Senior Field Applications Engineer - Power ICs & Tapeout

GLOBALFOUNDRIES U.S. INC.; Santa Clara (CA); Sur place; USD 67 000 - 109 000; Plein temps

Résumé du poste

GlobalFoundries in Santa Clara seeks a Field Application Engineer to engage with Power technology customers early, assess technical needs, and identify GF solutions that drive DWIN and tapeout. You will collaborate across GF teams to craft compelling, application-specific presentations and support transitions from design to production.

The ideal candidate has 5+ years in semiconductor design/tapeout, strong knowledge of IC design flows for 22FDX/FinFET, and proven program management and

Qualifications

• Bachelor's or Master's degree in electrical engineering or equivalent (e.g. applied physics).
• Minimum 5 yrs in semiconductor design, tapeout and process.
• Strong knowledge of IC chip design flows and tools for BCD and 22FDX/FinFET technologies.
• Technical program management and cross-functional collaboration skills.
• Excellent English written & verbal communication.

Responsabilités

• Engage with customers to understand technical needs for semiconductor IC products.
• Assess competitive landscape and advocate GF value propositions.
• Collaborate with account managers, product marketing, and experts to craft compelling presentations.
• Merge technical and commercial terms into design-winning proposals.
• Identify and resolve issues to convert DWIN into tapeout.

Connaissances

Technical Program Management

Problem solving

Teamwork

Communication

Ownership

Formation

Bachelor's or Master's in Electrical Engineering

Outils

EDA tools

Description du poste

GlobalFoundries in Santa Clara seeks a Field Application Engineer to engage with Power technology customers early, assess technical needs, and identify GF solutions that drive DWIN and tapeout. You will collaborate across GF teams to craft compelling, application-specific presentations and support transitions from design to production.

The ideal candidate has 5+ years in semiconductor design/tapeout, strong knowledge of IC design flows for 22FDX/FinFET, and proven program management and