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Intel Corporation in the United States is seeking a Senior Analog Design Engineer to design, develop, and optimize analog and mixed-signal ICs for high-speed IO applications. The role requires deep technical expertise and the ability to lead complex projects from concept to production.
You will collaborate with architecture, logic, verification, physical design, and validation teams across global sites, mentoring engineers and driving design reviews to ensure robust, scalable solutions.
The Hard IP and Test Chip Development team, within Intel's Central Engineering Group, is responsible for delivering industry-defining analog and mixed-signal IP for Intel's Client, Datacenter, AI and Foundry customers. The IO team owns high-speed serial IO and die-to-die interfaces across multiple advanced process nodes.
We are seeking an experienced Senior Analog Design Engineer to join our engineering team. The successful candidate will be responsible for designing, developing, and optimizing analog and mixed-signal integrated circuits for various applications. This role requires deep technical expertise in analog circuit design and the ability to lead complex projects from concept to production.
In this role, you will drive the definition, design, and verification of high-performance analog blocks, IP top level designs and subsystems (floor planning, power delivery, bump maps), collaborating closely with system architects, logic designers, and layout engineers. The ideal candidate is self-driven, detail-oriented, and passionate about analog design in high-speed IO and die-to-die systems. You will facilitate technical discussions, hold design reviews, and play an active role in post-silicon validation and performance optimization. The position also involves providing guidance to layout engineers and mentoring junior analog designers as needed. Strong problem‑solving skills, teamwork, and a willingness to share knowledge and collaborate across disciplines are essential. This role offers an opportunity to develop innovative designs and be part of a highly experienced IO and die-to-die design team focused on delivering next‑generation high‑speed interconnect solutions.
Job Type: Experienced Hire
Shift: Shift 1 (United States of America)
Primary Location: US, Arizona, Phoenix
Additional Locations: US, Colorado, Fort Collins, US, Oregon, Hillsboro
Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Find out more about the benefits of working at Intel.
Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change. This role is an on-site role and you are expected to work in the office at least 4 days per week.
Annual Salary Range for jobs which could be performed in the US: $190,610.00-269,100.00 USD. The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.