RF/Mixed-Signal Packaging Scientist – Module Design

IBM; Town of Yorktown (NY); On-site; USD 120,000 - 190,000; Full time

Benefits offered by this job

Healthcare benefits

401(k) plan

Paid time off

Education resources

Job summary

IBM Research in Yorktown Heights, NY is seeking a Research Scientist to advance RF and mixed‑signal packaging for quantum computing applications. You will design CMOS‑based packages for RFICs and high‑density interconnects, run EM simulations, and collaborate with IC and system designers from concept to bring‑up.

Required: Master's degree, strong RF/microwave background, experience with HFSS/ADS or Cadence Allegro; hands‑on lab skills; knowledge in communication theory or quantum computing is a

Qualifications

• Strong background in RF/microwave engineering.
• Familiarity with state-of-the-art packaging technologies.
• Experience with HFSS, ADS, Cadence Allegro, or similar tools.

Responsibilities

• Develop RF and mixed-signal packaging solutions including experimental characterization.
• Perform EM simulation, SI/PI analysis, and package-IC co-simulation.
• Collaborate with IC and system designers from concept to bring-up and test.

Skills

RF/microwave engineering

HFSS

ADS

Cadence Allegro

SI/PI

Education

Master's Degree

Doctorate Degree

Tools

HFSS

ADS

Cadence Allegro

Job description

IBM Research in Yorktown Heights, NY is seeking a Research Scientist to advance RF and mixed‑signal packaging for quantum computing applications. You will design CMOS‑based packages for RFICs and high‑density interconnects, run EM simulations, and collaborate with IC and system designers from concept to bring‑up.

Required: Master's degree, strong RF/microwave background, experience with HFSS/ADS or Cadence Allegro; hands‑on lab skills; knowledge in communication theory or quantum computing is a