Semiconductor Lab Engineer II - Packaging & Metrology

Inside Higher Ed; Gainesville (FL); On-site; USD 75,000 - 95,000; Full time

Job summary

A leading educational institution seeks an Engineer II to operate laboratory equipment for research projects. This role includes data management, equipment training for users, and collaboration with faculty and other researchers. Candidates should have a Bachelor's degree in a relevant field or equivalent experience and knowledge in microelectronics and semiconductor fabrication. The expected salary ranges from $75,000 to $95,000 based on education and experience. This is a full-time, time-limited position located in Gainesville, Florida.

Qualifications

• High school diploma or equivalent and six years of relevant experience, or Bachelor's degree with two years of experience.
• Experience with IC packaging and semiconductor fabrication.

Responsibilities

• Operate laboratory equipment for research projects.
• Lead data collection and management for projects.
• Train users on proper equipment use.

Skills

IC packaging

Microelectronics and semiconductor fabrication knowledge

Hands-on processing

Metrology

Reliability analysis

Failure analysis

3D image analysis software (VisualSI, ImageJ)

Education

B.S. in electrical engineering

B.S. in mechanical engineering

B.S. in materials science

Tools

Thermal, stress, humidity test tools

Lab equipment

Job description

Job No: 539221

Work Type: Full Time

Location: Main Campus (Gainesville, FL)

Categories: Grant or Research Administration, Engineering

Department: 19050500 - EG-SEMICONDUCTORS

Job Description

Classification Title:

Engineer II

Classification Minimum Requirements:

A high school diploma or equivalent and six years of relevant experience; Appropriate college coursework or vocational/technical training may substitute at an equivalent rate for the required experience; or Bachelor's degree in an appropriate area and two years of relevant experience.

Job Description:

Operates laboratory equipment in line with the FSI research projects and service agreements and packaging development initiatives as needed. Laboratory equipment includes etching, dicing, packaging, thermal testing, X-ray tomography, dual beam FIB/SEMs, scanning acoustic microscope, digital microscope, probe station, sample preparation, optical microscope, etc. Additional tasks involve optimizing workflows for reliability studies and ensuring compliance with industry standards in packaging technologies.

Monitors, maintains, calibrates, and troubleshoots laboratory and mechanical room equipment. Communicates and oversees infrastructure changes and updates in lab and mechanical room facilities (including vacuum pumps, air compressors, water chiller, etc.) as needed and keeps the laboratory and mechanical room secure and well organized. Orders necessary parts and consumables for assigned labs, working closely with vendors on competitive pricing.

Leads data collection and management for projects, follows guidelines, and with restrictions of such projects.

Trains new users, including undergraduate and graduate students, postdoctoral associates, and other professional engineers on proper use of equipment and lab procedures. Coordinates and instructs graduate engineers in laboratory equipment operations and functions, as well as manages lab access for each. Maintains logs of instrument usage, as well as users, and manages access of laboratory equipment and review of security camera footage.

Researches and studies new tools and methods to operate the equipment in order to stay up-to-date with evolving test and measurement capabilities. Also provides consultation and assistance to the faculty and others in use of the laboratory.

Performs tasks for FSI research laboratory and other interanl and external collaborators. Assists faculty and other FSI researchers or engineers in collecting data and writing sponsored research reports and technical papers for publication and/or presentation.

Expected Salary:

$75,000-$95,000; commensurate with education and experience

Required Qualifications:

A high school diploma or equivalent and six years of relevant experience; Appropriate college coursework or vocational/technical training may substitute at an equivalent rate for the required experience; or Bachelor's degree in an appropriate area and two years of relevant experience.

Preferred:

B.S. in electrical engineering, mechanical engineering, materials science or other relevant disciplines.

Experience with IC packaging, advanced packaging.

Microelectronics and semiconductor fabrication knowledge.

Hands-on processing, metrology, reliability, and failure analysis experience.

Operating semiconductor fabrication and reliability test tools (i.e. thermal, stress, humidity, etc.).

Direct experience in operating lab equipment and general lab management.

Experience with 3D image analysis software (VisualSI, ImageJ, Avizo, ORS, etc.).

Special Instructions To Applicants:

In order to be considered for this position, you must upload a cover letter and resume with application.

This is a time-limited position.

Application must be submitted by 11:55 p.m. (ET) of the posting end date.

Health Assessment Required:

No

Applications Close: 02 April 2026

To apply, visit https://explore.jobs.ufl.edu/en-us/job/539221

Our Commitment:

The University of Florida is an Equal Employment Opportunity Employer.

Hiring is contingent on eligibility to work in the U.S. The University of Florida is a public institution and is subject to all requirements under Florida Sunshine and Public Record laws. If an accommodation due to a disability is needed to apply for this position, please call 352-392- 2477 or the Florida Relay System at 800-955-8771 (TDD) or visit Accessibility at UF.

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