Senior Manager, Analog Eng — Lead Mixed-Signal ASICs

Renesas Electronics

Duluth (GA)

Hybrid

USD 185,000 - 225,000

Full time

14 days+

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Job summary

Renesas Electronics is seeking a Senior Manager Analog Engineering in the CMSD division to lead a team of analog designers from concept through product release. You will define specifications, architecture, and IP requirements, coordinating across verification, test, and product engineering to deliver configurable mixed-signal ASICs.

You will mentor your team, drive high-quality development practices, and collaborate with cross-functional groups to optimize performance, power, and die size while

Qualifications

  • MSEE with 15+ years in analog and mixed-signal design.
  • Excellent communication skills for global collaboration.
  • Coaching, mentoring, and development of team members.
  • Ability to develop system architectures and lead cross-functional programs.
  • Knowledge of AMS simulations and analog modelling.

Responsibilities

  • Lead a team of analog designers and act as the technical project lead from concept to market release.
  • Develop specifications and architecture with product/marketing to gain competitive advantage.
  • Define IP requirements and an integrated development plan for design, verification, and layout.
  • Oversee analog/mixed-signal verification plans and ensure quality through peer reviews.
  • Collaborate with test, qualification, and product engineering teams; mentor the team.

Skills

Leadership
Mentoring
Communication
System architecture
Cross-functional collaboration
AMS simulations knowledge

Education

MSEE

Job description

Renesas Electronics is seeking a Senior Manager Analog Engineering in the CMSD division to lead a team of analog designers from concept through product release. You will define specifications, architecture, and IP requirements, coordinating across verification, test, and product engineering to deliver configurable mixed-signal ASICs.

You will mentor your team, drive high-quality development practices, and collaborate with cross-functional groups to optimize performance, power, and die size while

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