Senior FPGA & Digital Hardware Engineer for Imaging-Defense

Teledyne Technologies Incorporated; Wilsonville (OR); On-site; USD 120,000 - 180,000; Full time

Job summary

Teledyne FLIR Defense in the United States seeks a Senior Electrical Engineer who will be a hands-on contributor, developing complex digital hardware, PCB assemblies, and embedded electronics for imaging and sensing systems used in defense applications.

You will lead hardware design from concept to production, collaborate with cross-functional teams, perform bring-up and validation, and help define roadmaps for next‑generation thermal imaging and EO/IR sensing products.

Qualifications

• Bachelor's degree in Electrical Engineering or related field preferred.
• 5–10+ years in digital hardware design, embedded electronics, or PCB design.
• Experience with high-speed digital interfaces (PCIe, DDR3/DDR4, Ethernet, SERDES).
• Proven ability to design FPGA-based hardware platforms and complex systems.

Responsibilities

• Define hardware architectures from requirements and roadmaps.
• Design and validate PCB assemblies with embedded processors and FPGA devices.
• Lead bring-up, debugging, and testing of hardware in laboratory environments.
• Collaborate across Product, Software, Mechanical, and Manufacturing teams.
• Document specifications, test procedures, and manufacturing releases.

Skills

Digital hardware design

Embedded electronics

PCB design

FPGA design (AMD/Xilinx)

High-speed interfaces

Schematic capture

Troubleshooting

Team collaboration

Education

Bachelor's degree in Electrical Engineering

Tools

Altium Designer

AMD/Xilinx FPGA tools

Job description

Teledyne FLIR Defense in the United States seeks a Senior Electrical Engineer who will be a hands-on contributor, developing complex digital hardware, PCB assemblies, and embedded electronics for imaging and sensing systems used in defense applications.

You will lead hardware design from concept to production, collaborate with cross-functional teams, perform bring-up and validation, and help define roadmaps for next‑generation thermal imaging and EO/IR sensing products.