Senior Electrical & Hardware Engineer

NCSL International

Orlando (FL)

Hybrid

USD 120,000 - 180,000

Full time

14 days+

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Benefits offered by this job

Equity option
Hybrid work
Leadership opportunity
Direct collaboration with founders

Job summary

iPolish, Inc. is seeking a Senior Electrical & Hardware Engineer to lead mixed-signal embedded design for the Magic Wand and next-gen display hardware.

You will own schematic capture, PCB layouts, and the full hardware development lifecycle, coordinating with founders and overseas partners across certification and manufacturing milestones. Ideal candidates have 5+ years in hardware for consumer electronics, proficiency with ESP32-class SoCs, and hands-on experience with EMC, safety, and

Qualifications

  • B.S. or M.S. in Electrical/Computer Engineering.
  • 5+ years hardware product development for consumer electronics.
  • Experience with schematic capture and PCB layout.
  • ESP32 or Wi‑Fi/BLE SoC experience.
  • EMC and certification campaigns experience.
  • Ability to coordinate multi-country certification timelines.

Responsibilities

  • Own schematic capture and PCB layout for compact, battery-powered consumer electronics products.
  • Design low-voltage analog/mixed-signal circuits and power-path management.
  • Lead design-for-manufacturing reviews with overseas CM partners.
  • Coordinate FCC/CE/UKCA certifications end-to-end with test houses.
  • Maintain BOMs and ECO documentation and sourcing cross-references.
  • Support safety and battery compliance including UN 38.3 and related standards.

Skills

Schematic capture
PCB layout
ESP32 SoC
EMC knowledge
Certification coordination
HW-FW integration

Education

B.S./M.S. in Electrical/Computer Engineering

Tools

Fusion 360 Electronics
EAGLE
Altium
KiCad

Job description

iPolish, Inc.


Senior Electrical & Hardware Engineer


Full-Time Mid-to-Senior Level On-Site / Hybrid


LOCATION

Orlando, FL


EMPLOYMENT TYPE

Full-Time


DEPARTMENT

Engineering


About iPolish

iPolish, Inc. is a Central Florida digital beauty technology company pioneering electrophoretic display (EPD)-based color-changing cosmetic products, including digitally programmable press-on nails and the Magic Wand handheld programming device. We operate at the intersection of advanced materials science, consumer electronics, and fashion-tech, with manufacturing partners in China, Taiwan, USA, Japan and Mexico and a product roadmap targeting simultaneous launch across North American, European, and Asia-Pacific markets.


Position Overview

We are seeking an experienced Senior Electrical & Hardware Engineer to lead the design, prototyping, and bring-to-market of mixed-signal embedded systems at the core of the iPolish® product platform. This role is central to the continued development of the Magic Wand device — a compact, battery-powered wireless EPD programmer — as well as next-generation iPolish press on nail display hardware. You will work directly with the founders across the full hardware development lifecycle, from schematic capture through DFM, multi-market regulatory certification, and volume manufacturing. This role carries significant international compliance coordination responsibility: iPolish products are wireless, battery-powered, and skin-adjacent, and the successful candidate will help drive certification and market-access programs across the US, Canada, UK, EU, and Asia-Pacific.


Key Responsibilities


  • Own schematic capture and PCB layout for compact, battery-powered consumer electronics products, including the Magic Wand (ESP32-C6-class Wi-Fi/BLE SoC, LiPo power system, high-voltage EPD source/gate drivers)

  • Design and validate low-voltage analog/mixed-signal circuits, including power-path management (ideal-diode ORing, PFET mux, LDOs), high-voltage EPD driver rails (±30 V class VGH/VGL supplies), and USB-C charging topologies

  • Perform component voltage-rating and derating audits, tolerance analysis, and FMEA; maintain design verification test plans for reliability and safety compliance

