Senior Mechanical Engineer

Global Outsourcing; Woburn (MA); On-site; USD 85,000 - 110,000; Full time

Job summary

An innovative technology consulting firm in Woburn, Massachusetts, seeks a Mechanical Engineer with extensive experience in embedded electronic product design. The role involves collaboration with hardware and thermal design teams, optimizing layouts for electronic systems, and reporting project progress. Candidates should possess at least 5 years of experience and a degree in Mechanical Engineering. A self-motivated individual is ideal, capable of leading at a technical level while interacting with remote teams.

Qualifications

• 5+ years of experience in electronics packaging, design, and testing.
• Experience in embedded product design.
• Ability to work independently and in teams.

Responsibilities

• Liaise with design engineers to optimize board layout.
• Maintain awareness of new technologies.
• Report project progress to the Engineering Director.

Skills

Solid modelling

Mechanical component design

Interface with design teams

Familiarity with standard form factors

Shock and vibration testing

Technical team leadership

Self-motivated

Ability to interact with remote teams

Education

BS or MS in Mechanical Engineering

Job description

GISS Systems has been a leader in information technology consulting. GISS mission is to deliver results for its many Global clients through the design, development and implementation of leading edge enterprise technology solutions. GISS relentless focus on delivering results for its clients has made it one of the fastest growing companies in United States since its founding.

Job Description

Job Summary:

• · Liaising with the hardware, thermal and PCB design engineers to agree optimal layout and construction of theboards.
• · Maintaining awareness of new technologies.
• · Reporting to the Engineering Director on project progress.

Required Education, Skills and Experience:

• · In depth knowledge of solid modelling, drawing, tolerances (GD&T), and change control processes.
• · Design of small or precision mechanical components for high complexity densely packed embedded boardlevel electronic sub-systems or similar environments.
• · Ability to interface well with remote design teams.
• · Familiarity with standard form factor designs, e.g. Open VPX (3U and 6U) or VME.
• · Familiarity with shock and vibration testing in general, or of electronic board level systems in particular.
• · Experience of team leading at a technical level.
• · In addition to technical skills, the candidate must be independent and self-motivated but also be able to interactwith other engineers both locally and overseas.
• · It is likely that the role will involve occasional travel to the UK,though this is unlikely to be frequent or for long periods.

Qualifications

Mechanical
Engineering graduates (BS or MS), able to demonstrate practical post
graduateinvolvement in embedded electronic product design.

Additional Information

Required Education

Minimum of 5 years of electronics packaging experience designing, developing,
documenting and testingboard level and chassis level products.