Senior Packaging PM for Global Device Launches

Amazon; San Francisco (CA); On-site; USD 156,000 - 212,000; Full time

Job summary

Amazon.com Services LLC in Sunnyvale, CA, seeks a Senior Packaging Engineering Program Manager to drive end-to-end packaging strategy for devices, including BOM management, compliance, POD labeling, and on-schedule launches.

You will partner with Packaging Engineering, Industrial Design, Marketing, Legal/Compliance, Operations, and Hardware TPMs to align timelines, resolve trade-off decisions, and deliver scalable packaging solutions across global product introductions.

Qualifications

• 9+ years of design experience
• Experience working with stakeholders to plan and execute programs that are strategic in nature
• Ability to travel domestically and internationally

Responsibilities

• Define and manage the end-to-end packaging development schedule, ensuring on-time delivery of milestones from concept through production readiness.
• Drive packaging structure alignment across cross-functional teams, facilitating timely decisions and stakeholder consensus.
• Define, implement, and ensure accurate application of compliance‑related content across all packaging deliverables.
• Lead Print On Demand (POD) labeling support and execution, ensuring quality and on-time delivery.
• Develop and execute packaging strategies supporting global product launches and regional market expansion.
• Identify and implement process improvements and scalable mechanisms that increase efficiency and mitigate risk across packaging deliverables.
• Coordinate resources and engage stakeholders to maintain schedule integrity across concurrent programs.
• Proactively identify risks to packaging timelines and drive resolution through clear escalation and communication.

Job description

Amazon.com Services LLC in Sunnyvale, CA, seeks a Senior Packaging Engineering Program Manager to drive end-to-end packaging strategy for devices, including BOM management, compliance, POD labeling, and on-schedule launches.

You will partner with Packaging Engineering, Industrial Design, Marketing, Legal/Compliance, Operations, and Hardware TPMs to align timelines, resolve trade-off decisions, and deliver scalable packaging solutions across global product introductions.