R&D AI & Intelligent Tool Development Engineer, Joint Development Modules (7735)

TSMC - Taiwan Semiconductor Manufacturing Company Limited; San Jose (CA); Hybrid; USD 150,000 - 250,000; Full time

Job summary

TSMC in San Jose, CA, is building an on-site AI technical expert team and will operate in a hybrid schedule with four days in‑office. The role centers on accelerating AI‑driven verification and autonomous system development across semiconductor process modules in partnership with US tool suppliers.

You will co‑design next‑generation process chambers, lead intelligent control initiatives, and guide secure Copilot/LLM‑based workflows to shorten R&D to high‑volume manufacturing cycles.

Qualifications

• 2–10 years of experience and a Ph.D. in a STEM field with a specialization in AI/ML, Process Modeling, PIML, Reinforcement Learning, or LLM applications for industrial automation.
• Deep expertise in closed‑loop control theory, sensor fusion, and predictive maintenance algorithms.
• Practical knowledge of Agentic AI, LLM integration, and building Copilot systems within secure engineering environments.
• Understanding of Digital Twin architecture and physics‑based modeling for semiconductor process simulation.

Responsibilities

• Co‑Design & Joint Development: Partner deeply with key US tool suppliers to drive the engineering, architecture, and design of pre‑alpha and next‑generation process chambers and hardware systems.
• Intelligent Control & Performance: Lead the development of in‑situ sensor fusion and closed‑loop control systems to optimize tool performance. Drive initiatives for tool‑to‑tool matching and predictive health monitoring to achieve superior cost efficiency and ESG targets.
• Agentic AI & Digital Twin: Architect Agentic AI capabilities via secure infrastructure to automate complex engineering workflows, enabling autonomous execution. Develop Digital Twin strategies to dramatically shorten the cycle from R&D to high‑volume manufacturing (HVM).
• Cross‑Module Collaboration: Interface with R&D headquarter module teams to deliver robust AI‑driven modeling, intelligent control, and autonomous execution on supplier sites.
• Technical Leadership: Act as the on‑site TSMC AI technical expert in California, guiding supplier software and data engineering teams to align with TSMC’s aggressive technology roadmap.

Skills

Closed-loop control

Sensor fusion

Predictive maintenance

Agentic AI

LLM integration

Digital Twin modeling

Education

PhD in STEM

AI/ML specialization

Process Modeling

Reinforcement Learning

LLM applications for industrial automation

Job description

TSMC’s Advanced Tool and Module Development Function in R&D is establishing a new engineering team in the US as a direct extension of its organization in Taiwan. This newly formed team will serve as the on-site technical bridge and represent headquarter R&D teams in working shoulder-to-shoulder with US-based semiconductor equipment suppliers to shorten the AI‑driven intelligence and process control development cycle from prototype to process verification.

In this role, you will do more than manage vendor relations—you will co‑develop and co‑design next‑generation and pre‑alpha intelligent systems from the ground up. Your mission is to accelerate the hardware‑software verification and commercialization pipeline, directly influencing the future of global semiconductor fabrication through autonomous systems. Because this team covers the entire spectrum of process modules (Etch, EPI, Thin Film, Wet, CMP, Metrology, etc.), TSMC is seeking versatile, brilliant minds who understand how AI algorithms and intelligent control directly impact process physics and tool performance.

You will join us in our San Jose office, operating on a hybrid work schedule with 4 days in‑office.

Responsibilities

• Co‑Design & Joint Development: Partner deeply with key US tool suppliers to drive the engineering, architecture, and design of pre‑alpha and next‑generation process chambers and hardware systems.
• Intelligent Control & Performance: Lead the development of in‑situ sensor fusion and closed‑loop control systems to optimize tool performance. Drive initiatives for tool‑to‑tool matching and predictive health monitoring to achieve superior cost efficiency and ESG targets.
• Agentic AI & Digital Twin: Architect Agentic AI capabilities via secure infrastructure to automate complex engineering workflows, enabling autonomous execution. Develop Digital Twin strategies to dramatically shorten the cycle from R&D to high‑volume manufacturing (HVM).
• Cross‑Module Collaboration: Interface with R&D headquarter module teams to deliver robust AI‑driven modeling, intelligent control, and autonomous execution on supplier sites.
• Technical Leadership: Act as the on‑site TSMC AI technical expert in California, guiding supplier software and data engineering teams to align with TSMC’s aggressive technology roadmap.

Minimum Qualifications

• 2–10 years of experience and a Ph.D. in a STEM field (such as EE, ME, Physics, Chemistry, Materials Science, or Data Science) with a specialization in AI/ML, Process Modeling, PIML, Reinforcement Learning, or LLM applications for industrial automation.
• Deep expertise in closed‑loop control theory, sensor fusion, and predictive maintenance algorithms.
• Practical knowledge of Agentic AI, LLM integration, and building Copilot systems within secure engineering environments.
• Understanding of Digital Twin architecture and physics‑based modeling for semiconductor process simulation.

Preferred Qualifications

• Strong cross‑functional communication and negotiation skills to effectively collaborate with external supplier executives and internal TSMC R&D teams.
• A thriving mindset in an ambiguous, fast‑paced, pre‑alpha R&D environment.

For positions requiring access to technical data subject to export control regulations, including Export Administration Regulations, TSMC North America may have to obtain export licensing approval from the U.S. Government for certain individuals. All employment is contingent upon TSMC North America obtaining any export license or other approval that may be required by the U.S. Government.

Pay Transparency / Benefits statement

At TSMC, your base pay is only part of your overall total compensation package. At the time of this posting, this role typically pays a base salary between $150,000 and $250,000 per year. The range displayed reflects the minimum and maximum target for new hires. Actual pay may be more or less than the posted range. Factors that influence pay include the individual's skills, qualifications, education, experience and the position level and location. TSMC’s total compensation package consists of market competitive pay, allowances, bonuses, and comprehensive benefits. We also offer extensive development opportunities and programs.