Senior Module Development Engineer

Intel Corporation

Hillsboro (OR)

On-site

USD 134,000 - 220,000

Full time

4 days ago
Be an early applicant

Get a reply from this employer

Your resume and cover letter, tailored to exactly what they’re hiring for.

Get past ATS filters

Benefits offered by this job

Stock bonuses
Health benefits
Retirement plan
Vacation

Job summary

Intel Corporation's Advanced Packaging Technology Development (APTD) Metrology Group seeks a Senior Module Development Engineer to advance metrology equipment and measurement strategy. You will bridge hands-on tool work with strategic roadmapping, ensuring readiness before processes lock and risks emerge.

You will own end-to-end tool qualification, support fab operations, and collaborate with AI and process-control teams to drive predictive monitoring and excellence across multiple packaging

Qualifications

  • Bachelor’s degree in STEM with 6+ years of relevant experience.
  • Master’s degree in related fields with 4+ years of relevant experience.
  • PhD in related fields with 2+ years of relevant experience.
  • Expertise in semiconductor processing, wafer-level assembly, or cleanroom environments.
  • Proficiency in process development methodologies, SPC, and manufacturing process improvement.
  • Technical expertise in module engineering or fab process/hardware technology development.

Responsibilities

  • Drive technology development and enablement across high-volume manufacturing and future nodes.
  • Lead the design and development of sophisticated metrology and inspection processes.
  • Define and own the long-range technology roadmap for metrology.
  • Perform pathfinding activities to support process and hardware development.
  • End-to-end qualification of metrology equipment from install to fab readiness.
  • Serve as the primary technical resource for fab support and tool fleet performance.
  • Recommend and implement equipment and process modifications to improve efficiency.
  • Collaborate with suppliers to co-develop tool capabilities and roadmaps.
  • Stay current on industry trends and forecast future technology needs.
  • Lead metrology module development across concurrent programs.

Skills

Metrology fundamentals
Cross-functional collaboration
Python
Scripting
Dashboard creation

Education

Bachelors in STEM
Masters in STEM
PhD in STEM

Tools

Python
Dashboard creation
Scripting

Job description

Job Details:
Job Description:

The Advanced Packaging Technology Development (APTD) Metrology Group at Intel sits at the heart of our most critical technology development and pathfinding programs. As packaging architectures grow increasingly complex, the role of metrology has evolved far beyond traditional inspection and measurement — it has become astrategic enablerof technology progress, yield learning, and program decision-making confidence.

We are seeking aSenior Module Development Engineerwho combines deep hands-on expertise in next-generation metrology equipment with a broad, current awareness of where the semiconductor metrology industry is heading. The ideal candidate brings the technical credibility to work at the equipment level and the strategic clarity to translate industry knowledge into a forward-looking roadmap that keeps our capabilities ahead of program demand. This requires genuine engagement with the global metrology landscape — staying current with advances in measurement science, emerging equipment capabilities, and evolving industry standards — and applying that knowledge with sound judgment and determine which capabilities are worth pursuing and when.

This engineer will be embedded in our most advanced development and pathfinding programs from their earliest stages — ensuring that measurement strategies are defined, equipment is ready, and metrology coverage is in place before process flows are locked and before gaps can become program risks. A critical dimension of this role is theend-to-end qualification of new metrology equipment— taking ownership from initial tool installation and acceptance testing through process validation and full fab readiness — ensuring every new tool meets the performance and capability standards our programs require. This engineer will also serve as akey technical resource for fab support, and ensuring the metrology tool fleet consistently operates at the highest level of performance and availability. The ability to move fluidly between strategic roadmap work and hands-on fab problem solving is essential — and is what makes this role both uniquely challenging and uniquely rewarding.

This is a role that demandstechnical depth, industry awareness, and the ability to lead with influenceacross a wide range of partners — from process integration and module engineering to advanced process control, AI and automation, and senior program leadership. The ideal candidate resolves complex process challenges with the same confidence and credibility they bring to presenting a technology investment case to senior leadership.

Key Responsibilities:
  • Drivetechnology development and enablementacross both high-volume manufacturing and future technology nodes — delivering process integration and equipment solutions that meet desired device specifications and performance targets

  • Lead the design and development oftechnically sophisticated metrology and inspection processes including material selection, parameter optimization, equipment configuration, and system design to enable new product architectures and functional requirements

  • Define and own the metrology group’slong-range technology roadmaptranslating a deep understanding of industry trends, emerging measurement technologies, and program requirements into a clear, prioritized strategy that keeps our capabilities ahead of demand

  • Performpathfinding activitiesin support of process and hardware development enabling the manufacturing of innovative device architectures and developing roadmaps for technologies that support future program needs.

