Quantum Materials Scientist: Process & Integration for QCs

Amazon Web Services (AWS); Pasadena (CA); On-site; USD 143,000 - 193,000; Full time

Job summary

AWS Center for Quantum Computing in Pasadena, CA is seeking an Applied Scientist on the Materials team to drive materials integration and process development for superconducting quantum processors. You will join a cross-disciplinary team of physicists, materials scientists, and hardware/software engineers advancing quantum computing.

The role emphasizes thin-film deposition, semiconductor integration, and materials characterization, with a focus on device topography and process sequences that

Qualifications

• PhD in mechanical engineering, electrical engineering, material science, physics or equivalent.
• Expertise in thin-film deposition and process integration at 200 mm wafer scale or larger.
• Expertise in thin-film characterization.

Responsibilities

• Develop and optimize materials for superconducting quantum hardware, focusing on thin-film deposition and materials solutions enabling integration architectures for scaling qubit density.
• Establish process-structure-property relationships for production-relevant films and interfaces and qualify new tools and process modules.
• Coordinate with cross-functional teams to translate materials advances into production and publish results in scientific journals when appropriate.

Skills

Thin-film deposition

Film characterization

Wafer-scale integration

Cross-disciplinary collaboration

Education

PhD in Mechanical Engineering

PhD in Electrical Engineering

PhD in Materials Science

PhD in Physics

Tools

Python

Job description

AWS Center for Quantum Computing in Pasadena, CA is seeking an Applied Scientist on the Materials team to drive materials integration and process development for superconducting quantum processors. You will join a cross-disciplinary team of physicists, materials scientists, and hardware/software engineers advancing quantum computing.

The role emphasizes thin-film deposition, semiconductor integration, and materials characterization, with a focus on device topography and process sequences that