Senior Mechanical Engineer

advantestcareers

Lake Forest (CA)

On-site

USD 110,000 - 180,000

Full time

11 days ago
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Job summary

Advantest Test Solutions, Inc. in Lake Forest, CA is seeking a Sr. Mechanical Engineer to design, test, and evaluate hardware sub-systems for semiconductor handling and testing equipment, including co-packaged optics.

You will develop detailed designs, create drawings, and collaborate on product development with cross-functional teams. The role requires 6–10+ years in electro-mechanical systems, proficiency in SolidWorks, GD&T, FEA, and experience with high-precision testing and thermal

Qualifications

  • BS degree in Mechanical Engineering or related field.
  • 6–10+ years of electro-mechanical design experience.
  • Experience with closed-loop motion control hardware.
  • Proficient in SolidWorks and ASME Y14.5 GD&T.
  • Experience with CAD-based FEA for part optimization.
  • Knowledge of thermal dynamics and CFD for airflow/thermal analysis.
  • On-site role in Lake Forest, CA.

Responsibilities

  • Design electro-mechanical assemblies to meet customer specs.
  • Create detailing drawings, assembly drawings and BOMs.
  • Identify technical risks and opportunities for optimization.
  • Present designs during internal design reviews.
  • Develop test specifications and evaluation protocols.
  • Perform electro-mechanical hardware testing and qualification.
  • Collaborate with manufacturing, QA and suppliers.
  • Work with external partners to meet product goals.
  • Support cross-functional design reviews and testing.

Skills

Cross-functional collaboration
Mechanical design
Thermal management
Vibration testing
Project leadership

Education

BS in Mechanical Engineering

Tools

SolidWorks
GD&T (ASME Y14.5)
FEMA/FEA CAD tools

Job description

Sr. Mechanical Engineer

Advantest Test Solutions, Inc. (ATS) is looking for a senior level Mechanical Engineer. This individual will perform a broad range of mechanical engineering functions related to the design, testing, and evaluation of hardware sub-systems for handling and testing electronic systems including semiconductors, embedded devices and co-packaged optics (CPO) devices. Develop and execute the detail design on new and/or modified existing designs in a fast-paced environment. Serve on product development team(s) and be assigned specific sub-assembly or sub-system mechanical design and testing responsibility. This role will require experience in electro-mechanical and automated systems, as can be found in leading semiconductor handlers and test systems.

Essential Duties and Responsibilities:

  • Design new and/or modify existing electro-mechanical assemblies to meet specific end customer requirements. Can include PCB Assys with multiple PCBs and heatsinks.
  • Complete all detail drawings, assembly drawings and Bills of Material for all initial manufacturing builds and eventual production level manufacturing.
  • Identify technical risk areas and optimization opportunities.
  • Present designs during internal Design Reviews.
  • Develop test specifications and evaluation protocols.
  • Perform electro-mechanical hardware, assembly and integration testing and final qualification testing.
  • Interpret functional test results and present findings to senior technical staff or vendors and customers.
  • Develop and implement mechanical design changes that are identified during testing or design verification review.
  • Develop new or modified test equipment, manufacturing and inspection jigs and fixtures, as required.
  • Work as part of a team that includes manufacturing, quality assurance and technical support organizations to establish functional specifications for components and to select vendors/suppliers for purchased parts, materials and assemblies.
  • Work closely with external Technology partners and successfully accomplishes common product design/ production goals.
  • All other duties as assigned.

Requirements, Education and Skills:

  • Requires a BS degree in Mechanical Engineering or similar.
  • Ideal candidates have 6 – 10+ years of experience, preferably in a high-technology environment.
  • Experience working in cross-functional teams that build complex electro-mechanical systems comprised of closed-loop motion control hardware, electrical and software components is required.
  • Experience in SolidWorks or similar 3D CAD system is required.
  • Experience in creating and interpreting mechanical detail and assembly drawings using ASME-Y14.5M GD&T standards is required.
  • Experience using CAD based FEA tools to check and optimize mechanical parts against structural requirements is required.
  • Experience in electronic packaging, testing and integrating thermal systems into automated equipment is also preferred.
  • Experience in failure prediction and analysis methods and processes like DFMEA, wishbone diagrams, 5 Whys or 8D Reports is required.
  • Knowledge of thermal dynamics and CFD experience may be required to perform air flow analysis or thermal analysis.
  • This is an on-site role in our Lake Forest, CA facility.

Additional Skills Preferred (but not required):

  • Experience with the architecting, design, certification and deployment of semiconductor capital equipment.
  • Experience with using PDM (MechWorks) Software tools to manage system hardware design configurations and documentation.
  • Experience with machine frame design and/or nineteen-inch electrical rack assembly design.
  • Experience using 3D printers to create fast prototype or demonstration parts and assemblies.
  • Contributed to the mechanical design and packaging of Co-Packaged Optics (CPO) modules, focusing on thermal management, EMI shielding, and optical alignment.
  • Participated in cross-functional design reviews involving mechanical, electrical, and thermal disciplines to meet performance and reliability targets.
  • Supported prototyping and testing of electro-mechanical assemblies, including load carrying performance, pressure distribution, environmental stress screening and vibration testing.
  • Collaborated with external partners to develop chillers, condenser units or HVAC systems.
  • Experience in semiconductor wafer handling, electrical device handling and/or factory automation equipment used in semiconductor device manufacturing or testing.
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