Senior Engineer I, Field Process

ASM; Hillsboro (OR); On-site; USD 90,000 - 130,000; Full time

Job summary

ASM is looking for a Senior Engineer, Field Process to advance their film technologies at a customer site in Oregon. The role involves developing and optimizing processes and serving as the technical liaison between ASM and customer engineering teams.

The ideal candidate will have an MS or PhD in materials science or a related field, along with hands-on experience in thin film technologies. This position supports ASM's mission to accelerate semiconductor manufacturing through innovative engineering and collaboration.

Qualifications

• Hands-on experience with thin film processing, developing, or characterizing.
• Experience designing statistical experiments and interpreting results.
• Ability to maintain confidentiality and uphold IP standards.

Responsibilities

• Develop and optimize ALD, PEALD, PECVD processes.
• Serve as technical liaison between customer and ASM.
• Support customer engagement and training.

Skills

Troubleshooting skills

Strong communication skills

Experience with ALD processes

Familiarity with semiconductor applications

Education

MS or PhD in materials science, chemical engineering, or physics

Job description

Step into a career with ASM, where cutting edge technology meets collaborative culture.

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.Butwe’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.

As a Senior Engineer, Field Process, you will help expand ASM’s advanced film technologies at our customer’s Oregon site by developing, optimizing, and transferring innovative ALD, PEALD, PECVD, Epitaxy, and LPCVD processes. You will serve as the technical link between customer engineering teams and ASM’s global Business Unit, ensuring new products and processes are introduced smoothly and successfully. Your work directly supports ASM’s mission to accelerate next‑generation semiconductor manufacturing through collaboration, technical excellence, and customer partnership.

What you will be working on

• MS degree with relevant internship, research, or academic project experience, or PhD with relevant academic, research, or internship experience in materials science, chemical engineering, or physics.
• Hands‑on experience through internships, research, or academic projects involving processing, developing, or characterizing thin films using thermal ALD, plasma ALD, plasma CVD, epitaxy, or LPCVD reactors.
• Demonstrated troubleshooting and structured problem‑analysis skills gained through internships, lab work, or research projects (e.g., KT, FMEA, Ishikawa, 7‑step methodologies).
• Experience designing, running, and interpreting DOEs or statistical experiments in academic, research, or internship settings.
• Familiarity with semiconductor device applications, vacuum techniques, metrology, and thin film characterization through coursework, lab work, or internships.
• Willingness and ability to travel as needed for training and customer engagement; flexibility to support extended hours or weekends during qualifications or escalations.
• Strong verbal and written communication skills, with the ability to clearly explain technical concepts.
• Ability to maintain confidentiality and uphold IP boundaries.

What we are looking for

• MS degree with relevant internship, research, or academic project experience, or PhD with relevant academic, research, or internship experience in materials science, chemical engineering, or physics.
• Hands‑on experience through internships, research, or academic projects involving processing, developing, or characterizing thin films using thermal ALD, plasma ALD, plasma CVD, epitaxy, or LPCVD reactors.
• Demonstrated troubleshooting and structured problem‑analysis skills gained through internships, lab work, or research projects (e.g., KT, FMEA, Ishikawa, 7‑step methodologies).
• Experience designing, running, and interpreting DOEs and statistical experiments.
• Familiarity with semiconductor device applications, vacuum techniques, metrology, and thin‑film characterization.
• Ability to travel as needed for training and customer engagement; flexibility to support extended hours or weekends during qualifications or escalations.
• Strong verbal and written communication skills, able to explain complex concepts clearly.
• Ability to maintain confidentiality and uphold IP boundaries.

What sets you apart

• Internship, research, or academic experience with ASM ALD, PEALD, PECVD, epitaxy, or vertical furnace LPCVD equipment.
• Demonstrated success optimizing deposition processes in research, pilot, or high‑volume manufacturing‑adjacent environments.
• Exposure to customer‑facing technical discussions, presentations, or technical reviews through internships or collaborative research.
• Experience supporting process transfer, scale‑up, or qualification activities in academic, pilot, or industrial settings.
• Experience collaborating cross‑functionally and contributing to structured action plans during technical challenges or escalations.

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting‑edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com andon LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.