Product Technical Chip Lead, Senior Director

Astera Labs

San Jose (CA)

In loco

USD 260.000 - 295.000

Tempo pieno

14 giorni+

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Descrizione del lavoro

Astera Labs in San Jose, CA seeks a Product Technical Chip Lead (Senior Director/AVP) to drive end-to-end success of UALink switching products. You will connect architecture, design, validation, firmware, systems, and operations to ensure alignment and on-time execution across the full lifecycle.

You will lead cross-functional teams, own chip tapeout, and shape engineering culture while delivering scalable, high-performance silicon for rack-scale AI and hyperscale data centers.

Competenze

  • Bachelor's degree in Electrical/Computer Engineering or related field.
  • 15+ years of experience across architecture, silicon design, validation, systems.
  • Proven track record of developing large-scale chips (300mm²+) through successful tapeout.

Mansioni

  • Own the full technical lifecycle of the product line from architecture to customer enablement.
  • Drive chip development from RTL to GDSII, including tapeout milestones.
  • Lead development of large-scale chips (300-400mm²) using 2.5D/3D packaging and chiplets.
  • Translate requirements into clear priorities and execution paths.
  • Own chip tapeout and sign-off with emphasis on chip quality.
  • Lead cross-functional teams across engineering functions.
  • Establish scalable processes and data-driven decision making.

Conoscenze

Executive leadership
Cross-functional collaboration
RTL design
Design verification
DFT / manufacturing test strategies
Strong communication

Formazione

Bachelor's degree in Electrical Engineering, Computer Engineering, or related field
Master's degree (preferred)

Strumenti

2.5D/3D packaging
chiplet-based architectures
PCIe
Ethernet
UALink/UCIe knowledge

Descrizione del lavoro

Product Technical Chip Lead, Senior Director

San Jose, California, United States

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com .

Astera Labs is seeking an Senior Director OR Associate Vice President, Product Technical Lead (Chip Lead) to drive the end-to-end success of our next-generation UALink switching products in San Jose. This is an executive technical leadership role where you will connect architecture, design, validation, firmware, systems, and operations to ensure clarity, alignment, and predictable execution across the full product lifecycle.

As the technical integrator for the product line, you will lead through influence and cross-functional authority, working oncutting-edgeUALink, UCIe, and PCIe Gen6/Gen7 technologies that power the largest AI clusters in the world.You'llbe the central technical voice ensuring our switching products scale with Astera's hyper-growth while delivering world-class silicon tocustomersenabling rack-scale AI and hyperscale data centers.

Location - San Jose, CA OR Israel

Key Responsibilities

  • Product Technical Ownership
  • Own the full technical lifecycle of the product line - architecture assumptions, design integration, validation strategy, readiness, and customer enablement
  • Drive chip development execution from RTL to GDSII, ensuring architecture, implementation, andtapeoutmilestones are met
  • Lead development of large-scale chips (300-400mm²)utilizing2.5D/3D advanced packaging technologies and chiplet-based architectures
  • Reduce ambiguity by translating product requirements into clear priorities, tradeoffs, and execution paths
  • Own the ChipTapeoutand Chip signoff with full responsibility on Chip Quality.
  • Cross-Functional Technical Leadership
  • Anticipate challenges early, drive alignment across all engineering functions, ensuring risks, dependencies, and decisions are surfaced and resolved at the earliest
  • Partner with design verification teams to define coverage goals, regression strategies, and sign-off criteria
  • Collaborate with DFT teams on test architecture, scan insertion, BIST, and manufacturing test strategies
  • Work closely with physical design teams on timing closure, power optimization, and backend execution
  • Process Excellence & Organizational Development
  • Establish and reinforce scalable processes, documentation, and handoffs that support company growth
  • Provide structured, data-driven decision-making andmaintaina crisp operational cadence across the product line
  • Transform conflicts to foster a culture of ownership over ego, mentoring and elevating teams while strengthening technical judgment, accountability, and cross-functional collaboration
  • Model steady, calm leadership, particularly in high-stakes or ambiguous situations
  • Shape engineering culture and talent strategy to support Astera's rapid growth trajectory

Basic Qualifications

  • Bachelor's degree in Electrical Engineering, Computer Engineering, or related field
  • 15+ years of experience across architecture, silicon design, validation, systems, or related domains
  • Proventrack recordof developing large-scale chips (300mm²+) through successfultapeout
  • Hands-on experience with 2.5D and 3D advanced packaging technologies and chiplet-based architectures
  • Strong understanding of RTL design, design verification, DFT, and physical design flows
  • Experience with high-speed serial interfaces such as PCIe, Ethernet, or switching architectures
  • Demonstrated executive leadership of cross-functional technical programs with end-to-end product cycle ownership
  • Strong communicationand executive presence with the ability to influence at all levels of the organization

Preferred Qualifications

  • Master's degree in Electrical Engineering or Computer Engineering
  • Experience withUALink, UCIe, PCIe Gen5/Gen6/Gen7, or Ethernet switching architectures
  • Experience with advanced process nodes (7nm, 5nm, or below)
  • Background in power management, clocking architectures, or high-speed analog integration
  • Experienceoperatingin fast-growing startups or hyper-scale environments
  • Systems Thinking: See the big picture while managing details
  • Emotional Intelligence: Calm under pressure, empathetic, and influential
  • Adaptability: Thrive in ambiguity and fast-changing environments
  • Execution Discipline: Deliver predictable results without sacrificing innovation

Base salary range is $260,000 to $295,000 depending on experience, level, and business need. This role may be eligible for discretionary bonus, incentives and benefits.

We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.

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