing, Six Sigma, and process validation.
• Familiarity with ERP/MES systems and data‑driven decision‑making.
• Proven ability to evaluate, select, and implement advanced automation technologies in manufacturing environments.

Skills and Abilities:

• Skilled in operating/programming/troubleshooting FUJI pick and place machines or similar high‑speed/high‑precision platforms.
• Proficient in programming Koh Young 3D SPI and AOI inspection systems.
• Strong understanding of the wash process required for circuit cards in the aerospace industry.
• Experience with conformal coating, potting, and ruggedization for defense applications.
• Knowledge of thermal profiling and reflow soldering optimization.
• Ability to lead cross‑functional teams and manage multiple projects simultaneously.
• Proficiency in CAD tools for process and fixture design.

Travel/Physical Requirements:

• Must be a U.S. citizen
• Must be eligible to obtain and maintain a U.S. Government security clearance.

Senior Process Engineer (Finance)

Job Summary:

The Senior Process Engineer will lead and optimize manufacturing processes for circuit card assemblies (CCA) within a defense industry environment. This role ensures compliance with stringent military and aerospace standards while driving continuous improvement in quality, cost, and delivery. The Engineer will have deep expertise in electronics manufacturing, including soldering, SMT (Surface Mount Technology), and through‑hole assembly processes.

Responsibilities and Tasks:

• Process Development & Optimization: Design, implement, and improve processes for circuit card assembly, including SMT, wave/selective soldering, bonding/staking, and conformal coating. Develop and maintain process documentation, work instructions, and standard operating procedures.
• Quality & Compliance: Ensure adherence to IPC‑A‑610, J‑STD‑001, and MIL standards for defense electronics. Collaborate with Quality Assurance to resolve non‑conformances and implement corrective actions.
• Continuous Improvement: Utilize Lean, Six Sigma, and root cause analysis to reduce defects and improve yield. Drive automation and advanced manufacturing techniques for efficiency gains.
• Technical Support: Provide hands‑on support to production teams for troubleshooting and process‑related issues. Train operators and technicians on best practices and new technologies.
• Cross‑Functional Collaboration: Work closely with Design Engineering to ensure manufacturability of new products. Support Supply Chain and Procurement in evaluating component and material specifications.
• Data Analysis & Reporting: Monitor key process metrics and generate reports for management. Implement SPC (Statistical Process Control) for critical processes.

Education, Experience/Knowledge & License/Certification:

• A bachelor's degree in mechanical, electrical, manufacturing engineering, or related field (Master's preferred), with a minimum 6+ years of relevant experience or equivalent experience: minimum 10+ years of hands‑on experience in electronics manufacturing and process engineering, specifically in circuit card assembly, may be considered in lieu of a degree.
• Strong knowledge of IPC standards (IPC‑A‑610, J‑STD‑001) and defense/aerospace requirements.
• Proficiency in SMT equipment, soldering techniques, and automated optical inspection (AOI).
• Experience with Lean Manufacturing, Six Sigma, and process validation.
• Familiarity with ERP/MES systems and data‑driven decision‑making.
• Proven ability to evaluate, select, and implement advanced automation technologies in manufacturing environments.

Skills and Abilities:

• Skilled in operating/programming/troubleshooting FUJI pick and place machines or similar high‑speed/high‑precision platforms.
• Proficient in programming Koh Young 3D SPI and AOI inspection systems.
• Strong understanding of the wash process required for circuit cards in the aerospace industry.
• Experience with conformal coating, potting, and ruggedization for defense applications.
• Knowledge of thermal profiling and reflow soldering optimization.
• Ability to lead cross‑functional teams and manage multiple projects simultaneously.
• Proficiency in CAD tools for process and fixture design.

Travel/Physical Requirements:

• Must be a U.S. citizen
• Must be eligible to obtain and maintain a U.S. Government security clearance.

#LI-SW1 Here Are Some of the Great Benefits We Offer:

• Most locations offer a 9/80 schedule, providing every other Friday off
• Competitive compensation & 401(k) program to plan for your future
• Robust medical, dental, vision, & disability coverage with qualified wellness discounts
• Basic Life Insurance and Additional Life & AD&D Insurances are available
• Flexible Vacation & PTO
• Paid Parental Leave
• Generous Employee Referral Program
• Voluntary Benefits Available: Longer Term Care, Legal, Identity Theft, Pet Insurance, and more
• Voluntary Tricare Supplement available for military retirees

This job description does not list all the duties of the job. You may be asked by your supervisors or managers to perform other duties. The employer has the right to revise this job description at any time. The job description is not an employment contract. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions of this position. Elbit America is an equal opportunity employer as to all protected groups, including protected veterans and individuals with disabilities.