Senior Development Test Engineer — Pre & Post-Silicon Software Test, Validation and Characterization

TylSemi, Inc.; San Jose (CA); On-site; USD 180,000 - 216,000; Full time

Job summary

TylSemi, Inc. San Jose, California, United States seeks an experienced Senior Development Test Engineer to own end-to-end testing, characterization and failure analysis of next-generation multi-die packages.

You will lead validation across high-speed die-to-die interconnects (UCIe), PDN/PMIC, PMC, PCIe/CXL subsystems, applying statistics and ML to test data while ensuring traceability from requirements to evidence. This role demands deep hardware test expertise and fast decision-making.

Qualifications

• 8–10+ years in post-silicon validation or complex SoCs/ASICs.
• Experience with multiple die packages and PCIe/CXL/UCIe interconnects.
• Strong hardware test and measurement skills with lab equipment.
• Ability to translate requirements into validation evidence.

Responsibilities

• Own end-to-end testing strategy for multi-die packages.
• Develop test content in C and Python for bare-metal and drivers.
• Build scalable test automation with HIL and CI/CD.
• Perform bench-to-ATE handoffs and validation across PDN/PMIC/PMC.
• Apply statistical analysis and ML to test data for root-cause insights.

Skills

Post-silicon validation

C & Python test content

Lab instrumentation

High-speed protocols (PCIe/CXL/UCIe)

Fault injection

Automation frameworks

Education

BS or MS in Electrical/Computer Engineering

Tools

Git

CMake

GCC/Clang

CI pipelines

Job description

Senior Development Test Engineer — Pre & Post-Silicon Software Test, Validation and Characterization

TylSemi, Inc. San Jose, California, United States

About this position

About TYLsemi, Inc.

The Opportunity

The AI infrastructure market is exploding. Every hyperscaler, every cloud provider, every AI company is building custom silicon. But they all face the same problem: how do you connect hundreds of chips, deliver clean power at scale, and move terabits of data without melting the package?

That's what we solve. TYLsemi builds the chiplet infrastructure IP — the IO, power delivery, and interconnect building blocks — that makes AI/HPC systems actually work at scale.

This isn't a nice-to-have. It's the critical path.

Why Now

The Market Window

The semiconductor industry is going through its biggest architectural shift in 40 years:

• Moore's Law is dead. 2nm and beyond delivers marginal performance gains. The future is chiplets, not monolithic dies.
• Custom silicon is now mainstream. Google, Microsoft, Amazon, Meta, OpenAI — they're all designing their own ASICs. The $50B custom silicon market is growing 30% annually.
• IO and power are the bottleneck. Solve hard problems and provide something which is a category in itself.
• Translation: We're entering the market at exactly the moment when every major AI/HPC player needs what we're building, and their alternatives are disappearing.

Culture & Team: How We Work

No Politics, No Bureaucracy

There are no layers, no approval chains, no corporate theater.

• If you have an idea, we test it. If it works, we ship it.
• No endless meetings, no PowerPoint presentations to convince middle management.

Remote-Friendly, Global Team

• US team: Bay Area preferred, but we hire the best people regardless of location
• India team: Building a world-class design center in Bangalore

Move Fast, Ship Real Products

We're not a research project. We have paying customers, committed capital, and aggressive timelines.

This is a company, not a lifestyle business. We're building to win.

What We Value

• Ownership mindset. You're not here to execute someone else's roadmap. You're here to define it.
• Bias for action. We move fast. Analysis paralysis doesn't fly here.
• Deep technical expertise. This is hard engineering. We need people who've shipped real silicon and debugged real hardware.
• Low ego, high standards. We don't care about titles or politics. We care about results.

The Ask

If you're reading this, you're probably comfortable. You have a good job at a stable company with all the benefits.

We're asking you to walk away from that and bet on us.

Here's why you should:

• The market is real. AI infrastructure spending is $200B+ annually and growing 40% YoY. Every hyperscaler needs what we're building.
• The team has done this before. We've built and exited semiconductor companies at scale. This isn't our first rodeo.
• The traction is de-risked. We have LOIs, strategic investors, and a clear path to revenue.
• The work is consequential. You're not optimizing someone's ad click-through rate. You're building the silicon infrastructure that powers AI.

