PROCT ADT Equipment Staff Engineer/MTS/ Principal (Dry Etch | Deposition CVD/PVD/Diffusion | CMP | Wet)

Micron Technology, Inc.; Boise (ID); On-site; USD 130,000 - 190,000; Full time

Job summary

Micron Technology, Inc. in Boise, ID seeks a Staff/Principal Equipment Engineer to provide technical leadership and drive improvements in equipment performance across global fabrication sites.

You will lead complex cross-site initiatives to resolve challenges, enable node readiness, and improve yield and defectivity through data-driven methods. The role requires deep ownership, collaboration with suppliers, and mentoring of engineers to ensure scalable, cost-effective outcomes across multiple

Qualifications

• Bachelor’s degree in engineering or related field and equivalent experience.
• 6+ years in semiconductor manufacturing, including equipment or process engineering.
• Experience solving complex technical problems using data analysis, DOE, or structured methods.
• Proven ability to lead multi-site initiatives and influence teams.

Responsibilities

• Lead global ownership of equipment performance across toolsets with improvements in stability and efficiency.
• Direct multi-fab root cause analysis for yield, defectivity, and reliability issues.
• Provide technical leadership in tool hardware and chamber behavior to expand process capability.
• Partner with development and process teams to enable node readiness and volume ramp.
• Influence equipment supplier strategy and align roadmaps to business needs.
• Drive standardization through BKMs across sites and improve cost of ownership.
• Communicate strategies and outcomes to leadership while mentoring engineers.

Skills

Data analysis

DOE

Problem solving

Leadership

Education

Bachelor's degree in Mechanical Engineering

Bachelor's degree in Electrical Engineering

Bachelor's degree in Chemical Engineering

Bachelor's degree in Materials Science

Bachelor's degree in Physics

Job description

Position Overview:

As a Staff/Principal Equipment Engineer within PROCT ADT, you will provide technical leadership to improve equipment performance, capability, and global manufacturing outcomes. You will lead complex, multi-site initiatives to resolve equipment challenges, enable technology node readiness, and drive yield and defectivity improvements. This role requires deep expertise, strong ownership, and the ability to influence across teams and suppliers to deliver measurable impact in cost, performance, and scalability.

Responsibilities

• Lead global ownership of equipment performance across toolsets, driving improvements in stability, availability, matching, and efficiency.
• Direct complex, multi-fab root cause analysis for equipment-driven yield, defectivity, and reliability issues using data-driven and physics-based approaches.
• Provide technical leadership in tool hardware and chamber behavior to expand process capability and improve performance limits.
• Partner with Technology Development, integration, and process teams to enable node readiness, volume ramp, and disciplined change control.
• Influence equipment supplier strategy by leading technical engagements, driving design improvements, and aligning roadmaps to business needs.
• Drive global standardization through development, validation, and deployment of Best Known Methods (BKMs) across sites.
• Lead initiatives to improve cost of ownership, reduce variation, and increase productivity through equipment and maintenance optimization.
• Communicate technical strategies, risks, and outcomes to leadership while mentoring and developing engineers across the organization.

Minimum Qualifications

• Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Physics, or a related field, or equivalent experience.
• 6+ years of experience in semiconductor manufacturing, including equipment engineering, process engineering, or related roles.
• Proven experience leading complex technical problem solving using data analysis, DOE, or structured methodologies.
• Proven track record to lead multi-functional, multi-site initiatives and influence team members to deliver measurable results.

Preferred Qualifications

• 10+ years of experience in semiconductor equipment engineering or advanced manufacturing environments.
• Deep expertise in one or more process areas such as Dry Etch, Deposition (CVD, PVD, Diffusion), CMP, or Wet Cleans.
• Strong track record of improving equipment performance, tool matching, yield, and defectivity at scale.
• Experience partnering with equipment suppliers to drive hardware improvements and influence technology roadmaps.
• Experience supporting advanced memory manufacturing (DRAM, NAND) and high-volume manufacturing or technology ramp environments
• Experience and/or interest in developing Agentic AI workflows into current or future processes.

Job Profile(s):

FAB Engineer 4 - FAB Eng MTS

Relocation Level: TBD

Before Getting Started

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As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

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