Senior Optical Packaging & CPO Tech Lead

Flint Hills Resources; Bridgewater, Fremont (MA, CA); On-site; USD 160,000 - 220,000; Full time

Benefits offered by this job

Medical

Dental

Vision

Flexible spending and health savings

Life insurance

Disability

Retirement

Paid vacation/time off

Educational assistance

Infertility assistance

Paid parental leave

Adoption assistance

Job summary

Molex, a Koch company, seeks an experienced senior optical engineer to lead technology development for co-packaged optics (CPO). The role combines hands-on optical packaging with project management and cross-functional leadership across global sites and vendors.

You will drive packaging R&D, plan feasibility studies and DOE, mentor engineers, and push manufacturable solutions toward production while traveling domestically and internationally as required.

Qualifications

• Master’s degree or higher in Optical Engineering, Physics, Electrical Engineering, Materials Science, or related field.
• Minimum 10 years of industry experience in optical packaging, SiPh packaging, or semiconductor laser/device packaging with strong process engineering background.
• Hands-on experience in optical device packaging: die attach, adhesives, wire bonding, optical fiber management, optical alignment, materials selection.
• Strong knowledge of semiconductor wafer processes and interactions with packaging (e.g., thermal budgets, contamination control).
• Proven track record leading technology development projects and cross-functional/global teams.
• Excellent communication and people management skills; experience managing vendors and supplier qualification.
• Willingness and ability to travel as required (domestic and international travel).
• SiPh (silicon photonics) packaging and integration processes.
• Experience in process development and optimization related to optical devices.
• Optical fiber knowledge: theory, handling, cleaving, splicing, ferrule/array assembly, fiber pigtail techniques.
• Die attach processes, bonding materials (solders, adhesives), curing processes, and reliability implications.
• Thermal analysis and mechanical/stress analysis for packages.
• Materials science for packaging: coefficient of thermal expansion (CTE) mismatch mitigation, adhesives, and underfills.
• Wire bonding and alternative electrical interconnects; knowledge of flip-chip and other interconnect technologies.
• Familiarity with reliability testing standards (thermal cycling, HTOL, moisture, mechanical shock/vibration).

Responsibilities

• Lead technology development activities for CPO and associated optical packaging solutions.
• Define and execute packaging solutions R&D: die attach, adhesive selection, wire bonding, fiber attach, alignment, thermal and stress considerations, and material qualification.
• Plan and run feasibility studies, design-of-experiments (DOE), pilot builds, and reliability testing.
• Project and technical management (planning, schedules, budgets, risk management, vendor coordination).
• Manage and lead cross-functional teams (design, manufacturing, reliability, supply chain, quality) and collaborate with global sites/vendors.
• Hands-on lab/bench work: prototyping, process setup, process optimization, optical fiber handling, optical alignments, test automation, and test integration.
• Identify process/packaging yield drivers, implement corrective actions, and scale technologies toward production.
• Prepare technical documents, reports, presentations, and interact with external partners and suppliers.
• Mentor junior engineers and build team capabilities.

Skills

Leadership

Communication

Problem solving

Collaboration

Planning & Execution

Education

Master’s degree or higher in Optical Engineering, Physics, Electrical Engineering, Materials Science

Job description

Molex, a Koch company, seeks an experienced senior optical engineer to lead technology development for co-packaged optics (CPO). The role combines hands-on optical packaging with project management and cross-functional leadership across global sites and vendors.

You will drive packaging R&D, plan feasibility studies and DOE, mentor engineers, and push manufacturable solutions toward production while traveling domestically and internationally as required.