Senior Electrical Engineer

OSI Engineering; Palo Alto (CA); On-site; USD 180,000 - 280,000; Full time

Job summary

OSI Engineering seeks an accomplished Electrical Engineering leader to own the wearable platform’s electrical architecture—from schematic to production. You will guide the EE team on RF, power, and sensor integration for a textile beanie‑form factor, coordinating with firmware and production teams to ship by year end.

The role demands 10+ years in complex hardware, hands‑on sign‑off on multi‑MCU buses, and a track record with overseas CM relationships and DFM/DFT/DFx practices.

Qualifications

• 10+ years designing complex consumer hardware with at least one shipped product.
• Deep mixed-signal expertise across MCU systems, sensor AFEs, audio DSPs, image sensor interfaces, RF/wireless, and battery/charging.
• Strong SI/PI discipline with hands-on sign-off on flex and rigid-flex multi-island designs.
• Experience architecting and validating multi-MCU communication buses — parallel and serial interfaces.
• Experience BOM ownership and second-source strategy on a shipped product.
• Hardware bring-up experience and firmware debugging collaboration.
• Experience managing overseas contract manufacturers and applying DFM/DFT/DFx.

Responsibilities

• Own the electrical architecture across the platform, including power, RF, and sensor integration.
• Lead schematic and PCB design for flex and rigid-flex layouts with SI/PI sign-off.
• Architect the power tree: battery management, multi-rail regulation, USB-C charging.
• Own RF and wireless design, antenna tuning, and Wi-Fi/BLE coexistence.
• Define and validate communication buses for sensors, audio, and inter-MCU links.
• Drive part selection, BOM ownership, and second-source strategies for hardware.
• Lead EE bring-up and debug, enabling firmware and subsystem teams.
• Navigate DFM/DFM gates with CM partners and push to production by year end.
• Build and scale the EE team from prototyping to production volumes.

Skills

Mixed-signal design

PCB design

SI/PI

BOM ownership

RF/wireless

Power management

MCU interfaces

CM management

Job description

You’ll own the electrical engineering team for a breakthrough stealth-stage neurotechnology and brain-computer interface (BCI) startup building an AI-powered neural interface platform. In this role, you will own the wearable electrical architecture from schematic through production, helping bring a highly integrated next-generation device to market. The platform combines cameras, spatial audio microphones, EEG sensors, Wi-Fi/BLE connectivity, and advanced power management on a flex PCB embedded within a textile beanie, requiring deep expertise in compact wearable system design, signal integrity, and production-ready hardware development.

What You’ll Do

• Own the electrical architecture across the platform — compute partitioning, sensor integration, power, RF, and SI/PI.
• Lead schematic and PCB design for flex and rigid-flex multi-island layouts, and own SI/PI sign-off across every revision.
• Architect the power tree — battery management, multi-rail regulation, USB-C charging, and dynamic power budgeting.
• Own RF and wireless electrical design — antenna diversity, body-proximity tuning, and Wi-Fi/BLE coexistence.
• Define and validate every communication bus on the platform — parallel and serial sensor interfaces, audio buses, inter-MCU links.
• Drive part selection, benchmarking, and BOM ownership across MCUs, PMICs, RF SoCs, and the full electrical BOM, with second-source strategy.
• Lead bring-up at the electrical layer — own SI, PI, power, and bus-level debug, and unblock firmware and subsystem leads on the way.
• Drive the design through DFM and qualification gates with our CMs, and ship the product by end of year.
• Build and lead the EE team as we scale from early test batches to production volumes.

Responsibilities:

• 10+ years designing complex consumer hardware, with at least one shipped product (wearable, audio, mobile, or comparable).
• Deep mixed-signal expertise across MCU systems, sensor AFEs, audio DSPs, image sensor interfaces, RF/wireless, and battery/charging.
• Strong SI/PI discipline with hands-on sign-off on flex and rigid-flex multi-island designs.
• Direct experience architecting and validating multi-MCU communication buses — parallel and serial interfaces, inter-processor links.
• Direct experience driving part selection, BOM ownership, and second-source strategy on a shipped product.
• Track record of leading hardware bring-up and partnering closely with firmware on debug.
• Comfortable owning overseas CM relationships and driving DFM, DFT, and DFA from prototype through volume.

Preferred Skills:

• EEG, ECoG, or other biopotential systems — especially high-channel-count or dense sensor arrays.
• Custom ASIC bring-up, silicon co-design, or in-array readout architectures.
• RF design for body-worn antennas and multi-radio coexistence.
• Founding engineer or lead‑level experience at an early‑stage hardware company.

Diane Chen

408.550.2800 x130