Senior Engineer, Process Engineering (Advance Packaging)

ASM International; Northern (KY); Hybrid; USD 110,000 - 160,000; Full time

Job summary

ASM International seeks a Senior Engineer, Process Engineering, to drive development and qualification of advanced thin film deposition solutions for semiconductor packaging. You will bridge customers, R&D, hardware engineering, and product management to accelerate technology adoption and growth.

The role requires a Master’s degree or higher in a related field and 7–10+ years of experience. Expect international collaboration, cross-functional work, and travel to support Asia-based customers.

Qualifications

• Master’s degree or higher in a relevant science or engineering field.
• 7–10+ years in thin film deposition equipment development or process engineering in semiconductor packaging.

Responsibilities

• Lead hardware and process qualification of thin film deposition equipment at customer sites.
• Develop and optimize plasma etching, cleaning, and thin film deposition processes for packaging.
• Execute customer demonstrations, process evaluations, and troubleshooting for high-value problems.
• Collaborate with customers across Asia to understand challenges and drive product adoption.
• Partner with R&D, hardware engineering, and Global Product Management to translate requirements into product improvements.
• Support customer escalations and deliver sustainable solutions.

Skills

Thin film deposition

Process engineering

Customer-facing experience

Project management

Cross-functional collaboration

Education

Master’s degree or above in Materials Science/Physics/Chemical Engineering

Tools

XPS

SIMS

RBS

AFM

XRD

HRTEM

FESEM

Auger

Raman

Ellipsometry

Job description

Senior Engineer, Process Engineering (Advanced Packaging)

Step into a career with ASM, where cutting edge technology meets collaborative culture.

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.Butwe’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.

Job's Mission

As a Senior Engineer, Process Engineering, you will drive the development, qualification, and customer adoption of advanced thin film deposition solutions for semiconductor packaging applications. This role serves as the technical bridge between customers, R&D, hardware engineering, and product management to accelerate technology penetration and enable future business growth.

What You Will Be Working On

• Lead hardware and process qualification of thin film deposition equipment at customer sites.
• Develop and optimize plasma etching, cleaning, and thin film deposition processes for advanced semiconductor packaging applications.
• Execute customer demonstrations, process evaluations, and troubleshooting activities based on customer high-value problems (HVPs).
• Collaborate closely with customers across Asia to understand technical challenges, identify new opportunities, and drive product adoption.
• Partner with R&D, hardware engineering, and Global Product Management (GPM) teams to convert customer requirements into product enhancements and future BU projects.
• Support customer escalations and work cross-functionally to deliver sustainable solutions.

What We Are Looking For

• Master’s degree or above in Materials Science, Physics, Chemical Engineering, or a related field.
• 7-10+ years of experience in thin film deposition equipment development, process engineering, or semiconductor manufacturing.
• Experience supporting customer qualifications, process development, production ramp, demonstrations, and field issue resolution.
• Strong understanding of semiconductor packaging technology and customer-driven process development.
• Proven ability to independently lead complex process development projects, including project planning, experimental design, and stakeholder management.
• Excellent communication and presentation skills, with the ability to communicate complex technical concepts clearly and effectively.
• Willingness to travel outside Taiwan for approximately 30% of the time to support customer engagements and business activities across Asia.
• Open to international assignments and global collaboration across regions.

What Sets You Apart

• Strong customer-facing experience with a track record of driving technology adoption and customer penetration.
• Deep expertise in thin film deposition processes and semiconductor packaging applications.
• Hands-on experience with materials characterization techniques such as XPS, SIMS, RBS, AFM, XRD, HRTEM, FESEM, Auger, Raman, and Ellipsometry.
• Ability to translate customer challenges into actionable R&D, product improvement, and business opportunities.
• Comfortable working in a highly international environment with frequent customer interaction.
• Excited by global career development opportunities, including potential relocation to the United States after 1-2 years and increased exposure to North American customers and teams.
• Adaptable, self-driven, and capable of influencing customers and internal stakeholders through technical expertise and strong communication skills.

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.