Senior Embedded Software Engineering Lead

Teledyne LeCroy Korea; Goleta (CA); On-site; USD 178,000 - 237,000; Full time

Job summary

Teledyne FLIR in Goleta, CA is seeking an experienced embedded software lead responsible for designing, developing and testing firmware for infrared sensing systems. You will participate in requirements, design, coding, unit tests and production handoff, coordinating with hardware teams and manufacturing.

The ideal candidate has 6+ years in embedded development, strong C/C++ skills, and deep knowledge of I2C/SPI/USB and low-latency interfaces.

Qualifications

• Embedded/C development experience including board-level software.
• Experience with Visual Studio and .NET/C# development.
• Familiarity with SQL Server environments and testing in thermal chambers.
• Strong hardware/software integration skills and knowledge of I2C/SPI/USB.
• Ability to design low-latency protocols for peripherals.
• Experience with embedded toolchains and debugging tools.
• IR/thermal imaging background is highly desirable.
• Familiarity with AI-assisted dev tools is a plus.

Responsibilities

• Lead embedded software design, development, and testing for infrared systems.
• Mentor engineers and drive architectural decisions and code reviews.
• Coordinate cross‑functional work with hardware, firmware, and test teams.
• Ensure performance, latency and reliability constraints are met.

Skills

Embedded C/C++

.NET/C# Development

Visual Studio

SQL Server

Thermal chamber testing

Hardware/software integration

I2C/SPI/USB

Low-latency protocols

Embedded toolchains

Infrared/IR tech knowledge

AI-assisted development tools

Education

BS or MS in Computer Science/Engineering, EE, Mathematics, Physics or related

U.S. citizenship or permanent resident

Job description

Teledyne FLIR in Goleta, CA is seeking an experienced embedded software lead responsible for designing, developing and testing firmware for infrared sensing systems. You will participate in requirements, design, coding, unit tests and production handoff, coordinating with hardware teams and manufacturing.

The ideal candidate has 6+ years in embedded development, strong C/C++ skills, and deep knowledge of I2C/SPI/USB and low-latency interfaces.