This is the bet. Join us and build something that matters.

Or stay comfortable. No judgment.

But if you're the kind of person who wants to take the shot, we'd love to talk.

READY TO JOIN?

About the role

We are seeking an experienced to own the end-to-end testing, characterization, and failure analysis strategy for complex, next-generation multi-die packages.

You will own the complete validation lifecycle across a multi-die architecture—covering high-speed die-to-die (UCIe) interconnects, Power Delivery Networks (PDN/PMIC), Platform Management Controllers (PMC), PCIe/CXL subsystems.

Additionally, you will apply statistical analysis and machine learning to test data—driving outlier detection, bench-to-ATE correlation, and predictive telemetry signals—without treating ML models as a substitute for true physical root-cause analysis.

What you’ll do

Test content and automation

• Test Plan Ownership: Define development test strategies, coverage targets, content architecture, and strict traceability from architectural requirements to validation evidence.
• Bare-Metal & C/Python Test Content: Write low-level C and Python test suites—including bare-metal exercisers, traffic generators, stress patterns, and custom firmware drivers/hooks.
• Scalable Automation & HIL: Build robust test frameworks featuring instrument control, automated sequencing, structured result capture, and Hardware-in-the-Loop (HIL) CI/CD integration for continuous validation.
• Bench-to-ATE Handoff: Develop lab-to-ATE correlation test suites and drive smooth handoffs to Product & Test Engineering (PTE)
• Own the development test plan: coverage goals, content architecture, and the traceability between a requirement, the test that exercises it, and the evidence it passed.

Characterization and margin

• Injection Frameworks: Build minimally invasive fault-injection hardware/software infrastructure that perturbs target datapaths without destabilizing the test setup itself.
• Protocol & Platform Fault Testing: Execute rigorous error campaigns targeting CRC retries, lane degradation/repair, sideband timeouts, PCIe AER, DMA/IOMMU translation faults, and PMIC reset conditions.
• Firmware & Resilience Testing: Validate system firmware error handlers, watchdog timers, and hardware-level fault containment behavior under out-of-spec conditions.

Required qualifications

• Experience: 8–10+ years in post-silicon validation , system software testing, silicon bring-up, or development test for complex SoCs / ASICs / GPUs.
• Software/Firmware Skills: Advanced proficiency in C and Python for low-level bare-metal test content, hardware abstraction, and automation frameworks.
• Silicon Characterization: Proven experience with Shmoo plotting PVT corner testing, jitter/margin analysis, and guard-band definition.
• Fault Injection Expertise: Hands-on experience building or executing error-injection and recovery validation campaigns on production silicon.
• Lab Instrumentation: Fluency with oscilloscopes, protocol analyzers (PCIe/CXL), logic analyzers, BERTs, thermal chambers, controllable power supplies, and JTAG debuggers.
• High-Speed & System Protocols: Practical, protocol-level understanding of high-speed serial interfaces (PCIe, CXL, or UCIe) and control buses (I2C, SPI, UART, PMBus, SMBus).
• Power Systems: Solid grasp of system power delivery—including sequencing, PMIC telemetry, DVFS, voltage regulation, and protection trip limits.
• Data & Tooling: Competency with toolchains (Git, CMake, GCC/Clang, CI pipelines) and statistics/data analysis over test populations.
• Education: BS or MS in Electrical Engineering, Computer Engineering, Computer Science, or equivalent practical experience.
• AI Tool usage : AI coding and automation tool is must for this role

Compensation

The compensation range shown below represents total target cash compensation and includes both base salary and target bonus. Actual compensation will vary based on factors such as experience, skills, qualifications, job level, and work location.

In addition to cash compensation, this position is eligible for equity in the form of stock options, giving you the opportunity to share in the Company’s long-term growth and success.

The pay range for this role is:

180,000 - 216,000 USD per year(US)