Quantum NCG 3DHI Engineer

GlobalFoundries; United States; On-site; USD 85,000 - 146,000; Full time

Job summary

GlobalFoundries is seeking a motivated R&Dbonding integrationengineer to join our Quantum Advanced Packaging team. This role covers 3D heterogeneous integration development, including wafer-to-wafer and die-to-wafer bonding.

You will drive 3DHI process development with unit process engineers and OSATs, develop expertise in materials and tooling, and collaborate across teams to improve yields and reduce cycle times.

Qualifications

• Bachelor’s or Master’s in Electrical/Mechanical/Chemical Engineering or Materials Science.
• Prior internship or co-op experience preferred.
• English language proficiency required.

Responsibilities

• Drive 3DHI process development with unit process engineers and tool vendors for Quantum Advanced Packaging.
• Collaborate with OSATs to develop wafer-level and 2.5D/3D integration processes.
• Develop expertise in processes, materials and tooling with characterization resources.
• Understand failure modes and improve yields while reducing cycle time and cost.
• Generate IP related to wafer integration and packaging technology.
• Work with other teams on varied assignments as needed.

Skills

3D integration knowledge

Semiconductor packaging

Communication skills

Project management

Leadership experience

Education

Bachelor’s or Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field

Job description

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

New College Graduate Overview:

We offer many full-time employment paths for recent graduates, which provide accelerated training in a fast-paced work environment, cross-functional working opportunities, and talent mobility. New college graduates are provided with mentorship, networking, and leadership opportunities, which give our new team members life-long connections and skills.

Summary of Role:

GlobalFoundries is seeking a motivated R&Dbonding integrationengineer to become part of our Quantum Advanced Packaging team.This role will entail 3D heterogeneous integration (3DHI) development including wafer-to-wafer and die-to-wafer bonding.

Essential Responsibilities:

• Drive3DHI process development efforts and planning by working with the unit process engineers and directly with the tools & materialssuppliersfor theQuantum Advanced Packaging projects.
• Collaborate with OSATs (Outsourced Assembly and Test) to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration processes.
• Developexpertisein the processes, materials andtooling leveragingavailable characterization resources.
• Drive amechanisticunderstanding of failure modes.
• Develop integration schemes to continuously improve yields and to reduce cycle time & costs.
• Generate IP related to novel wafer integration & packaging technology.
• Work and collaborate with other teamsregardingdifferent assignments as needed.

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Securityrequirementsand programs.
• Other duties as assigned bymanager.

Required Qualifications:

• Education –Bachelor’s orMaster’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, MaterialsScienceor relatedfieldfrom an accredited degree program.
• Prior relatedinternship or co-op experience.
• Must have at least an overall 3.0 GPA and proven good academic standing.
• Language Fluency - English (Written & Verbal).
• Travel - Up to10%.

Preferred Qualifications:

• PhD education level preferred.
• Fundamental knowledge of semiconductor packaging process modules and integration.
• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
• Project management skills,i.e.,the ability to innovate andexecute onsolutions that matter; the ability to navigate ambiguity.
• Strong written and verbal communication skills.
• Strong planningandorganizational skills.

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Expected Salary Range

$85,000.00 - $146,000.00

The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at [e-mail] and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case‑by‑case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.

An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.

GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.

All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law