Project Architect – ASIC Manufacturing, Package, Test & Qualification

imec; San Jose (CA); On-site; USD 165,000 - 210,000; Full time

Job summary

IC-Link by imec is seeking an experienced Project Architect to guide ASIC/SoC manufacturing initiatives, spanning packaging, production testing, qualification, and related supply chain activities.

You will lead multi-disciplinary teams, translate customer requirements into executable proposals, engage with global OSATs and manufacturing partners, and drive technical and commercial success in a dynamic, international environment.

Qualifications

• BSc or MSc in Microelectronics, Electrical Engineering, Physics, Applied Physics, or related field.
• 10+ years of professional post-silicon ASIC manufacturing experience.
• Experience with semiconductor packaging, production test, and qualification.
• Strong knowledge of OSATs and global manufacturing partners.

Responsibilities

• Serve as technical lead during pre-sales for ASIC/SoC manufacturing opportunities.
• Define project scope, timelines, costs, technical deliverables, and risks with the Business Development Manager.
• Develop manufacturing solutions spanning packaging, production testing, qualification, and supply chain management.
• Demonstrate imec expertise in package development, test, qualification, and manufacturing services.
• Respond to customer questions and translate requirements into manufacturing solutions.
• Collaborate with customers and internal teams across functions.
• Represent portfolio to stakeholders and align with objectives.
• Develop detailed statements of work with deliverables and milestones.
• Work with OSATs and manufacturing partners globally.
• Stay informed on semiconductor industry trends and competitive positioning.
• Identify opportunities to improve engagement processes.

Skills

Project leadership

Customer engagement

Semiconductor packaging

Production testing

Qualification processes

SOW development

OSAT collaboration

Vendor management

Financial analysis

Program management

Education

BSc/MSc in Microelectronics or related

Tools

FCBGA

WLCSP

QFN

QFP

2.5D/CoWoS

3D integration (WoW/CoW)

JEDEC standards

OSAT partnerships

Job description

Project Architect – ASIC Manufacturing, Package, Test & Qualification

Engineering & Technology – San Jose, California, USA

Join IC-Link by imec and help customers bring complex ASIC and SoC products from concept toward manufacturing. As part of the Project Architect team, you will combine deep technical expertise in semiconductor packaging, production test, qualification, and supply chain management with strong customer engagement and project leadership skills.

About the role

IC-Link by imec is looking for an experienced Project Architect to support business development activities and help define manufacturing solutions for customer ASIC and SoC programs.

In this role, you will oversee multiple customer projects and develop technical and commercial solutions covering packaging, production testing, qualification, and related manufacturing activities. You will work closely with customers, business development managers, design teams, external manufacturing partners, and other internal stakeholders to translate customer requirements into executable project proposals. A strong technical background in post-silicon semiconductor manufacturing is essential for success in this role.

What you will do

• Serve as the technical lead during the pre-sales phase for customer ASIC and SoC manufacturing opportunities.
• Define project scope, timelines, costs, technical deliverables, and risks in partnership with the Business Development Manager, helping position IC-Link to win customer programs while maximizing value creation.
• Develop manufacturing solutions spanning semiconductor packaging, production testing, qualification, and supply chain management.
• Demonstrate IC-Link by imec's expertise and capabilities in package development, test, qualification, and manufacturing services.
• Respond to customer technical questions and translate customer requirements into clear and executable manufacturing solutions.
• Collaborate closely with customers as well as internal technical, commercial, and operational teams across multiple functions.
• Represent your portfolio of projects to key stakeholders and work closely with design managers and directors to ensure alignment with broader organizational and customer objectives.
• Develop detailed statements of work, ensuring appropriate diligence around technical deliverables, assumptions, timelines, risks, and commercial considerations.
• Work with global OSAT and manufacturing partners to identify appropriate solutions for customer programs.
• Stay informed about semiconductor industry trends, advanced packaging technologies, and IC-Link by imec's competitive positioning within ASIC manufacturing services.
• Identify opportunities to improve the quality, efficiency, and speed of our customer engagement and project-definition processes.
• Contribute new ideas and support their implementation across the organization.

Who you are

• You hold a BSc or MSc in Microelectronics, Electrical Engineering, Physics, Applied Physics, or a related technical discipline.
• You have 10+ years of professional experience in post-silicon ASIC manufacturing, with significant expertise across packaging, production test, and qualification.
• You have strong technical knowledge of:
• Package design, including substrate design and assembly.
• Wafer sort and final production test.
• Semiconductor qualification requirements and JEDEC standards, including applications for automotive and space environments.
• You have extensive experience with mainstream semiconductor packages such as FCBGA, WLCSP, QFN, and QFP, as well as advanced packaging technologies such as 2.5D/CoWoS and 3D integration technologies including WoW and CoW.
• You have solid knowledge of production test strategies, manufacturing test flows, and semiconductor qualification processes.
• You have experience working with OSATs and manufacturing partners in a global environment.
• You understand the commercial aspects of semiconductor design development, NPI, and production pricing models and are comfortable performing financial calculations and evaluating project economics.
• You have experience developing statements of work (SOWs) with careful attention to both technical deliverables and commercial terms.
• You have demonstrated project management experience and can lead and follow up on complex projects involving multiple stakeholders in a structured and methodical way.
• You bring strong operational acumen, organizational skills, attention to detail, and the ability to manage multiple priorities simultaneously.
• You are an enthusiastic team player with excellent written and verbal communication skills.
• You are fluent in English and able to communicate effectively and diplomatically with customers, management, engineers, researchers, and administrative teams.
• You bring a positive mindset, strong sense of ownership, and an always-improving mentality.
• You enjoy working in a dynamic, collaborative, international, and multicultural environment.

What we do for you

In exchange for your skills, passion, and expertise, you will join an organization offering a wide variety of challenges and opportunities to take initiative. You will work in a multidisciplinary and international environment alongside experts and industry leaders while contributing to technologies that have the potential to influence the future of society.

Your contributions, together with those of your colleagues, help keep imec at the forefront of semiconductor innovation. We support continuous learning and professional growth and offer the opportunity to build relationships across imec's global organization and the broader semiconductor ecosystem.

As expected from a leading organization, we offer an attractive compensation and benefits package to reward your contributions.

Compensation

The expected salary range for this position is $165,000 to $210,000 per year. Actual compensation will be determined based on factors including experience, qualifications, skills, and internal equity.