Production Operator

SEMPAC; Beaverton (OR); On-site; USD 38,000 - 46,000; Full time

Job summary

SEMPAC in Beaverton, Oregon is seeking dependable Production Operators to join our growing manufacturing team. You will support a dynamic production environment with evolving processes and contribute to quality, efficiency, and continuous improvement through hands-on work with small components.

Qualified candidates will have a High School Diploma or GED, be able to read instructions, perform precise assembly and inspection tasks, and communicate in English.

Qualifications

• Prior experience using tweezers and small tools under microscope.
• Prior electronics experience preferred.
• Prior lean manufacturing experience preferred.
• Must be able to communicate both verbally and in written form in English.

Responsibilities

• Kitting materials.
• Part cleaning.
• Media blasting of components.
• Operating punch press and transfer molding press.
• Operating sawing equipment.
• Performing detailed assembly and inspection tasks with precision.
• Participation in continuous improvement activities.

Skills

Microscope handling

Electronics experience

Lean manufacturing

English communication

Education

High School Diploma or GED

Job description

Job Description - Production Operator

SEMPAC is seeking dependable Production Operators to join our growing manufacturing team. This position supports a dynamic production environment with evolving processes and provides the opportunity to contribute directly to the quality, efficiency, and continuous improvement of our operations. Successful candidates are reliable, detail‑oriented, and perform well in small, team‑based, task‑focused settings.

Our employees play at critical role at SEMPAC. Their skill, precision, and commitment to quality play a critical role in the design, engineering, and manufacture of our semiconductor packaging solutions. Attention to detail and adherence to specifications at every stage of production enable us to consistently meet customer requirements for quality, performance, and delivery.

SEMPAC is a privately owned company located in Oregon’s Silicon Forest, focused on the design, development, and manufacture of pre‑molded, open‑cavity semiconductor packages. Our products enable integrated circuits and micromachined devices to interface reliably with the external environment. We provide customized packaging solutions for a wide range of applications, including avionics, aerospace, high‑frequency RF, broadband communications, optoelectronics, MEMS, sensors, and military systems.

SEMPAC is committed to equal employment opportunity and does not discriminate based on age, color, national origin, citizenship status, physical or mental disability, race, religion, creed, sex, sexual orientation, gender identity or expression, genetic information, marital status, political affiliation, veteran status, or any other legally protected characteristic. Reasonable accommodations are provided to qualified individuals with disabilities.

This position offers an opportunity to contribute to a growing manufacturing organization committed to safety, quality, precision, and continuous improvement

Essential Functions

• Kitting materials
• Part cleaning
• Media blasting of components
• Operating punch press
• Operating transfer molding press
• Operating sawing equipment
• Performing detailed, hands‑on assembly and inspection tasks requiring precision and sustained focus.
• Participation in continuous improvement activities

Qualifications

• Prior experience using tweezers and small tools under microscope is required.
• Prior electronics experience preferred.
• Prior lean manufacturing experience preferred.
• Must be able to communicate both verbally and in written form in English.
• Must demonstrate the ability to read inspection, assembly, and rework instructions.
• Must demonstrate basic math skills.

Required Education and Experience

• High School Diploma, GED or equivalent.
• Must pass a background check
• Drug screening is required.

Working Environment

• This position is performed in a manufacturing environment where ambient temperatures are frequently elevated.

Physical Demands

• Standing or remaining stationary for extended periods
• Performing repetitive hand and finger motions using small tools
• Conducting visual inspections of small components
• Occasional lifting of materials weighing up to 35 pounds, with infrequent lifting of materials weighing up to 60 pounds.