Senior PCB DFx Engineer – HDI, RF & High-Reliability

Viasat

Tempe (AZ)

Hybrid

USD 142,000 - 264,000

Full time

10 days ago

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Job summary

Viasat in the United States is seeking a technical leader for Operations Engineering focused on PCB materials, DFx, and fabrication technologies for high-reliability space and defense programs. You will partner with design, manufacturing, quality, program, and suppliers to ensure robust, manufacturable PCB designs.

The role requires 10+ years in PCB fabrication, IPC standards expertise, and DoD clearance or ability to obtain.

Qualifications

10+ years' experience in PCB fabrication, PCB technology, DFx, or PCB manufacturing engineering.
HDI fabrication, micro-vias, sequential lamination, controlled impedance, RF materials, high reliability PCB knowledge.
Familiarity with IPC-2221/2222, IPC-601X, IPC-A-600, IPC-A-610, J-STD-001.
Experience with aerospace/defense/space hardware programs is a plus.
US Government position; US Citizenship required; ability to travel up to 20%.

Responsibilities

Guide in HDI, RF/microwave, high-speed digital, rigid-flex, and high-reliability PCB technologies.
Review stack-ups, materials, impedance, vias, drawings, and manufacturing specs.
Lead PCB Design for Fabrication reviews from concept through production.
Collaborate with global PCB fabrication suppliers to optimize yield, quality, cost, and schedule.
Drive root-cause investigations and corrective actions for fabrication and reliability issues.
Develop and maintain PCB design guidelines, standards, and procedures.
Support multiple concurrent development programs and critical design reviews.