  • Lead design-for-manufacturing (DFM) reviews and coordinate with overseas CM partners (China, Taiwan, Mexico) on PCB fabrication, panelization, SMT assembly, and functional test infrastructure — including bed-of-nails / spring-pin programming and test fixtures

  • Develop and maintain full Bills of Materials (BOM) and CPL/placement files with preferred and alternate sourcing, DigiKey / LCSC / Mouser cross-references, and formal component change documentation (ECOs, CCNs)

  • Coordinate international wireless and product-safety certification programs end-to-end: FCC and ISED (Canada), CE RED and UKCA, SAR testing, MIC/Giteki (Japan), SRRC (China), and emerging EU radio-equipment cybersecurity requirements (EN 18031 series); manage test-house relationships, technical files, and Declarations of Conformity

  • Support battery and product safety compliance, including UN 38.3 transport testing, pack-level certification (UL 2054 / IEC 62133 class), and safety-relevant component selection (e.g., glow-wire-compliant connectors)

  • Track evolving market-access requirements (EU GPSR, EU Battery Regulation labeling and marking phases, RoHS/REACH) and translate them into actionable design and documentation changes

  • Collaborate on firmware-hardware integration with embedded software developers; review strapping-pin and boot configurations, bring-up procedures, and factory calibration and programming flows

  • Contribute to IP documentation and patent prosecution support as needed, working with outside counsel and RocketPatent LLC

  • Manage hardware project timelines, milestone tracking, and cross-functional dependencies across engineering, operations, and external vendors; maintain schedules from prototype build through production release

  • Author and maintain technical project documentation including design history files, ECO logs, component change notices, and design review packages


Required Qualifications


  • B.S. or M.S. in Electrical Engineering, Computer Engineering, or equivalent

  • 5+ years of hands-on hardware product development experience with consumer electronics or IoT devices

  • Proficiency in schematic capture and PCB layout; Fusion 360 Electronics / EAGLE experience strongly preferred (Altium or KiCad acceptable with willingness to work in the company toolchain)

  • Demonstrated experience with ESP32 or equivalent Wi-Fi/BLE SoC families; familiarity with Nordic nRF52-class BLE SoCs a plus

  • Experience with battery-powered products: LiPo charging/protection, power-path management, thermal and safety design

  • Solid understanding of EMC principles and direct experience supporting FCC/CE certification campaigns, including pre-scan, test-house liaison, and remediation

  • Working knowledge of international market-access frameworks for wireless consumer products (radio, safety, battery, and labeling requirements) and ability to coordinate multi-country certification schedules

  • Comfort working in a fast-paced startup environment with hands-on prototyping and bench testing


Preferred Qualifications


  • Experience with electrophoretic displays (E Ink-class, SiPix, or custom EPD) or high-voltage display driver ICs, including waveform and supply-rail design considerations

  • Background in manufacturing engineering, DFM, or factory bring-up at contract manufacturers in Asia or Mexico

  • Experience with RF antenna variants and conducted/radiated test configurations (e.g., U.FL/W.FL test ports for certification builds)

  • Familiarity with HTS classification, tariff structures, and Taiwan/China supply chain logistics

  • Experience contributing to patent applications, IP disclosures, or FTO analyses

  • Prior use of LCSC, DigiKey, and Mouser for component sourcing, cross-referencing, and lifecycle management

  • Familiarity with project management methodologies (Agile, stage-gate, or hybrid); experience using engineering task-tracking tools

  • Experience managing external vendors, test labs, or CM partners to schedule and deliverable commitments

  • Background in semiconductor or IC manufacturing processes — including wafer fabrication, packaging, or BEOL operations — with the ability to evaluate component-level design margins and interface effectively with IC vendors on custom or semi-custom silicon


Work Environment & Perks


  • Direct collaboration with the founding team on industry-first EPD beauty technology

  • Competitive compensation commensurate with experience; equity participation available

  • Flexible hybrid arrangement after initial onboarding period

  • Opportunity to own key technical domains and grow into a technical leadership role as the company scales

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