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General Motors in Sunnyvale, CA is seeking a Senior Hardware Engineer to lead design and system integration of connectivity modules across GM vehicle platforms. You will define system architecture, drive schematic and PCB design, lead board bring‑up and ensure robust performance across operating conditions.
The role requires experience with SoC-based systems, power architecture, high-speed interfaces, and cross‑functional collaboration with silicon vendors, firmware and software teams.
Hybrid: This role is categorized as hybrid. The selected candidate is expected to report to Warren, MI or Sunnyvale, CA at least three days per week (Tuesday-Thursday).
At General Motors, our product teams are redefining mobility. Through a human-centered design process, we create vehicles and experiences that are designed not just to be seen, but to be felt. We're turning today's impossible into tomorrow's standard -from breakthrough hardware and battery systems to intuitive design, intelligent software, and next-generation safety and entertainment features. Every day, our products move millions of people as we aim to make driving safer, smarter, and more connected, shaping the future of transportation on a global scale.
Connectivity is a critical enabler of advanced vehicle functionality, including safety, user experience, and cloud-connected services. We are seeking a Senior Hardware Engineer to lead the design and system integration of next-generation automotive connectivity platforms across GM vehicle architectures. The ideal candidate has strong experience in hardware architecture, system bring‑up, and cross-functional integration of complex embedded systems combining high-performance compute and wireless connectivity. They are comfortable operating across hardware, firmware, and RF domains to drive system-level decisions and resolve complex issues.
The Senior Hardware Engineer will lead the design, architecture, and system integration of connectivity modules across GM vehicle platforms. This includes defining system architecture, driving schematic and PCB design execution, leading board bring‑up, and ensuring robust system performance across all operating conditions. This role requires end-to-end ownership, from concept through production, with strong collaboration across silicon vendors, RF, firmware, mechanical and thermal.
GM offers a variety of health and wellbeing benefit programs. Benefit options include medical, dental, vision, Health Savings Account, Flexible Spending Accounts, retirement savings plan, sickness and accident benefits, life insurance, paid vacation & holidays, tuition assistance programs, employee assistance program, GM vehicle discounts and more.
The compensation information is a good faith estimate only. It is based on what a successful applicant might be paid in accordance with applicable state laws. The compensation may not be representative for positions located outside of New York, Colorado, California, or Washington. The expected base compensation for this role is: $135,000 - $209,000. Actual base compensation within the identified range will vary based on factors relevant to the position. This role is categorized as hybrid. This means the selected candidate is expected to report to a specific location at least 3 times a week {or other frequency dictated by their manager}. The selected candidate will be required to travel <25% for this role. This job may be eligible for relocation benefits.
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