  • Conductprocess technology feasibility studiesthrough theoretical simulations and practical engineering methods providing early, evidence-based assessments of new measurement approaches before committing to full qualification Evaluate and qualifynext-generation metrology and inspection equipmentend-to-end — from installation and acceptance testing through process validation and full fab readiness — ensuring every new tool meets the performance and capability standards our programs require.

  • Serve as theprimary technical resource for fab support— providing engineering disposition on process excursions, driving resolution of metrology-related program holds, and maintaining the tool fleet at the highest level of performance and availability.

  • Recommend and implementequipment and process modificationsthat improve production efficiency, optimize output, and enhance manufacturing techniques for both existing and next-generation products.

  • Partner withkey equipment and materials suppliersto develop and implement enabling elements of the technology — building direct technical relationships that go beyond standard supplier engagement to actively co-shape next-generation tool capabilities and roadmaps.

  • Remain current onrelevant industry process, materials, and metrology trends— developing a forward-looking view of future technology needs and partnering with the vendor ecosystem to build a cost-sensitive, capability-driven roadmap that pushes the industry forward.

  • Leadmetrology module developmentacross multiple concurrent advanced packaging programs — taking full ownership from first wafer through process sign-off, including recipe development, specification setting, SPC strategy, and sampling plan definition.

  • Design and implementrapid inline feedback mechanismsthat compress the time between experiment execution and actionable insight — directly accelerating cycles of learning across TD and pathfinding programs.

  • Collaborate with AI, machine learning, and advanced process control teams to developintelligent monitoring and excursion detection strategies— evolving from threshold-based alarms toward predictive, context-aware process control.

  • Represent the metrology group incross-functional program reviews— communicating metrology readiness, capability status, and risk with clarity and credibility to integration, process, and senior program leadership teams

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

  • Bachelor’s degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Chemistry, or related STEM field with 6+ years of relevant experience.

  • OR Master’s degree in the same fields with 4+ years of relevant experience.

  • OR PhD in the same fields with 2+ years of relevant experience.

  • Expertise in semiconductor processing, wafer-level assembly, or cleanroom environments.

  • Proficiency in process development methodologies, statistical process control, and manufacturing process improvement.

  • Technical expertise in module engineering or fab process/hardware technology development.

Preferred Qualifications

  • Strong metrology fundamental understanding and development experience.

  • Strong collaboration skills with cross-functional teams, including yield and operations.

  • Demonstrated ability to leverage data analysis tools for process optimization and continuous improvement.

  • Experience with packaging processes, equipment automation development, or project management.

  • Passionate about advancing Intel’s strategic goals and driving meaningful industry advancements.

  • Experience in Python, Dashboard Creation, and Scripting

  • Direct experience engaging with metrology equipment vendors at a technical roadmap level as a co-development partner

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-219,550.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Module Development Defect Metrology Engineer
Module Development Defect Metrology Engineer

Intel Corporation • Hillsboro (OR)

On-site
USD 156,000 - 220,000
Stock bonuses
Health benefits
Retirement plan
+1
Module Development Engineering Manager
Module Development Engineering Manager

Intel Corporation • Hillsboro (OR)

On-site
USD 134,000 - 220,000
Stock bonuses
Health benefits
Retirement plan
+1
C4/FBE Metro Module Engineer in WPM Organization
C4/FBE Metro Module Engineer in WPM Organization

Intel Corporation • Rio Rancho (NM)

On-site
USD 76,000 - 146,000
Advanced Packaging Module Development Engineer
Advanced Packaging Module Development Engineer

Intel Corporation • Hillsboro (OR)

On-site
USD 134,000 - 255,000
C4 Metrology Engineer
C4 Metrology Engineer

100 Intel Corporation • Rio Rancho (NM)

Hybrid
USD 104,000 - 171,000
NM Wafer Packaging Manufacturing: Advanced Packaging Module Engineer
NM Wafer Packaging Manufacturing: Advanced Packaging Module Engineer

Intel Corporation • Albuquerque (NM)

On-site
USD 76,000 - 146,000
C4 Metrology Engineer
C4 Metrology Engineer

Intel Corporation • Albuquerque (NM)

Hybrid
USD 104,000 - 171,000
Stock bonuses
Health benefits
Retirement plan
+1
•Senior Packaging Module Development Engineer
•Senior Packaging Module Development Engineer

Intel Corporation • Phoenix (AZ)

Hybrid
USD 134,000 - 255,000
Stock bonuses
Health benefits
Vacation
Intel Foundry Module Development Engineer - CMP
Intel Foundry Module Development Engineer - CMP

Intel Corporation • Hillsboro (OR)

Hybrid
USD 134,000 - 255,000
Stock bonuses
Health plans
Hybrid work model
Advanced Packaging TD Plating Module Engineer
Advanced Packaging TD Plating Module Engineer

Intel Corporation • Oregon

On-site
USD 134,000 - 255,000
Competitive pay and stock bonuses
Health, retirement, and vacation benefi
Intel culture and growth opportunities