RD Manager

Foxconn E BG Group; Santa Clara (CA); On-site; USD 180,000 - 240,000; Full time

Job summary

Foxconn E BG Group in Santa Clara, CA, seeks an R&D Manager to lead a specialized engineering team focused on the architecture, design, development, and validation of next‑generation AI server and rack infrastructure.

You will provide technical leadership across high‑performance hardware, power delivery, thermal management, signal integrity, and lifecycle validation while partnering with manufacturing, quality, and supply chain to scale from design to production.

Qualifications

• BS in Electrical, Mechanical, Computer, or Systems Engineering.
• 4–7 years in high‑performance server hardware architecture and system design.
• 3+ years AI‑specific power and thermal infrastructure expertise.
• 4+ years EVT, DVT, and PVT with root‑cause analysis experience.
• 3–5 years leading engineering teams and managing multiple priorities.

Responsibilities

• Lead architecture and system‑level design of AI servers and rack infrastructure, including power, thermal, mechanical, electrical, and reliability requirements.
• Mentor and allocate resources across programs and provide technical guidance to resolve complex engineering challenges.
• Serve as the design readiness gatekeeper throughout EVT, DVT, and PVT lifecycle, driving risk mitigation and corrective actions.
• Partner with engineering, manufacturing, quality, supply chain, and NPI teams to optimize designs for performance, cost, reliability, manufacturability, and scalability.
• Interface with hyperscalers, Tier‑1 customers, suppliers, and partners to align requirements and validation expectations.

Skills

AI server architecture

System design

Power delivery

Thermal management

Signal integrity

Leadership

Project management

Education

Bachelor of Science in Electrical Engineering or related field

Tools

DFM/DFT/DFC

Job description

Company Overview

Established in Taiwan in 1974, Hon Hai Technology Group, commonly known as Foxconn, is the world’s largest electronics manufacturer and leading provider of technological solutions with a network of over 233 campuses across 24 countries. In the US, Foxconn employs 8,000 across 56 different sites with manufacturing operations in Virginia, Wisconsin, Ohio, Indiana, Texas, and California. As of 2025, Foxconn ranks 28 th among the Fortune Global 500 and reported revenue of approximately USD $259 billion.

Company Overview

Established in Taiwan in 1974, Hon Hai Technology Group, commonly known as Foxconn, is the world’s largest electronics manufacturer and leading provider of technological solutions with a network of over 233 campuses across 24 countries. In the US, Foxconn employs 8,000 across 56 different sites with manufacturing operations in Virginia, Wisconsin, Ohio, Indiana, Texas, and California. As of 2025, Foxconn ranks 28 th among the Fortune Global 500 and reported revenue of approximately USD $259 billion.

The company’s diverse product offerings span four major segments: smart consumer electronics, cloud, and networking solutions, computing, and various other components. Foxconn makes 40% of the consumer electronics that we find in our everyday lives. In recent years, Hon Hai has adopted the 3+3 strategy, focusing on three emerging industries - electric vehicles, digital health solutions, and robotics - while leveraging three key technologies: next-generation communications, artificial intelligence (AI), and semiconductors. Together, these initiatives position the company as a leader in innovation for the 21st century.

Hon Hai Technology Group is deeply committed to championing environmental sustainability within its manufacturing processes. By integrating sustainability into its operations framework, the company strives to serve as a best-practice model for global enterprises, enhancing corporate responsibility while meeting the growing demand for environmentally conscious production methods.

Job Summary

The R&D Manager leads and mentors a highly specialized engineering team responsible for the architecture, design, development, and validation of next-generation AI server and rack infrastructure. This role provides technical leadership across high-performance hardware architecture, high-density power delivery, advanced thermal management, high-speed signal and power integrity, and full hardware lifecycle validation.

Duties And Responsibilities

• Lead the architecture and system-level design of next-generation AI servers and rack infrastructure, including power, thermal, mechanical, electrical, and reliability requirements. Provide technical direction on high-density power, liquid cooling, signal integrity, power integrity, and complex system-level engineering trade-offs.
• Lead, mentor, and develop a highly specialized engineering team while establishing project priorities, milestones, and performance expectations. Allocate engineering resources effectively across multiple programs and provide technical guidance to resolve complex engineering challenges.
• Serve as the technical gatekeeper for design readiness, risk assessment, and validation throughout the EVT, DVT, and PVT lifecycle. Drive root-cause failure analysis, corrective actions, and risk mitigation to prevent critical design issues from reaching production or customer deployment.
• Partner with engineering, manufacturing, quality, supply chain, and NPI teams to optimize designs for performance, cost, reliability, manufacturability, and scalability. Lead the transition from R&D to manufacturing and provide technical leadership during builds, engineering changes, and production ramp.
• Serve as a technical interface with hyperscale's, Tier-1 customers, suppliers, and technology partners to align technical requirements and validation expectations. Evaluate external technologies, resolve technical issues, and drive corrective actions to support product performance and time-to-market.

Education

• Bachelor of Science (BS) degree in Electrical Engineering, Mechanical Engineering, Computer Engineering, Systems Engineering, or a closely related is required.

Experience

• 4–7 years of experience in high-performance server, rack, or computing hardware architecture and system design, with strong knowledge of AI server/rack systems, high-density power architecture, signal integrity, and power integrity.
• 3+ years of experience with AI-specific power and thermal infrastructure, including advanced thermodynamics, high-density power delivery, liquid cooling, and system-level thermal management.
• 4+ years of experience across EVT, DVT, and PVT, with proven ability to perform root-cause failure analysis, manage engineering risks, and drive complex hardware issues through resolution. At least 3 years of experience implementing DFM, DFT, DFC, and other Design for X principles is preferred.
• 3–5 years of experience leading engineering teams, mentoring technical talent, allocating resources, and managing multiple priorities. Demonstrated technical credibility, strong decision-making, and the ability to lead teams effectively under pressure are required.
• Strong ability to influence engineering, manufacturing, NPI, quality, supply chain, vendors, and customers to achieve technical and business objectives. Experience working with hyperscalers, Tier-1 customers, or strategic technology suppliers is strongly preferred.

EEOC Statement

Foxconn is an equal opportunity employer that is committed to diversity and inclusion in the workplace. Foxconn prohibits discrimination and harassment of any kind and provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, gender, religion, sex, sexual orientation, ethnicity or national origin, age, disability, marital status, genetics, pregnancy, or any other protected characteristic as outlined by federal law. In addition to federal law requirements, Foxconn complies with applicable state and local laws governing nondiscrimination in employment in every location in which the company has facilities. This policy applies to all terms and conditions of employment, including recruiting, hiring, placement, promotion, termination, layoff, recall, transfer, leaves of absence, compensation, and training.